Mon, May 23, 2022
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MediaTek launches mmWave 5G chipset Dimensity 1050
Chips + Components
NEWS TAGGED DDR5
Monday 11 April 2022
Memory module makers cautious about short-term demand prospects
Memory module makers including Adata Technology, Apacer Technology and Team Group have all expressed caution about short-term demand prospects, citing unfavorable macroeconomic con...
Thursday 31 March 2022
Memory and storage demand for datacenters promising, says Micron
Memory and storage demand for datacenters will be rising over the next decade, with the segment's growth poised to outperform the broader memory and storage market's increase, according...
Tuesday 29 March 2022
DRAM, NAND flash spot prices start falling in March
Spot market prices for DRAM and NAND flash memory have fallen at a rapid pace since the middle of March, according to industry sources.
Monday 7 March 2022
Micron remains confident in FY22 revenue prospects
Despite the ongoing shortage of non-memory chips and components, which is unlikely to improve as a whole until 2023, memory chip vendor Micron Technology remains optimistic about...
Tuesday 11 January 2022
Distributors of ICs, materials upbeat about demand for servers in 2022
Semiconductor material distributors are optimistic about demand from the server sector in 2022, particularly from US cloud service platforms (CSP) operators Google, Meta, Microsoft...
Tuesday 4 January 2022
DDR5 key to stimulating overall DRAM bit supply growth in 2022
The overall DRAM bit supply growth is expected to decelerate in 2022, but demand for DDR5 memory could still be providing momentum, according to industry sources.
Thursday 30 December 2021
Nanya to break ground for new DRAM plant in 1H22
Nanya Technology plans to break ground for a new DRAM plant in the first half of 2022 in an effort to meet growing market demand, and expects to invest a total of NT$300 billion (US$10.86...
Thursday 30 December 2021
DRAM spot prices picking up
DRAM spot market prices have been picking up since December 2021, a bullish sign for the near-term price trend, according to industry sources.
Wednesday 22 December 2021
Micron sees AI, 5G and EV drive memory demand growth
Memory and storage revenue has outpaced the rest of the semiconductor industry over the last two decades, according to Sanjay Mehrotra, president and CEO for Micron Technology, who...
Wednesday 15 December 2021
SK Hynix starts shipping 24Gb DDR5 chip samples
SK Hynix has started shipping samples of 24Gb DDR5 chips, according to the company.
Friday 10 December 2021
Chipmakers gearing up for DDR5 output ramp-up
Samsung Electronics and other major DRAM chip vendors are looking to scale up substantially their output for DDR5 memory next year, according to sources at memory module makers.
Wednesday 24 November 2021
Metaverse applications to bring new opportunities for memory supply chain
Looming metaverse applications are expected to generate massive data drastically triggering storage demand, which will generate new business opportunities for memory vendors and backend...
Friday 19 November 2021
DRAM vendors stay cautious about capacity expansions
The world's top-3 DRAM vendors will see their combined production capacity stay flat or increase only slightly in 2022, due to their focus on process technology transitions rather...
Thursday 28 October 2021
Intel unveils 12th Gen Core family
Intel has unveiled the 12th Gen Intel Core processor family with the launch of six new unlocked desktop processors, including the Core i9-12900K with a max turbo boost of up to 5.2GHz...
Thursday 21 October 2021
ASML gearing up for EUV equipment boom
With Intel announcing plans to adopt ASML's high-NA EUV machines in its post-nanometer process technology that is expected to be ready for production by 2025, ASML has disclosed it...
Wednesday 26 May 2021
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology. Delivering more than twice the performance of DDR4 at up to 7,200Mbps, the new DDR5 will be capable of orchestrating the most extreme compute-hungry, high-bandwidth workloads in supercomputing, artificial intelligence (AI) and machine learning (ML), as well as data analytics applications. Samsung indicated the new DDR5 utilizes highly advanced HKMG technology that has been traditionally used in logic semiconductors. With continued scaling down of DRAM structures, the insulation layer has thinned, leading to a higher leakage current. By replacing the insulator with HKMG material, Samsung's DDR5 will be able to reduce the leakage and reach new heights in performance. This new memory will also use approximately 13% less power, making it especially suitable for datacenters where energy efficiency is becoming increasingly critical. Leveraging through-silicon via (TSV) technology, Samsung's DDR5 stacks eight layers of 16Gb DRAM chips to offer the largest capacity of 512GB. TSV was first utilized in DRAM in 2014 when Samsung introduced server modules with capacities up to 256GB.
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Vedanta looking for chip customers in advance
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Renesas to reopen Kofu factory as 300mm wafer fab dedicated for power semiconductors
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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