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Saturday 27 September 2025
Samsung breaks silence on 12-layer HBM3E validation
Samsung Electronics is expected to confirm by late September 2025 that its 12-layer fifth-generation high-bandwidth memory (HBM3E) has cleared customer validation, South Korean media...
Friday 26 September 2025
SK Hynix reportedly to begin 1c GDDR7 production in 2025, eyeing Tesla and Nvidia orders
SK Hynix is reportedly set to begin producing GDDR7 memory on its sixth-generation 1c DRAM node, a 10nm-class technology. Likely customers include long-standing partners Tesla and...
Friday 26 September 2025
Exclusive interview: Micron to capitalize on 2026 HBM market share, aggressively raises automotive memory prices
Memory giant Micron delivered strong financial results and expects the tight supply of DRAM and other memory products to continue through 2026. Micron executive vice president and...
Friday 26 September 2025
Micron rises to second in global HBM market as Samsung slips
Micron Technology has, for the first time, overtaken Samsung Electronics in the high-bandwidth memory (HBM) market, securing second place in global shipments during the second quarter...
Thursday 25 September 2025
Micron joins forces with TSMC for HBM4E memory, targeting 2027 launch
Micron Technology is partnering with TSMC to develop its next-generation HBM4E memory, targeting a market debut in 2027. The US chipmaker confirmed the plan during its fiscal fourth-quarter...
Wednesday 24 September 2025
GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric and Advanced Process Technologies
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate...
Wednesday 24 September 2025
Micron secures six HBM4 customers as AI-driven DRAM demand grows
Micron Technology is sharpening its product roadmap to capture surging demand from artificial intelligence applications, unveiling advances in high-bandwidth memory and expanding...
Tuesday 23 September 2025
Samsung reportedly struggles with HBM4 yields as SK Hynix leads memory race
Samsung is betting on advanced 1c DRAM-based HBM4 technology but remains constrained by 35% yields, while SK Hynix relies on stable production and Nvidia's trust to defend its lead...
Tuesday 23 September 2025
Samsung races to supply Nvidia with HBM3E, WAT results crucial
Despite previously facing overheating issues, Samsung Electronics is preparing to supply its fifth-generation high bandwidth memory (HBM3E) to Nvidia. However, opinions within the...
Friday 19 September 2025
Samsung gains edge as Micron falters on Nvidia's HBM4 demands
As Nvidia raises the performance threshold for fourth-generation high-bandwidth memory (HBM4), reports suggest that Micron Technology may be struggling to meet these standards. Industry...
Friday 19 September 2025
Samsung and SK Hynix set stage for global battle over HBM4 chips

SK Hynix has announced it is the first in the world to establish a mass production system for sixth-generation High Bandwidth Memory...

Thursday 18 September 2025
Hanwha Semitech stakes early lead in hybrid bonding race for SK Hynix's HBM4
Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment...
Wednesday 17 September 2025
SK Hynix leads South Korean companies in operating profit and tax payments in 1H25
In the first half of 2025, SK Hynix recorded the highest operating profit and the largest corporate tax payment among South Korean companies. The surge in demand for high-bandwidth...
Friday 12 September 2025
Nvidia reportedly asks Samsung to double GDDR7 memory orders
Nvidia has reportedly requested Samsung Electronics Co. to significantly expand its procurement of GDDR7 graphics memory, a move expected to enhance Samsung's memory business revenue...
Friday 12 September 2025
SK hynix Completes World's First HBM4 Development and Readies Mass Production
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...