Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment...
SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial...
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
South Korean experts are raising alarms that domestic semiconductor equipment manufacturers may be falling behind in developing hybrid bonding technology—critical for advancing...
In a milestone move signaling the transition of South Korea's space ambitions from government-led development to commercial enterprise, the Korea Aerospace Research Institute (KARI)...
Hyundai Motor Group Executive Chair Chung Eui-sun will visit Washington on July 30 to back South Korea's final-stage trade negotiations with the US, joining Samsung Chairman Lee Jae-yong...
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...
A high-stakes patent dispute between Hanwha Semitech and Hanmi Semiconductor over a critical piece of equipment in the HBM production process — the TCB machine — is set...
Hanwha Solutions' solar subsidiary, Hanwha Qcells, has officially launched its solar module recycling brand, EcoRecycle by Qcells, marking its entry into the US recycling market amid...
As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
The protracted dispute between Hanmi Semiconductor and SK Hynix regarding the supply of Thermo Compression Bonding (TCB) equipment has reached a resolution, with Hanmi Semiconductor...
Japan's behind-the-meter energy storage market is entering a period of significant policy benefits. Driven by subsidy programs and residential demand, the market is rapidly heating...
