Samsung Electronics, fresh off completing sixth-generation HBM4 development, is reportedly accelerating DRAM capacity expansion in a renewed effort to reclaim leadership in AI memo...

Samsung Electronics, with its sixth-generation high-bandwidth memory (HBM4), uses base dies produced by Samsung Foundry. As Samsung's HBM4 competitiveness rises, the market expects...

SK Hynix announced a comprehensive organizational restructuring to expand its global research network and reinforce its leadership in the high-bandwidth memory sector. The strategic...

SK Hynix has reportedly postponed the mass production timeline for its sixth-generation high bandwidth memory (HBM4) from the end of the second quarter of 2026 to the third quarter...

These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.

Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition**,** reallocating capacity toward DDR5 RDIMM modules and freeing up around...

Update: Samsung has since reached out to DIGITIMES and denied this report. The company also declined to provide more details.

Samsung Electronics has reportedly completed the Production Readiness Approval (PRA) for its sixth-generation high-bandwidth memory (HBM), officially entering the production preparation...

Google's expanding investment in custom AI accelerators is reshaping the high-bandwidth memory market and lifting Samsung Electronics and SK Hynix as demand for tensor processing...

Artificial intelligence (AI) is fueling a DRAM supercycle, prompting South Korean securities firms to continuously raise their forecasts for Samsung Electronics' operating profit...

Samsung Electronics is undertaking one of its most significant internal restructurings in years as the company pushes to strengthen its artificial intelligence (AI) capabilities and...

At the upcoming International Solid-State Circuits Conference (ISSCC) 2026 in February, Samsung Electronics and SK Hynix are set to unveil significant advances in high-performance...

Media reports show that Google's Ironwood TPU is equipped with HBM3E from Samsung Electronics and SK Hynix. According to the Korea Economic Daily, Samsung supplied over 60%...

Samsung Electronics is reportedly nearing the final stage of qualification tests for its HBM4 memory chips with Nvidia, with a December decision that could mark one of the company's...