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Tuesday 27 October 2026
Samsung, SK Hynix eye 2Q27 shipments of 8-layer HBM4 to Nvidia
Samsung Electronics and SK Hynix are targeting the second quarter of 2027 to begin volume shipments of eight-layer HBM4 memory to Nvidia, ZDNet Korea reported on October 26,...
Tuesday 27 October 2026
Inside SKT’s push to turn SK Hynix’s fabs into an AI business
South Korean telecommunications provider SK Telecom (SKT) has reportedly established Hy-TF, a task force dedicated to AI collaboration with SK Hynix, to upgrade its digital-twin and...
Tuesday 27 October 2026
China supply-chain price hikes strain domestic demand
China’s semiconductor and electronics supply chains are reporting a wave of price increases, from Goke Microelectronics raising quotes for hybrid-packaged memory products to...
Tuesday 27 October 2026
DRAM price gains fall short as supply shrinks up to 50%
DRAM price growth has slowed sharply in the fourth quarter of 2026, but severe supply shortages are intensifying as manufacturers continue to restrict shipments. Industry sources expect...
Tuesday 27 October 2026
Weekly news roundup: iPhone Duo shipment target revised upward amid display issues
This week's coverage highlights shifting technology supply chains and rising demand across foldable smartphones, memory, energy storage, robotics, and AI infrastructure. Apple lifted...
Monday 26 October 2026
Podcast highlights: TSMC's 3nm demand story, Samsung HBM shift, and A14 ramp
Following TSMC's third-quarter 2026 earnings call, DIGITIMES analyst Luke Lin provided in a podcast additional analysis of several details that received limited attention in market...
Saturday 24 October 2026
Nvidia rejects near-term memory glut fears, leaves CXMT cooperation open
Nvidia CEO Jensen Huang said the company did not expect memory supply to exceed demand in the coming years and remained open to working with China's ChangXin Memory Technologies (CXMT)...
Friday 23 October 2026
Taiwan's inaugural semiconductor strike pauses as nearly 70% of Micron Taoyuan Union rejects new bonus offer
Taiwan's first-ever strike in the semiconductor industry has temporarily drawn to a close. A 24-hour warning strike spearheaded by Micron Technology's Taoyuan union concluded on the...
Friday 23 October 2026
SK Hynix halts Solidigm IPO review in face of broader AI and market volatility
Solidigm, the US-based subsidiary established by SK Hynix, has officially halted its review of potential pre-IPO and IPO options.
Friday 23 October 2026
Western Digital argues AI's longer payoff lies in stored data, not compute
Western Digital argues that demand for hard drives depends less on the current wave of AI spending than investors fear. On its fiscal first-quarter earnings call on October 22, the...
Friday 23 October 2026
Western Digital widens margins on pricing and exabyte growth
Western Digital's fiscal first quarter showed a hard-drive business turning demand into profit faster than into sales. Revenue for the three months ended October 2, 2026 rose 55% from...
Friday 23 October 2026
Samsung Foundry targets automotive, edge AI chips with 8LPU+
Samsung Electronics' foundry business will extend its 8-nanometer process, now more than eight years old, into another generation with the launch of the second-generation 8LPU+ platform...
Friday 23 October 2026
SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a...

Thursday 22 October 2026
Micron overhauls pay in Taiwan as unions push for profit sharing
Micron is overhauling how it pays employees, promising quarterly profit-sharing bonuses and better pay and benefits for its Taiwan staff. The changes follow a labor dispute with the...
Thursday 22 October 2026
Samsung reportedly overhauls DRAM, NAND R&D incentives to retain talent and accelerate next-gen memory chips
Samsung Electronics is reportedly restructuring its semiconductor research operations and performance-based compensation system to accelerate next-generation DRAM and NAND flash development,...