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    BenQ Materials targets CPO in semiconductor push
    Sep 6, 09:19
    Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27
    Sep 6, 09:16
    NEWS TAGGED HBM4
    Friday 4 September 2026
    Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
    Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    Wednesday 2 September 2026
    TSMC reportedly asks suppliers to develop 5μm HBM microbumps
    TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
    Wednesday 2 September 2026
    Nvidia pushes into HBM base dies as NVHBM battle heats up
    The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
    Tuesday 1 September 2026
    Samsung weighs HBM4 bonuses as memory, foundry teams align
    Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
    Tuesday 1 September 2026
    SK Hynix explores Intel as second source for HBM base dies
    SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...
    Thursday 27 August 2026
    Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

    Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

    Wednesday 26 August 2026
    SK hynix adds second major customer as Nvidia misses Samsung's top five
    SK hynix added a second customer accounting for more than 10% of revenue in the first half of 2026, while Nvidia remained outside Samsung Electronics' five largest customers, highlighting...
    Tuesday 25 August 2026
    SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
    The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...
    Tuesday 25 August 2026
    Nvidia memory demand widens the gap between SK Hynix and Samsung

    Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Thursday 20 August 2026
    SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
    SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
    Tuesday 18 August 2026
    Samsung faces tougher HBM4E test after HBM4 comeback

    Samsung Electronics' semiconductor chief has told executives not to treat the company's HBM4 comeback as proof that its recovery is...

    Sunday 16 August 2026
    Samsung, SK Hynix HBM4 hiring war drains South Korea's chip design talent
    South Korea's semiconductor talent shortage is intensifying as Samsung Electronics and SK Hynix recruit experienced chip designers for increasingly complex HBM4 products, drawing key...
    Thursday 13 August 2026
    Hanmi pulls ahead of Hanwha as HBM4 orders rebound

    South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory...

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