DIGITIMES news archive

Total: 1,319 items

Hanmi Semiconductor expands into advanced chip packaging for AI era

Sunday 28 September 2025

Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem. After establishing dominance...

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Tokyo Electron revises profit outlook amid China sales slowdown and market shifts

Sunday 28 September 2025

Tokyo Electron has revised downward its net profit forecast for the fiscal year ending March 2026, citing a slowdown in Chinese market sales and customer capital expenditure adjustments. The company also indicated...

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Tokyo Electron market sales profit equipment

Taiwan's E-Chem expands footprint in semiconductor chemicals, targets global growth

Sunday 28 September 2025

As global demand for advanced semiconductor packaging surges, Taiwanese specialty chemicals and materials maker E-Chem is investing aggressively to seize new market...

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Taiwan growth demand packaging materials

Samsung breaks silence on 12-layer HBM3E validation

Saturday 27 September 2025

Samsung Electronics is expected to confirm by late September 2025 that its 12-layer fifth-generation high-bandwidth memory (HBM3E) has cleared customer validation, South Korean media reported. The announcement would end...

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Samsung HBM3E production 2025 market

When LLMs outgrow the chip: Huawei's P/D separation redefines design choices

Saturday 27 September 2025

At Huawei Connect 2025, Huawei rolled out its Ascend 950, 960, and 970 AI chips with a three-year roadmap, headlined by the Ascend 950's new "P/D separation" design. The architecture splits large language model (LLM)...

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Huawei design Ascend 2025 chips

South Korean startup to launch Samsung 4nm-process LPU chip, at one-tenth cost of Nvidia's H100

Friday 26 September 2025

South Korean startup HyperAccel—an IC design firm focusing on AI semiconductors for large language models (LLM)—will launch a language processing unit (LPU) AI chip using Samsung Electronics' 4nm process in...

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startup Samsung launch Nvidia cost

SK Hynix reportedly to begin 1c GDDR7 production in 2025, eyeing Tesla and Nvidia orders

Friday 26 September 2025

SK Hynix is reportedly set to begin producing GDDR7 memory on its sixth-generation 1c DRAM node, a 10nm-class technology. Likely customers include long-standing partners Tesla and Nvidia. The company plans to match...

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SK Hynix production Nvidia Tesla DRAM

YMTC joins DRAM arena to ease China's AI memory crunch

Friday 26 September 2025

China's growing demand for high-bandwidth memory (HBM) is reshaping its chip sector. Yangtze Memory Technologies Co. (YMTC), long centered on NAND flash, is planning to expand into DRAM to produce HBM for artificial...

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YMTC DRAM HBM demand CXMT

Micron resumes full price hikes as DDR5 surges amid market demand

Friday 26 September 2025

The memory market is rapidly warming up, driven by AI, with major memory manufacturer Micron recently resuming its pricing after a temporary pause. Following the release of its financial report, both DRAM and NAND flash...

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market Micron price demand DDR5

Exclusive interview: Micron to capitalize on 2026 HBM market share, aggressively raises automotive memory prices

Friday 26 September 2025

Memory giant Micron delivered strong financial results and expects the tight supply of DRAM and other memory products to continue through 2026. Micron executive vice president and chief business officer Sumit Sadana...

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Micron automotive HBM 2026 Memory

Micron rises to second in global HBM market as Samsung slips

Friday 26 September 2025

Micron Technology has, for the first time, overtaken Samsung Electronics in the high-bandwidth memory (HBM) market, securing second place in global shipments during the second quarter of 2025. According to data from...

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Micron HBM Samsung market 2025

Micron joins forces with TSMC for HBM4E memory, targeting 2027 launch

Thursday 25 September 2025

Micron Technology is partnering with TSMC to develop its next-generation HBM4E memory, targeting a market debut in 2027. The US chipmaker confirmed the plan during its fiscal fourth-quarter earnings call. Micron also...

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Micron TSMC HBM4 2027 DRAM

Exclusive: Intel raises prices of older CPUs by over 10% in 4Q25 amid AI PC demand shortfall

Thursday 25 September 2025

According to supply chain sources, Intel—the leading PC CPU supplier—is planning to increase prices of its Raptor Lake processors by more than 10%. Industry insiders suggest this price hike may be partially...

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Intel PC supply chain demand AI PC

Memory shortage drives BT substrate orders, boosting 4Q25 growth momentum

Thursday 25 September 2025

The memory market shortage has reignited a new wave of price increases. As supply tightens for NAND flash storage memory, traditional hard disk drives (HDD) and solid-state drives (SSD) have also raised prices....

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BT substrate growth market price Kinsus

Samsung pushes DRAM to record highs, SK Hynix scales up, CXMT struggles on DDR5

Thursday 25 September 2025

Samsung and SK Hynix are accelerating DRAM wafer production as demand rebounds and prices climb, while China's CXMT falls behind in the DDR5 transition, limiting its ability to compete in the high-end server market.

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Samsung DRAM SK Hynix DDR5 CXMT

China-based Longsys jumps on SOCAMM2 as Nvidia skips first-gen spec

Wednesday 24 September 2025

The AI memory market is taking shape rapidly. China's Longsys has launched enterprise SOCAMM2 modules built on LPDDR5/5X, aiming to seize early opportunities in next-generation AI server demand. According to ETNews...

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Nvidia market AI server HBM SK Hynix

Why your next PC or smartphone will cost more: chipmakers, suppliers raise prices amid AI frenzy

Wednesday 24 September 2025

Escalating tariffs, high inflation, and a shift in supply chains to the US are driving up manufacturing costs, leaving little room for prices on consumer electronics and business technology to come down.

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cost PC inflation price demand

YMTC closes gap with global rivals: Xtacking 4.0 powers 267-layer NAND, eyes 300+

Wednesday 24 September 2025

China's NAND flash race is intensifying, with Yangtze Memory Technologies (YMTC) pushing Xtacking 4.0 into mass production. The company has begun producing 267-layer 3D NAND TLC while preparing designs for devices...

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YMTC NAND NAND flash production Memory

Huawei's custom HBM challenges the existing memory hegemony

Wednesday 24 September 2025

China is moving aggressively into the high-performance DRAM market dominated by Samsung Electronics and SK Hynix, with its sights set on customized high-bandwidth memory (HBM). The push for self-sufficiency is forcing...

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HBM Huawei SK Hynix Samsung DRAM

Micron sees demand broaden; ramps 1y DRAM and manufacturing expansion plans

Wednesday 24 September 2025

Micron Technology raised its 2025 outlook on stronger data center demand while keeping supply growth disciplined. Growth in PCs, smartphones, and automotive markets remains modest, but the company is accelerating its 1y...

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Micron DRAM demand manufacturing 2025

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