DIGITIMES archived news

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Oct

3

2026

Musk confirms talks with TSMC over his Texas chip factory project

Elon Musk, Jensen Huang see China closing lithography gap by 2030

Synopsys reshapes EDA, IP business models as AI shifts revenue from seats to customer output

Interview: AI PCs reach 65% of Europe's notebook channel, but what brings buyers to the market?

Biren readies BR20X, sharpening China's AI GPU challenge to Nvidia

Oct

2

2026

Anthropic aims for mid-November IPO as it juggles relationship with Trump administration

Samsung's Galaxy Tab S12 taps MediaTek Dimensity 9500 as 2nm successor arrives

LG Energy Solution and GM bet LMR can bridge the gap between LFP cost and high-nickel range

Bull's France factory doubles capacity to capture growing orders as EU pushes AI sovereignty

Climax Technology stays cautious on 2H26 as memory costs rise

Meta to add Naver Map navigation to AI glasses in South Korea

iPhone 18 Pro lifts Apple to 33% China share

Apple's Ternus pushes management cuts, faster hardware

Huawei hikes flagship prices up to US$200 as memory shortages hit smartphone margins

OpenAI fires 3 safety researchers for sharing confidential information

BMW to make 20% of senior management redundant with AI

Japanese firms cut China presence 22.4% as trade risks mount

ficonTEC, Hermes Testing target CPO testing scale-up with INS-2 platform

Stellantis to pause four French plants amid EV battery shortages

Hitachi and Fanuc launch Physical AI partnership for factory automation

Taiwan pledges to help TSMC expand domestic investment amid Singapore rumors

Inside Volantis's photonic bid to break AI's memory wall after US$88 million raise

Amazon weighs US$8B chip sale-leaseback to support credit rating

Nvidia weighs PTFE and HC for glass-free PCBs in Rubin Ultra

Qbic expands edge AI on Arm, lifts smart access control above 60%

Life after Meta: Manus regains independence, debuting Manus 2.0 and 'Cue' AI agent

China turns to 3D packaging to push AI performance beyond front-end scaling limits

Micron ramps up HBM capacity at Taiwan's four major sites

Nidec impairment loss far exceeds estimates as auditor withholds opinion

LG Electronics, LS Electric target AI data center bottlenecks with US cooling capacity, 345kV power deals

Hiroca targets Tier 1 shift, global capacity overhaul

California tech exec arrested in US$300M Nvidia AI server smuggling case

ASE stake, expansion open doors for Machvision

AMD bets on AI demand by buying World Labs

Tesla cuts AI5, AI6 memory specs to protect Optimus

Huawei turns to LogicFolding to keep its flagship chip race alive

Google's first Suncatcher satellite reaches orbit to test AI chips in space

China AI infrastructure spreads to mid-sized firms

China financing chain linked to Nvidia Blackwell chips, 32 Asus servers exposed

UNEEC shifts ODM focus to racks as L11 rises to 18%

TSMC mulls multi-fab Texas campus beyond Arizona, with Singapore also in talks

Taiwan government backs 7 semiconductor schools to upgrade equipment

JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities

DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide

Micron expands global fabs, calls on Taiwanese suppliers to go overseas

Micron eyes NVHBM profits with TSMC custom HBM push

Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop

China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute

JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists

Column: AI benchmarks remain lucrative business

TSMC, NTU deepen R&D ties through nearly 50 projects a year

Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds

FAW, GAC formalize partnership as Toyota's China joint ventures face possible overhaul

Hygon, Sugon deepen integration under one chairman after US$17.3B merger collapse

Samsung launches Tab S12, Buds On, SmartTag3

Japan power semiconductor deal stalls as Rohm, Toshiba, Mitsubishi haggle

Chinese automakers' shift to the US may reshape supply chains and supplier margins

SK Hynix says Solidigm IPO remains undecided as AI storage demand drives investment

Wi-Fi 8 races ahead of the standard, putting networking chips on a faster 2027 growth track

Toshiba reportedly to double HDD production as AI drives storage demand

Meta hires MongoDB CEO to lead AI enterprise platform

Climax Technology sets up AI center, targets 3Q27 sampling

GMI Cloud secures NT$14.05 billion loan for AI factory

Southern Taiwan Science Park approves three new companies, pushing 2026 investment over NT$100 billion

Swancor expands recycled materials, eyes recyclable carbon fiber for drone components

Onsemi revises Synaptics takeover deal after rival bid

Samsung SDI's new LFP battery shows how AI is reshaping battery markets beyond EVs

Huawei leads global smartwatch market, but earbuds reveal different competitive picture

Nanya Technology wins approval for Southern 3D packaging plant

CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era

China car exports to Europe severely underestimated, warns UBS

Commentary: AMD challenges Nvidia in embodied AI as Lisa Su acquires Fei-Fei Li's World Labs

A look at the startup winning Nvidia, Intel backing for AI scale-up optics

NextDrive tops Japan HEMS market, speeds IPO push

Champ-ray targets Japan drone market with power modules

Machvision expands early to chase NT$10B revenue

Samsung's mobile unit faces more than KRW1 trillion loss as memory costs surge

GM begins U.S. battery cell trial runs with South Korean equipment

Oct

1

2026

Charts: Micron earns its best margins from PCs, phones, not AI

Topco opens Fukuoka office to link Japan chip hubs

Taiwan aligns green certifications with Japan and EPEAT to speed electronics market entry

China ramps up Micro OLED capacity ahead of proven smart glasses demand

Infineon opens new backend chip plant in Thailand, eyes growth to up to five modules

ASE expands smart OSAT push with six university research partnerships

Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity

DB HiTek raises foundry prices by up to 30% as Chinese demand strains 200mm capacity

Ascend now ahead of Nvidia in China, with domestic supply driving AI chip substitution, says Huawei chairman

Meta's Muse lifts server CPU demand, with AMD EPYC orders extending into 2028

China's 'BEST' fusion reactor enters the engineering endgame

Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move

Synopsys and Amazon sign US$1 billion-plus deal to speed custom chip development

China's share of global solar module demand falls below 40% as Europe, India gain ground

Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion

China's chip-tool localization accelerates: ACM Research backlog jumps 88%

Samsung raises Galaxy S26 prices in South Korea seven months after launch

China OSAT share in cloud AI accelerators to hit 13% in 2026 as local ASIC volume ramps up

Huawei makes Mate 90 showcase for its Tau chip strategy

TCC Group targets Ukraine's postwar rebuild with cement acquisition

Neweb Information targets late-October listing on Taipei Exchange

MG Taiwan details recall after MG ZS scores zero stars in TNCAP test

Focus: The hidden price of Nvidia's AI agent security play

BOE eyes closer ties with Samsung, LG as it pushes into chip packaging

Machvision's dual-track strategy enters early growth as semiconductor, substrate visibility reaches 3 years

Volvo Taiwan sees AI wealth lift economy, but not yet car demand

Google skips Gemini 3.5 Pro, launches Gemini 4 Argon at US$2/$10 per million tokens

MediaTek TPU orders rise as chip capacity war intensifies

Samsung AI Forum 2026 puts agentic AI at center of transformation across devices, robotics, and chipmaking

Tata Electronics leans on INR612.8 billion in guarantees to fund iPhone, chip expansion

Micron hikes 2027 HBM prices after missing 2026 memory surge on fixed contracts

Taiwan launches joint cybersecurity audits for government IT service providers

OpenAI claims to thwart model distillation attack tied to Moonshot

US unveils South Korea's US$20B nuclear, Alaska LNG investment

Qualcomm, Samsung redesign chip packaging as heat limits phone performance

Nvidia ties AI agent security to BlueField-4, Vera CPU

Jabil targets US$17.5 billion in data center revenue as it builds out power, cooling, and networking

Synopsys raises long-term growth and margin targets, guides fiscal 2027 revenue to US$11.15 billion

Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push

Honor joins Taiwan foldable phone race with Magic V6

Nextronics sees AI, robotics, medical demand reshaping revenue mix

HPE secures US$1.2 B order from Vultr for first AMD Helios AI rack systems

China Rare Earth Group moves downstream, linking rare-earth magnets to robot direct-drive systems

Google to test AI computing in space with first orbital TPU launch

ProLogium advances Dunkirk superfactory, deepens Europe battery autonomy

Micron sees no end to the memory shortage, even after new fabs open in 2028

China's humanoid robot lead widens, with domestic vendors supplying over 95% of global shipments

Unimicron expands ABF substrate capacity with NT$10B Hukou land deal

DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration

Nio, Geely turn battery swapping into shared infrastructure as China's EV rivalry changes course

GPS-free indoor drones target high-rack inspection as smart warehouses expand

AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote

AWS Trainium 3 shipments stall as supply chain sees turnaround

Applied Materials and Kioxia team up on AI-era memory tech

Memory shortages deepen as AI demand keeps server prices climbing

SG Semiconductor builds brand and talent for Singapore chip industry

Apple Pay arrives in India with a limited card rollout

Jabil targets 24% growth in FY27 as AI hardware ramp reshapes business

Synopsys and OpenAI to share revenue from AI model built to run chip design tools

Micron's record quarter rests on pricing power as customers lock in 2027 supply

Samsung Foundry gets boost from HBM4 as 2nm push continues

Jensen Huang wins Van Fleet Award as Nvidia, South Korea trio reunites

Qualcomm says PC chip shortages are manageable; price swings hit harder

AI boom drives Southern Taiwan Science Park revenue past NT$1.7 trillion in 1H26

Lip-Bu Tan calls TSMC a partner rather than a rival

How a TSMC veteran is steering Singapore's lab-to-fab chip strategy

DIGITIMES Insight: Agentic AI shifts inference bottleneck to token control and task quality

ASIC shipments top GPUs in 2027 as ABF substrate bottlenecks shift

Trump-Xi talks leave chip policies unchanged; US guards AI advantage while China pursues self-reliance

ChainSea targets fourth-quarter OTC listing as AI transformation business takes shape

Nvidia pushes full-stack AI agent security as OpenAI sits out partner roster

Sep

30

2026

'I tell myself every day it'll ease': Phison CEO sees years of memory shortage

Gold Circuit turns Amazon into a shareholder for Trainium servers

Apple A20 Pro ditches PoP memory packaging for WMCM

Taiwan backs TSMC's US push but insists core R&D stays home

ASE Technology buys Singapore factory for AI chip testing expansion

Netlist challenges Micron, Nvidia, Broadcom, Google over alleged HBM patent use

Taiwan identifies electricity supply as national strength, with plans to expand gas and green energy

Leisure vehicles become Eurocharm's largest segment with capacity expanding in Vietnam, North America

DIGITIMES Insight: AI is emerging as the new growth anchor in the mobile communications industry

China auto market cools as Taiwan suppliers brace for 2H26 inventory cuts

EOI lays out three growth engines, eyes AI optical communications

Chief Telecom, Google Cloud launch backup services to bolster cable resilience

SK Hynix resumes DDR4, DDR5 packaging orders with Winpac

China's battery race enters post-scale era: Beijing shifts focus to solid-state and quality

AI boom draws display makers into semiconductors with glass core substrates and Micro LED

Interview: iFLYTEK Medical sees clinical integration as key to healthcare AI expansion in South Korea

Samsung SDI targets AI data centers with cylindrical LFP batteries and fire-propagation safeguards

Murata begins mass production of world's smallest three-terminal MLCCs

Acer targets new niches in mature device markets with education tablets, e-paper displays

ByteDance makes up a fifth of China's AI data center capacity amid growing buildout

Tatung pivots to AI infrastructure integration

Tatung targets 180-day AI data center deployment

Jensen Huang, Lisa Su join Tsinghua University advisory board, putting AI chip leaders closer to Beijing

NSIG chair exit brings leadership succession into focus

China's generative AI user base tops 700 million, driving adoption into manufacturing and humanoid robots

Samsung Electro-Mechanics' disclosed 2026 supply agreements total US$2.6 billion as server demand surges

Column: Memory and logic collide as AI shifts the balance

Commentary: What risks does China's DRAM capacity face amid tightening market?

DeepSeek brings software tools to Huawei's Ascend 950 to take on Nvidia

Geely-NIO deal signals consolidation in China's fragmented EV battery-swapping market

VSMC bets on value over cost as Singapore fab builds next-generation R&D and IP capabilities

CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment

Foxconn links motors, humanoids, smart factories into a vertically integrated robotics strategy

Magnesium prices fall below aluminum as EV makers look to cut weight

Jensen Huang rejects AI doomsday framing, calls safety an engineering problem

Chinese EV tech is set to challenge US market barriers over time

Inside Anthropic's multi-billion-dollar loop: how circular financing powers the AI boom

Taiwan upgrades Circular Redesign Center as govt pushes top-down circular economy ecosystem

Foundry 2.0 revenue hits record as growth spreads beyond TSMC

Linde secures Sanand land as global materials suppliers race to localize for India's first fabs

Tesla secures US$30B credit package to fuel AI and robot capex race

CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout

Samsung expects HPC to account for 66% of foundry business by 2029

Nidec changes CEO as restructuring accelerates

AT&T and Corning strike more than US$3 billion fiber supply deal

AI reshapes drone competition from flight to autonomy

Googlebook, QwenBook bring agentic AI to the PC system layer, opening new chip opportunities

India bars Semicon 2.0 chip plants from selling or mortgaging assets before full production

CATL starts cell trial production at Hungary plant

AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties

Taiwan-US drone production lines near launch

Vulcan wins US Army drone magnet contract as China decoupling drives selection

TSMC reportedly evaluates Texas fabs as US regional competition intensifies

Florida seeks order to block OpenAI AI model launches

TDK and Taiyo Yuden to explore alliance on AI-grade capacitors and inductors

AIDC conducts counter-drone system drill to expand airspace protection for critical infrastructure

Grand Pacific Petrochemical, Air Water join forces to expand Taiwan semiconductor materials business

Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant

OpenAI leans on cheaper models and always-on agents at DevDay as flagship upgrade is shelved

Trump opts for voluntary AI audits over new rules after White House summit with tech chiefs

Memory shortage pushes TV semiconductors above panel costs

Qualcomm sees smart glasses leading AI wearables boom; AI pins, pendants follow

Acer turns 50, marks it with a musical produced by its founder

Commentary: Garmin returns to OLED, putting Micro LED on notice

GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck

From EVs to AI humanoid robots: Tesla leans on Chinese manufacturing once again

Micro LED smartwatches set back as costs remain a fatal hurdle

Neocloud lifts OEM buying as ODM-direct share slips below 80% in 2026

AI boom strains PCB supply chain as materials, equipment shortages persist into 2027

Inside China's 3D DRAM push: from lab to fab, and the road ahead

Apple iPhone Duo revives UDC battle as Samsung weighs trade-offs

Dat Bike challenges VinFast with simpler EV scooter strategy

Exclusive: Advantech Korea eyes smart surgery, nursing AI PoCs

Meta reaches agreements with Firmus on securing AI compute in Southeast Asia

Rare earths loom over US-China trade truce

Sep

29

2026

Amazon buys NT$1.59 billion stake in one of its Taiwanese AI server suppliers

Mercedes-Benz and ProLogium expand solid-state battery testing partnership

Anthropic's US$2 trillion IPO bet comes with 80 pages of warnings

CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight

SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization

In global semiconductor race, Singapore bets on critical, mature technologies

Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5

AIDC sees NT$30 billion military maintenance boost, eyes drones

RoboTechnik completes Hong Kong listing to fund ficonTEC expansion in silicon photonics

Foxtron writes a new chapter in Taiwan auto history

Taiwan breaks ground on aerospace and drone hub, targeting 2028 completion

Cerebras to power Gimlet's push for faster AI inference

Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it

South Korea AI compute squeeze hits researchers and startups

AI boom sends China and Taiwan's PCB makers racing to HK for capital

Samsung Foundry nears 60% 2nm yield, shifts focus to power efficiency to win customers

MicroIP unveils AI drone and edge systems at Taiwan Expo USA

Solidigm weighs US IPO as AI storage demand lifts valuation

Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion

US, China eye US$60 billion in tariff relief, but chips stay off the table

Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

Beyond 16 layers: HBM stacks test advanced packaging equipment makers

Samsung bonus plan to lift South Korea talent race

GlobalFoundries eyes GaN expansion to challenge TSMC in AI

SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

GF's MIPS bets on RISC-V physical AI, expands into autos and data centers

Taiwan's Brave Eagle reaches 55% domestic content, bringing 200 suppliers into aerospace

HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5

Exclusive: Inside Tesla's playbook for dodging First Solar's TOPCon patent traps

Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them

LG expands AI data center cooling ties with Microsoft, SK Enmove

South Korea looks beyond high-nickel NCM in battery push

VSMC Singapore fab fully booked as VIS weighs Fab 2

TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US

Vanguard chairman says AI slowdown won't free up chip capacity

Qualcomm, Liquid AI tout on-device AI potential at Snapdragon Summit

Trump-Xi state dinner puts tech titans at the head table, spotlighting Taiwan's quiet supply chain clout

Nvidia expands CUDA-Q platform to target fault-tolerant quantum software

LG AI Research expands sovereign AI push into Kazakhstan, Middle East

Meta adds camera-free AI glasses as Samsung prepares 2026 launch

South Korean component makers face price cuts as memory costs climb

IDC says AI agent growth will widen global compute shortage by 2027

Meta's Muse raises questions about AI model leadership, product moats

AI server MLCC prices rise as Chinese suppliers gain ground in generic parts

Apple's foldable iPhone Duo faces low yields ahead of October launch

Samsung invests US$1 billion in ex-AWS chief's AI data center venture, joining Nvidia as a founding investor

Posco Future M lands KRW1.1 trillion LFP cathode deal with SK On

AMD pays US$8.2 billion for Fei-Fei Li's 3D world-modeling startup to shape future AI chips

Blade Hydrogen Green Technology targets waste hydrogen power for AIDC

Advantech's North America expansion signals a deeper shift toward local manufacturing, services

Column: Beyond Zero Trust – why AI supply chain resilience needs a plan B

HAA free tuition enrollment draws Silicon Valley buzz

Taiwan PCB output hits record high on AI demand, putting NT$1 trillion year within reach

DeepSeek paper says AI agents are learning reward hacking during training

Global 2026 EV sales to grow just 6.5% as Chinese exports become primary driver

Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard

Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win

Analysis: Elon Musk's AI safety push clashes with regulation

Sep

28

2026

Nvidia adds a record US$150 billion to its stock buyback

NXP says Singapore fab with Vanguard is its biggest investment since Freescale

Column: For physical AI, maps are turning into memory

South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations

Weekly news roundup: China gains ground in memory and AI hardware as supply stays tight

Apple keeps iPhone Duo in China, exposing limits of India's phone supply chain

Meta's Muse faces security scrutiny over macOS zero-day, human-agent test

China's Micro Han Xin code takes aim at Data Matrix in semiconductor traceability

Beyond ASML: China rethinks EUV race with light-source strategy

India roundup: India's tech ambitions widen from electronics manufacturing to chips, cloud and talent