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    NEWS TAGGED HBM4
    Thursday 24 July 2025
    Samsung plans HBM4 comeback with advanced chip technology
    Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...
    Wednesday 23 July 2025
    Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?
    Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...
    Wednesday 23 July 2025
    Samsung bets on GAA and HBM4 to retake AI crown
    The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung...
    Tuesday 22 July 2025
    Inside Samsung's 1c DRAM breakthrough: How a design feud nearly derailed the project
    Samsung Electronics has reportedly succeeded in developing its sixth-generation 10nm class DRAM, known as 1c DRAM, and is preparing for mass production despite internal tensions that...
    Monday 21 July 2025
    Samsung reportedly cracks 1c DRAM yield hurdle, positions HBM4 for AI rebound
    Samsung Electronics is preparing a major push to reclaim ground in the high-bandwidth memory (HBM) market, where it has lagged behind SK Hynix and Micron. Its sixth-generation 1c...
    Monday 21 July 2025
    Amazon, Google drive HBM memory boom as custom AI chips threaten Nvidia’s lead
    As demand for artificial intelligence (AI) accelerates, tech giants like Amazon, Google, and Meta are emerging as major players in the high-bandwidth memory (HBM) market. These companies...
    Friday 18 July 2025
    SK Hynix may lose HBM crown by 2026 as rivals trigger price showdown
    Goldman Sachs recently released a striking report on the high-bandwidth memory (HBM) market, stating that regardless of forecasting scenarios, SK Hynix's monopoly over HBM will eventually...
    Wednesday 16 July 2025
    Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production
    Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
    Monday 14 July 2025
    Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

    As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation...

    Wednesday 9 July 2025
    Hanmi's HBM4 tools go live, but is 2029 too late for hybrid bonding?
    Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...
    Friday 4 July 2025
    Intel's new AI accelerator may adopt HBM4? SK Hynix stresses no confirmed details
    Intel recently held its AI Summit in South Korea, sharing the latest trends in artificial intelligence (AI) technology and innovative applications across various industries. The event...
    Thursday 3 July 2025
    Samsung completes development of 1c DRAM, paving way for HBM4 rollout

    Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product...

    Thursday 3 July 2025
    Micron tightens grip on AI memory market as Samsung certification lags
    Micron Technology is stepping up its game in the competitive high-bandwidth memory (HBM) market, leveraging recent wins to boost production and capture rising demand driven by artificial...
    Wednesday 2 July 2025
    Towa expands South Korea presence as AI spurs demand for HBM packaging tools
    Japanese semiconductor equipment maker Towa Corporation, a global leader in advanced packaging systems, recently unveiled its newest technology for sixth-generation HBM4, aiming squarely...
    Wednesday 2 July 2025
    Samsung pitches 12-stack HBM3E to Nvidia after AMD's AI accelerator win
    Samsung Electronics is intensifying its push to secure a major HBM3E supply deal with Nvidia, as Device Solutions chief Jun Young-hyun visited Nvidia's Silicon Valley headquarters...
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    Research Report Database
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    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES