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    Analysis: Europe's battery independence dream is over: Chinese makers dominate global supply
    Feb 26, 16:13
    Apple's iPhone Fold aims for crease-free display with key panel orders
    Feb 26, 16:13
    Huawei and ByteDance jointly developed RRAM memory to accelerate AI applications
    Feb 26, 16:13
    Apple accelerates US chip supply chain rebuild fuel by TSMC and Foxconn expansion
    Feb 26, 16:13
    Nvidia tops US$100B in profit — but is China still worth the wait?
    Feb 26, 16:13
    Commentary: German BBA price war in China threatens used car residual value system
    Feb 26, 16:12
    NEWS TAGGED HBM4
    Thursday 26 February 2026
    Samsung reportedly exits 2D NAND, converts Hwaseong Line 12 to 1c DRAM end fab
    Samsung Electronics will halt 2D NAND flash production at its Hwaseong Line 12 and convert the facility into a 1c DRAM end fab, formally exiting planar NAND manufacturing and reallocating...
    Thursday 26 February 2026
    SK Hynix and Sandisk move to standardize HBF, shaking up AI memory ecosystem
    SK Hynix and Sandisk have launched a consortium to standardize High Bandwidth Flash (HBF), positioning the technology as a next-generation memory layer for AI inference and heightening...
    Tuesday 24 February 2026
    AI devours DRAM supply, SK’s Chey expands “monster chip” push

    Artificial intelligence infrastructure spending is tightening global memory supply and reshaping the semiconductor cycle. Speaking at...

    Tuesday 24 February 2026
    Nvidia reportedly adopts tiered HBM4 supply strategy, Samsung set to secure high-end GPU orders
    Just ahead of the launch of Nvidia's next-generation GPU Vera Rubin, market sources indicate that the company will differentiate high-bandwidth memory (HBM) suppliers based on product...
    Monday 23 February 2026
    Samsung regains DRAM lead with 40% revenue jump in 4Q25, eyes HBM4 to strengthen edge
    Samsung Electronics reclaimed the global DRAM market crown in 4Q25, just one year after losing it to SK Hynix. Industry watchers are closely monitoring whether Samsung can further...
    Monday 23 February 2026
    Samsung Foundry rebounds with utilization above 80% in 1Q26
    Samsung Electronics' foundry utilization exceeded 80% in the first quarter of 2026, its highest level in over a year, increasing the probability of a quarterly profit turnaround this...
    Monday 23 February 2026
    Samsung brings forward P5 cleanroom timeline under 'Shell First' strategy
    Samsung Electronics has accelerated cleanroom construction at its Pyeongtaek Fab 5 (P5), pushing forward capacity expansion for high-bandwidth memory and advanced-node semiconductor...
    Wednesday 18 February 2026
    Micron expands capacity to counter worst memory supply shortage in 40 years

    Micron Technology is accelerating capacity expansion in response to what executives describe as the most severe memory supply shortage...

    Tuesday 17 February 2026
    Samsung accelerates HBM hybrid bonding line to meet Nvidia demand
    Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...
    Monday 16 February 2026
    Weekly news roundup: Intel resets AI PC race, backs ZAM memory play, HBM3–HBM4 battle intensifies
    Below are the most-read DIGITIMES Asia stories in the week of February 9 to February 16, 2026. This week's coverage spans HBM3 and HBM4 capacity shifts, AI PC market share changes,...
    Thursday 12 February 2026
    HBM4 first-mover fog: Samsung and Micron duel for supremacy amid Nvidia supply tension
    Samsung Electronics has officially commenced the mass production and commercial shipment of its HBM4 memory, marking a pivotal moment in the global semiconductor landscape.
    Thursday 12 February 2026
    Micron begins high-volume HBM4 shipments as supply stays tight and capex rises
    Micron Technology has begun high-volume production and customer shipments of its next-generation HBM4 memory, ramping volumes earlier than expected amid tight industry supply, CFO...
    Tuesday 10 February 2026
    SK Hynix set to ship HBM4 for Nvidia's Vera Rubin this month

    SK Hynix is expected to begin shipments this month of its sixth-generation high-bandwidth memory, HBM4, a high-performance, low-power...

    Tuesday 10 February 2026
    China reportedly enters HBM3 mass production as South Korea pushes into HBM4

    China is preparing to initiate large-scale production of high-bandwidth memory (HBM), narrowing a technology gap with South Korea in a...

    Monday 9 February 2026
    Samsung boosts HBM4 DRAM investment to secure market leadership
    Samsung Electronics is set to begin mass production of the world's first sixth-generation high-bandwidth memory (HBM4) chips later in February 2026, marking a major milestone in the...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    Special Report
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook