News tagged HBM4 at DIGITIMES

NEWS TAGGED HBM4

Thursday 15 October 2026

Nvidia's Rubin expected to use mostly 12-layer HBM4 despite reported 8-layer shift

Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics...

Wednesday 14 October 2026

SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027

Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...

Wednesday 14 October 2026

Memory bottlenecks drive HBM shift to 8-layer stacks

As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...

Monday 12 October 2026

Microsoft's Maia 300 rack: 96 accelerators, HBM4, mostly liquid-cooled

Microsoft has released architecture details for Maia 300, its third-generation Azure AI accelerator. The design pairs 96 accelerators per rack with a two-tier network that links up...

Monday 12 October 2026

Samsung could unseat SK Hynix as HBM leader in 2027

Samsung Electronics could overtake SK Hynix as the world's largest supplier of high-bandwidth memory (HBM) in 2027, as HBM4 prices climb and memory manufacturers compete for limited...

Friday 9 October 2026

Samsung HBM4E wins NVIDIA nod for AI accelerator push

Samsung Electronics' next-generation 12-layer HBM4E product, a type of high-bandwidth memory (HBM), has reportedly cleared customer quality validation from Nvidia and major hyperscale...

Tuesday 6 October 2026

HBM4 prices to nearly triple in 2027, memory makers see windfall margins spread

Memory supply and demand will tighten further in 2027. According to supply chain sources, South Korean memory makers have recently quoted aggressive long-term contract prices for sixth-generation...

Monday 5 October 2026

Samsung reportedly seeks more than triple HBM prices for 2027 as HBM4 ramps

Samsung Electronics is reportedly seeking 2027 prices for its next-generation high-bandwidth memory (HBM) that are more than three times the price of its current HBM3E product, industry...

Friday 2 October 2026

Micron eyes NVHBM profits with TSMC custom HBM push

Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can...

Thursday 1 October 2026

Samsung Foundry gets boost from HBM4 as 2nm push continues

Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.

Wednesday 30 September 2026

AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties

Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...

Tuesday 29 September 2026

SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

Tuesday 22 September 2026

Samsung weighs 4nm expansion as HBM4 demand strains capacity

Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full...

Monday 21 September 2026

Samsung reportedly plans to double HBM4 output in 2027 as memory supply stays tight

Samsung Electronics is reportedly preparing to at least double production of its HBM4-family memory in 2027, accelerating a shift toward...

Wednesday 16 September 2026

Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

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Oct 15, 08:00

Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI

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