Qualcomm has completed initial hardware validation of its high-bandwidth compute (HBC) memory architecture, which will form a key part of its next-generation Dragonfly data-center...
Revenue from conventional DDR and LPDDR memory grew faster than that from high-bandwidth memory (HBM) in the third quarter of 2026, as global DRAM revenue surged 369% year over year...
SK Hynix's sixth-generation high-bandwidth memory (HBM4) yield has reportedly reached the mid-60% range, the highest in the industry. Analysts say improved yield has lifted production...
High Bandwidth Flash (HBF) could give AI accelerators more memory at roughly one-tenth the manufacturing cost per gigabyte of HBM4. But producing it could consume far more wafer capacity...
SK Hynix has appointed its AI memory development chief to lead a newly established Americas unit based in the US, putting a technology veteran closer to major US customers as the industry...
AI chipmakers' rising memory performance requirements are accelerating the shift from sixth-generation high-bandwidth memory (HBM4) to HBM4E, according to analysis of the South Korean...
Nvidia is reportedly adjusting the fourth-generation high-bandwidth memory (HBM4) specification for its Vera Rubin NVL72 platform, cutting bandwidth per GPU from the previously announced...
SK Hynix said customers are seeking more than twice the high-bandwidth memory (HBM) volume it can currently supply, as moves toward shorter memory stacks reflect supply shortages rather...
SK Hynix's third quarter suggests that, for now, the memory industry's familiar boom-and-bust pattern is giving way to something closer to a contracted, supply-constrained business...
Samsung Electronics and SK Hynix are targeting the second quarter of 2027 to begin volume shipments of eight-layer HBM4 memory to Nvidia, ZDNet Korea reported on October 26,...
Samsung Electronics is expected to enter 2027 with approximately 80% of its planned memory production secured under long-term contracts, reinforcing its pricing position while China's...
Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics...
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...
Microsoft has released architecture details for Maia 300, its third-generation Azure AI accelerator. The design pairs 96 accelerators per rack with a two-tier network that links up...
