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NEWS TAGGED HANMI
Thursday 22 October 2026
Elon Musk expands South Korean supplier network for Terafab
Elon Musk's Terafab semiconductor production initiative is expanding its supplier outreach in South Korea, with Tesla and SpaceX approaching materials, components, and equipment suppliers...
Tuesday 20 October 2026
Hanmi Semiconductor establishes US hub to support AI packaging customers

Hanmi Semiconductor has established a US subsidiary in Silicon Valley as it seeks to capitalize on growing demand for advanced semiconductor packaging...

Monday 19 October 2026
Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...
Thursday 8 October 2026
Hanmi wins rare Samsung order amid US$5 billion chip substrate expansion
South Korea's Hanmi Semiconductor has secured a KRW24.48 billion (approx. US$18.3 million) equipment order from Samsung Electro-Mechanics, a rare deal with a Samsung Group affiliate...
Tuesday 22 September 2026
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM)...
Wednesday 16 September 2026
Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment...
Sunday 6 September 2026
Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands
South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving...
Wednesday 19 August 2026
Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

Thursday 13 August 2026
Hanmi pulls ahead of Hanwha as HBM4 orders rebound

South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory...

Monday 20 July 2026
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
Thursday 16 July 2026
Hanmi, Hanwha clash in court over HBM equipment patents
Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically...
Wednesday 8 July 2026
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
Saturday 27 June 2026
Hanmi targets advanced packaging market with FC Bonder 3.5

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...

Friday 12 June 2026
Hanmi Semiconductor to invest in SpaceX as Terafab bets grow
Hanmi Semiconductor plans to invest KRW50 billion (US$32.81 million) in SpaceX, highlighting how space, satellites, and artificial intelligence infrastructure are increasingly linked...
Tuesday 9 June 2026
SK Hynix orders Hanmi equipment for HBM4 capacity buildout
SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand...