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NEWS TAGGED HBM4
Friday 25 April 2025
JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war
JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
Monday 21 April 2025
Samsung faces delays in 1c DRAM development, raising concerns over HBM4 timeline

Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources familiar with...

Monday 21 April 2025
Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

Saturday 19 April 2025
JEDEC rolls out HBM4 standard: 2TB/s memory poised to supercharge AI, HPC
The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards...
Friday 11 April 2025
Samsung redirects foundry talents to HBM business, stirring internal tensions

In a strategic pivot aimed at bolstering its high-bandwidth memory (HBM) operations, Samsung Electronics has begun reassigning personnel...

Thursday 10 April 2025
SK Group chairman makes unannounced Taiwan visit, focuses on AI supply chain
After nearly ten months, SK Group chairman Tae-won Choi's private jet landed again in Taiwan, signaling renewed efforts to deepen ties with key players in the AI supply chain. Exclusive...
Wednesday 9 April 2025
South Korea's semiconductor showdown: SK Hynix dominates with HBM4, Samsung languishes
The semiconductor competition in South Korea is set to intensify in early 2025, with major industry players Samsung Electronics and SK Hynix experiencing contrasting trajectories...
Tuesday 8 April 2025
Samsung logs profit beat with boost from Galaxy smartphones
Samsung Electronics Co.'s quarterly profit beat expectations after strong demand for its Galaxy S25 smartphones and legacy DRAM outpaced slipping margins in the high-stakes AI memory...
Wednesday 2 April 2025
Towa's HBM4 packaging breakthrough powers ambitious growth plan
Towa, a prominent name in Japan's semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory...
Wednesday 2 April 2025
GUC announces tape-out of the world's first HBM4 IP on TSMC N3P
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented...
Friday 28 March 2025
SK Hynix to finalize 2026 HBM production target by mid-2025 amid rising AI demand
SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...
Monday 24 March 2025
SK Hynix to pull M15X fab timeline forward by two months
SK Hynix is reportedly accelerating equipment installation at its M15X fab in Cheongju, South Korea, moving the original timeline forward from December to October in response to surging...
Friday 21 March 2025
Micron HBM revenue tops billion dollars amid expansion plans
Micron's HBM revenue exceeded US$1 billion this quarter. The company expects multibillion-dollar HBM revenue by 2025 and plans to start HBM4 production in 2026 while expanding capacity...
Thursday 20 March 2025
Samsung vows to reclaim ground in AI memory market with rollout
Samsung Electronics Co. pledged to strengthen its position in the high-bandwidth memory (HBM) chip market this year, in response to shareholder criticism over its underperformance...
Thursday 20 March 2025
SK Hynix, Micron exhibit AI memory solutions at Nvidia GTC
At the ongoing Nvidia GTC 2025, both SK Hynix and Micron Technology have demonstrated their respective AI memory solutions.