DIGITIMES news archive

Total: 1,455 items

Chinese GPU maker Lisuan secures Microsoft WHQL certification for 6nm chip

Tuesday 28 April 2026

China-based GPU designer Lisuan Tech has secured Windows Hardware Quality Labs (WHQL) certification from Microsoft, becoming the first Chinese company and the fourth globally...

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SaiMemory wins NEDO backing for next-generation ZAM memory, partners with Intel

Thursday 23 April 2026

SaiMemory, a next-generation memory developer established by SoftBank, said on April 22 that its development project has been selected for subsidies by Japan's New Energy...

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NEDO HBM performance development

Samsung scales MRAM to 8nm, setting 5nm showdown with TSMC in 2027

Tuesday 21 April 2026

Samsung is accelerating its push into magnetoresistive random-access memory (MRAM), positioning the technology as a strategic pillar alongside DRAM and high-bandwidth memory (HBM) in the intensifying global AI...

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Samsung MRAM TSMC 5nm 2027

Analysis: ASML lifts 2026 guidance on strong EUV demand

Friday 17 April 2026

ASML delivered first-quarter 2026 results that exceeded expectations, prompting management to raise its full-year guidance despite a cautious outlook for the second quarter. The company announced plans to expand its...

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ASML 2026 demand EUV guidance

Tata steps up iPhone manufacturing investments with fresh capital infusion

Thursday 16 April 2026

India's Tata Group has injected fresh capital into its electronics manufacturing arm, Tata Electronics, as it accelerates efforts to scale up iPhone production and strengthen its role in Apple's global supply chain.

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Tata Group electronics manufacturing India Apple iPhone

China's 2nm AI GPU hits prototype, production unclear

Tuesday 14 April 2026

Shanghai Dishan Technology has advanced its 2nm-class AI GPU into the prototyping stage, marking a rare push by a China-based designer into cutting-edge AI silicon — though manufacturing access and software...

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Shanghai AI GPU production design manufacturing

Glass substrates move toward mass production as Intel, Samsung Electro-Mechanics step up efforts

Tuesday 14 April 2026

Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI workloads require larger chip sizes and higher bandwidth, the industry is shifting its focus...

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chips glass substrate demand Intel production Semco

AI memory crunch revives DDR3 in PC market

Monday 13 April 2026

AI demand is squeezing global DRAM supply to the point where the PC market is turning back to decade-old technology. Shortages in DDR5 and DDR4 have pushed prices high enough to revive DDR3 platforms, with Fnnews...

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DDR3 market DRAM PC demand

Arm reportedly plans to sell AGI CPUs in China despite core licensing ban

Wednesday 8 April 2026

Arm recently unveiled its first self-developed AGI CPU, marking a significant milestone as the company shifts from a pure technology IP licensor to a standard CPU supplier competing directly with Advanced Micro Devices...

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Arm AGI CPU IP licensing China

China builds open RISC-V chip platform with Xiangshan, Ruyi OS

Monday 30 March 2026

China's Chinese Academy of Sciences (CAS) launched next-generation chip and operating system co-development alongside the debut of the Xiangshan open-source processor and Ruyi native OS at the 2026 Zhongguancun Forum.

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RISC-V development IP processor

Phison and Intel go hybrid to keep China's AI lobster craze from burning out

Monday 30 March 2026

The recent craze for OpenClaw "lobster raising" in China has sparked massive token consumption, with Yangtze Memory Technologies (YMTC) calling it the first killer app of AI agents. In response, Phison teamed up with...

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Phison Intel SSD YMTC DRAM

SEMICON China 2026: JCET CEO makes the case for atomic-level packaging to carry Moore's Law forward

Monday 30 March 2026

Advanced wafer manufacturing is approaching physical limits near the 1nm node, according to Zheng Li, director and CEO of JCET Group.

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packaging JCET wafer manufacturing SEMICON China

Semicon China 2026: AI spending nears US$800 billion, IBS flags 2028 chip cycle risk

Sunday 29 March 2026

SEMICON China 2026 spotlighted the scale of the AI investment boom, with Handel Jones, CEO of International Business Strategies (IBS), estimating that global AI and data...

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SEMICON China AI demand investment 2026

Samsung and SK Hynix boost China factory investments in 2025 amid memory demand surge

Thursday 26 March 2026

Samsung Electronics and SK Hynix are significantly increasing capital expenditures at their factories in China to expand chip supply and enhance profitability. According to Seoul Economic Daily, citing data from...

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Samsung SK Hynix China demand production 2025

SoftBank-backed SAIMEMORY plans post-HBM shift with vertical memory tech

Wednesday 25 March 2026

SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin to constrain current AI...

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startup HBM Intel performance data

Malaysia chipmakers monitor helium supply risks as Middle East tensions weigh Qatar output

Friday 20 March 2026

Malaysia's semiconductor industry is closely monitoring helium supply risks amid escalating tensions in the Middle East, though companies have not yet reported operational disruptions.

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Qatar chipmakers semiconductor industry supply chain production

Intel to expand EMIB capabilities in Malaysia amid Section 232 probe uncertainty

Thursday 19 March 2026

Intel's advanced packaging complex in Malaysia is expected to begin operations later this year, Prime Minister Datuk Seri Anwar Ibrahim said, as the company advances its assembly and testing capabilities and the...

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Intel packaging government testing policy

Russia reportedly turns to Loongson to escape x86 sanctions

Wednesday 18 March 2026

Amid sustained Western sanctions, Russia is reportedly advancing an alternative CPU pathway through cooperation between local IC firm Tramplin Electronics and China's Loongson. The company is said to be developing its...

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Russia Loongson x86 CPU IC

Chip inflation spreads as Samsung, Nexchip raise foundry prices and material costs surge

Monday 16 March 2026

China-based wafer foundry Nexchip recently announced that starting June 1, 2026, it will raise foundry prices by 10% to ensure stable product supply and sustainable long-term partnerships.

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Samsung Nexchip wafer price increase 2026

Tesla AI chip delay pushes South Korean NPU startup DeepX back six months

Friday 13 March 2026

Tesla's next-generation AI processor schedule change has disrupted Samsung Electronics' foundry timelines, delaying mass-production plans for South Korean startup DeepX's next AI accelerator by roughly six months.

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Tesla DeepX Samsung AI chip startup

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