Samsung Electronics and SK Hynix unveiled their next-generation high-bandwidth memory (HBM4) at SEDEX 2025 in South Korea, marking Samsung's first public display of an HBM4 sample...
Femtometrix, Inc., the premier provider of in-line nonlinear optical process control solutions for the semiconductor industry, proudly announces its recognition as Best Partner by...
Samsung Electronics is preparing to enter the final quality testing phase for Nvidia's sixth-generation high-bandwidth memory (HBM4), as its foundry division ramps up wafer production...
Samsung Electronics has boosted its sixth-generation 1c DRAM yield to nearly 80%, enhancing its HBM4 competitiveness. Production is ramping up at the Pyeongtaek plant, with tests...
Samsung Electronics revealed it is developing its seventh-generation high-bandwidth memory (HBM4E), with a target bandwidth of over 3TB per second. The announcement comes as Nvidia...
Nvidia has reportedly confirmed it will use Samsung Electronics' fifth-generation high-bandwidth memory (HBM3E) in its latest AI accelerator, the GB300. Additionally, Samsung plans...
Samsung Electronics is expected to confirm by late September 2025 that its 12-layer fifth-generation high-bandwidth memory (HBM3E) has cleared customer validation, South Korean media...
SK Hynix is reportedly set to begin producing GDDR7 memory on its sixth-generation 1c DRAM node, a 10nm-class technology. Likely customers include long-standing partners Tesla and...
Memory giant Micron delivered strong financial results and expects the tight supply of DRAM and other memory products to continue through 2026. Micron executive vice president and...
Micron Technology has, for the first time, overtaken Samsung Electronics in the high-bandwidth memory (HBM) market, securing second place in global shipments during the second quarter...
Micron Technology is partnering with TSMC to develop its next-generation HBM4E memory, targeting a market debut in 2027. The US chipmaker confirmed the plan during its fiscal fourth-quarter...
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate...
Micron Technology is sharpening its product roadmap to capture surging demand from artificial intelligence applications, unveiling advances in high-bandwidth memory and expanding...
Samsung is betting on advanced 1c DRAM-based HBM4 technology but remains constrained by 35% yields, while SK Hynix relies on stable production and Nvidia's trust to defend its lead...
Despite previously facing overheating issues, Samsung Electronics is preparing to supply its fifth-generation high bandwidth memory (HBM3E) to Nvidia. However, opinions within the...
