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NEWS TAGGED HBM4
Monday 19 January 2026
Micron sets 1γ as mainstream node for 2026 as HBM and SOCAMM2 ramp
With shipments of application-specific integrated circuits (ASICs) and XPUs expected to rise sharply in 2026, AI accelerators are set to continue relying on fifth-generation high-bandwidth...
Thursday 15 January 2026
South Korea's memory chip giants pivot back to capacity expansion

As the global memory market enters a prolonged upcycle, South Korea's two leading memory chipmakers, Samsung Electronics and SK Hynix,...

Thursday 15 January 2026
Samsung reportedly files new HBM trademarks as HBM4 advances
Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products.
Monday 12 January 2026
Samsung reclaims top spot in global DRAM market with record quarterly revenue
Samsung Electronics has reclaimed its position as the world's leading DRAM supplier in the fourth quarter of 2025, reporting record revenue of KRW27.7 trillion (US$19.2 billion) in...
Monday 12 January 2026
Weekly news roundup: AI memory effects in DRAM, HBM4, and TSMC's global expansion
Below are the most-read DIGITIMES Asia stories of the first full week of 2026: January 5-11.
Sunday 11 January 2026
CES 2026: Nvidia CEO says memory supply secure but AI demands more fabs
Nvidia CEO Jensen Huang addressed concerns over tight memory supply and soaring prices during a media Q&A at CES 2026, stating that Nvidia is likely the world's only chip company...
Friday 9 January 2026
Nvidia's Vera Rubin production timeline sparks debate as HBM4 readiness and talks with Korean memory makers draw scrutiny
Nvidia's next-generation AI superchip, Vera Rubin, has become the center of industry debate following comments by CEO Jensen Huang at CES 2026, where he said the product had entered...
Thursday 8 January 2026
CES 2026: Nvidia and Samsung signal possible talks on next-generation memory

During the CES 2026 technology show, Nvidia executives made an unannounced visit to Samsung Electronics' private semiconductor exhibition...

Wednesday 7 January 2026
Nvidia's Vera Rubin enters full production, igniting Micron's HBM4 capacity bet for 2026
When Nvidia CEO Jensen Huang confirmed at CES 2026 that its next-generation AI processor, Vera Rubin, had entered full production, the message to the memory industry was immediate...
Wednesday 7 January 2026
Nvidia CEO downplays memory supply concerns, highlights exclusive use of HBM4
Nvidia CEO Jensen Huang addressed concerns regarding recent memory supply shortages during a press conference at CES 2026, stating that Nvidia will be the exclusive consumer of sixth-generation...
Tuesday 6 January 2026
Supermicro expands manufacturing, liquid-cooling capacity for Nvidia Vera Rubin AI platforms
Supermicro announced expansions in manufacturing and liquid-cooling capabilities to support the deployment of data center-scale systems optimized for the Nvidia Vera Rubin and Rubin...
Tuesday 6 January 2026
SK Hynix says HBM3E to dominate memory in 2026 as HBM4 ramps up

SK hynix announced on Jan. 5 that it expects its fifth-generation high-bandwidth memory, HBM3E, to remain the dominant product in the...

Friday 2 January 2026
Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests
Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen...
Friday 2 January 2026
Samsung aims for 2026 HBM4 mass production after customer validation
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...
Wednesday 31 December 2025
Samsung reportedly poised to clear KRW20 trillion profit mark in 4Q25

Samsung Electronics is reportedly on track to post sharply higher operating profit in the fourth quarter of 2025 as demand tied to artificial...