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    Nvidia reportedly preparing Groq AI chips for the Chinese market
    6min ago
    NEWS TAGGED HBM4
    Tuesday 17 March 2026
    HBM4 showdown at GTC 2026: SK Hynix, Samsung, and Micron battle for AI memory supremacy
    The 2026 NVIDIA Global Technology Conference (GTC) has transcended its origins as a developer forum to become the ultimate proving ground for the high-bandwidth memory (HBM) indust...
    Tuesday 17 March 2026
    Micron enters high-volume production of HBM4 and PCIe Gen6 SSDs for Nvidia platforms
    At the Nvidia GTC 2026 conference, Micron Technology signaled a major push in the AI hardware race, announcing high-volume production of memory and storage components purpose-built...
    Tuesday 17 March 2026
    Nvidia GTC 2026: Samsung unveils HBM4E, showcasing comprehensive AI solutions, Nvidia partnership, and vision
    Samsung Electronics outlined the full range of AI computing technologies it will present at Nvidia GTC 2026 in San Jose, California, March 16-19, highlighting memory, logic, foundry,...
    Tuesday 17 March 2026
    SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026

    SK hynix Inc. (or "the company", www.skhynix.com) announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. 

    Monday 16 March 2026
    DRAM prices surge 180% as HBM competition shifts to profitability
    DRAM and NAND flash prices have soared by as much as 180% since the Lunar New Year, amid worsening memory chip supply shortages that are expected to persist at least until late 2027...
    Friday 13 March 2026
    Samsung targets 2nm process for HBM4E base die to boost AI chip edge
    Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological...
    Wednesday 11 March 2026
    Nvidia audits Samsung HBM4 packaging for Rubin GPUs, report says
    Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics' semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the...
    Monday 9 March 2026
    Industry mulls thicker HBM standards for 20-layer stacks
    Global semiconductor companies are discussing relaxing thickness standards for next-generation high-bandwidth memory (HBM) as the industry moves toward higher stack counts in future...
    Monday 9 March 2026
    Nvidia halts China-bound H200 production, shifts TSMC capacity to Vera Rubin

    Nvidia has halted production of artificial intelligence (AI) chips intended for the Chinese market and redirected manufacturing capacity...

    Friday 6 March 2026
    SK Group chairman reportedly to meet Nvidia CEO at GTC
    SK Group chairman Chey Tae-Won is expected to attend Nvidia GTC 2026 in San Jose, California, on March 16, 2026, where he will likely hold high-level talks with Nvidia CEO Jensen Huang...
    Wednesday 4 March 2026
    Samsung expands AI chip push with Pyeongtaek P5 and Texas foundry ramp

    Samsung Electronics is accelerating the expansion of its Pyeongtaek semiconductor campus in South Korea, aiming to establish the site...

    Tuesday 3 March 2026
    DRAM prices to surge up to 70% in 2Q26; Nvidia GTC 2026 ignites AI memory rally
    AI-driven data centre expansion has pushed the memory market beyond traditional supply-demand cycles, creating a structural shortage that continues to deepen. Industry sources say...
    Monday 2 March 2026
    Nvidia's Vera Rubin platform faces HBM4, cooling, and software hurdles ahead of ramp
    Nvidia's next-generation Vera Rubin platform has moved from public unveiling to early customer sampling, with the company projecting a broader production ramp later this year. Both...
    Thursday 26 February 2026
    Samsung reportedly exits 2D NAND, converts Hwaseong Line 12 to 1c DRAM end fab
    Samsung Electronics will halt 2D NAND flash production at its Hwaseong Line 12 and convert the facility into a 1c DRAM end fab, formally exiting planar NAND manufacturing and reallocating...
    Thursday 26 February 2026
    SK Hynix and Sandisk move to standardize HBF, shaking up AI memory ecosystem
    SK Hynix and Sandisk have launched a consortium to standardize High Bandwidth Flash (HBF), positioning the technology as a next-generation memory layer for AI inference and heightening...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook