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    YMTC's captial arm moves into FD-SOI as China pushes 12-inch SOI
    Sep 21, 18:23
    China SiC capacity tightens, spilling orders over to Taiwanese foundries
    Sep 21, 18:23
    Xpeng plans to license technology to more foreign automakers
    Sep 21, 18:23
    NASA added three SpaceX crew missions as Boeing’s Starliner lagged
    Sep 21, 18:23
    DeepX tests low-power NPU for smart glasses and 6G AI RAN
    Sep 21, 18:23
    Chinese automakers step up battery in-house push to reclaim cost control
    Sep 21, 18:23
    NEWS TAGGED HBM4
    Monday 21 September 2026
    Samsung reportedly plans to double HBM4 output in 2027 as memory supply stays tight

    Samsung Electronics is reportedly preparing to at least double production of its HBM4-family memory in 2027, accelerating a shift toward...

    Wednesday 16 September 2026
    Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

    The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

    Monday 14 September 2026
    Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout
    AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted...
    Wednesday 9 September 2026
    OpenAI's deeper Samsung tie-up lands on a foundry that is running out of capacity
    For Samsung Electronics' two loss-making logic businesses, OpenAI's declaration that it is jointly producing and researching next-generation chips with the Korean company matters less...
    Tuesday 8 September 2026
    Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

    Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

    Tuesday 8 September 2026
    Samsung allocates more than half of 4nm foundry capacity to HBM4
    Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
    Monday 7 September 2026
    HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days
    Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...
    Monday 7 September 2026
    SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
    SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
    Friday 4 September 2026
    Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
    Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    Wednesday 2 September 2026
    TSMC reportedly asks suppliers to develop 5μm HBM microbumps
    TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
    Wednesday 2 September 2026
    Nvidia pushes into HBM base dies as NVHBM battle heats up
    The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
    Tuesday 1 September 2026
    Samsung weighs HBM4 bonuses as memory, foundry teams align
    Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
    Tuesday 1 September 2026
    SK Hynix explores Intel as second source for HBM base dies
    SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...
    Thursday 27 August 2026
    Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

    Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

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    BIZ FOCUS
    Sep 21, 08:00
    GMIF 2026 Agenda Unveiled: Tech Giants on Lineup
    Monday 21 September 2026
    Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026
    Friday 18 September 2026
    SK hynix Launches 'SK hynix Ventures' in Silicon Valley
    Monday 14 September 2026
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
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