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    NEWS TAGGED HBM4
    Thursday 1 October 2026
    Samsung Foundry gets boost from HBM4 as 2nm push continues
    Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.
    Wednesday 30 September 2026
    AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
    Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...
    Tuesday 29 September 2026
    SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

    SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

    Tuesday 22 September 2026
    Samsung weighs 4nm expansion as HBM4 demand strains capacity

    Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full...

    Monday 21 September 2026
    Samsung reportedly plans to double HBM4 output in 2027 as memory supply stays tight

    Samsung Electronics is reportedly preparing to at least double production of its HBM4-family memory in 2027, accelerating a shift toward...

    Wednesday 16 September 2026
    Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

    The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

    Monday 14 September 2026
    Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout
    AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted...
    Wednesday 9 September 2026
    OpenAI's deeper Samsung tie-up lands on a foundry that is running out of capacity
    For Samsung Electronics' two loss-making logic businesses, OpenAI's declaration that it is jointly producing and researching next-generation chips with the Korean company matters less...
    Tuesday 8 September 2026
    Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

    Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

    Tuesday 8 September 2026
    Samsung allocates more than half of 4nm foundry capacity to HBM4
    Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
    Monday 7 September 2026
    HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days
    Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...
    Monday 7 September 2026
    SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
    SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
    Friday 4 September 2026
    Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
    Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    Wednesday 2 September 2026
    TSMC reportedly asks suppliers to develop 5μm HBM microbumps
    TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
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