SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial...
Micron Technology is reportedly deepening its ties with the Trump administration to secure a stronger foothold in the global semiconductor market. According to South Korean media,...
The global memory industry saw simultaneous growth in volume and pricing during the third quarter of 2025, with DRAM and NAND memory prices rising amid ongoing supply constraints...
Nvidia has reportedly requested Samsung Electronics Co. to significantly expand its procurement of GDDR7 graphics memory, a move expected to enhance Samsung's memory business revenue...
By September 2025, half-year earnings reports from 10 Chinese memory firms are in. Nine posted revenue growth, underscoring solid top-line momentum. Profitability, however, diverged...
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON...
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Winbond Electronics has implemented significant price increases for its DDR4 DRAM products beginning in the third quarter of 2025, with contract prices for the fourth quarter finalized...
Phison Electronics posted consolidated revenue of NT$5.934 billion (approx. US$195.7 million) for August 2025, marking a 4.3% increase from July and a 23% rise year-over-year, reaching...
China's state-backed DRAM maker CXMT is rapidly advancing in high-bandwidth memory (HBM), a market long controlled by Samsung Electronics and SK Hynix. Citing SemiAnalysis, South...
Recent reports indicate that Samsung Electronics is restarting construction on parts of its P4 and P5 fabs to accelerate advanced DRAM mass production. SK Hynix is also reportedly...
AP Memory has announced that its new generation PSRAM, known as ApSRAM (Attached-pSRAM), has completed customer platform validation and is slated for mass production by the end of...
Yangtze Memory Technologies (YMTC) officially registered its Phase III unit, Changcun Phase III (Wuhan) Integrated Circuit, on September 5. The company has not disclosed details on...
YMTC, China's leading NAND flash producer, has unveiled a US$2.9 billion Phase III venture in Wuhan, signaling its determination to scale up capacity and sharpen its edge in next-generation...
The rising wave of artificial intelligence (AI) is driving the growing importance of high-bandwidth memory (HBM), which has become a core component of AI system architectures. The...
