The recent increase in mature process DRAM prices is expected to boost Samsung Electronics' DRAM business revenue, offsetting the sluggishness in its high bandwidth memory (HBM) business...
AMD on June 12 officially confirmed that its next-generation AI accelerators—the Instinct MI350X and MI355X—will feature 12-high HBM3E memory supplied by Samsung and Micron...
As data centers face increasing demands for AI training and inference workloads, high-bandwidth memory (HBM) has become a critical competitive edge for memory manufacturers. Micron...
The world's top three DRAM manufacturers have confirmed a shift from DDR4 specifications to advanced process products. Following the announcements from two major South Korean memory...
SK Hynix has unveiled a long-term roadmap for next-generation DRAM technologies, laying out a vision that aims to drive sustainable innovation over the next 30 years as the global...
Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory...
As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...
Chipmaker Micron Technology Inc. said it will spend about US$200 billion on US manufacturing, research and development, the latest company to pledge large-scale investments in the...
SK Hynix President and CEO Kwak Noh-jung warned that growing tariff-related uncertainty could heighten market volatility in the second half of 2025. He shared these views during the...
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...
Taiwan-based memory module vendors Adata Technology and Team Group Inc. saw notable revenue gains in May 2025, driven by continued price increases for DRAM and NAND flash. Adata reported...
Memory manufacturers are reducing production capacity for older processes, driving DDR4 prices to skyrocket. Although Samsung Electronics' last buy order (LBO) for DDR4 was originally...
In a sign of China's accelerating ambitions in the semiconductor race, ChangXin Memory Technologies (CXMT), the country's leading DRAM manufacturer, is rapidly advancing development...
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
According to a press release on June 10, Micron Technology announced it has begun shipping samples of its 36GB HBM4 with 12-high stacking to multiple customers. The new memory is...
