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Monday 19 January 2026
Micron sets 1γ as mainstream node for 2026 as HBM and SOCAMM2 ramp
With shipments of application-specific integrated circuits (ASICs) and XPUs expected to rise sharply in 2026, AI accelerators are set to continue relying on fifth-generation high-bandwidth...
Monday 19 January 2026
TSMT bets on DRAM modules to fuel 2026 growth as consumer demand cools
Taiwan Surface Mounting Technology Corp. said revenue returned to growth in 2025 after two consecutive years of decline, though rising prices and tight supply of key components are...
Monday 19 January 2026
China's Innosilicon launches LPDDR6 IP with commercial shipments
As AI smartphones and AI PCs surge, end devices demand unprecedented memory bandwidth. Recently, Chinese interface IP provider Innosilicon announced that its self-developed LPDDR6/5X...
Monday 19 January 2026
Weekly news roundup: memory shortages, packaging power, TSMC's global pivot
Below are the most-read DIGITIMES Asia stories of the week of January 12-18, 2026.
Monday 19 January 2026
Advantest ATE lead times remain tight as AI and memory markets expand
As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with...
Monday 19 January 2026
Ardentec utilization rate rises through 2025 on chip testing demand from networking, automotive, and storage sectors
Semiconductor testing company Ardentec reported steady utilization growth through 2025, driven by strong chip-testing orders from the networking, automotive, and storage markets. The...
Sunday 18 January 2026
SK Hynix reportedly completes 1a DRAM upgrade at Wuxi plant in China

SK Hynix has reportedly finished converting its key DRAM production facility in Wuxi, China, to the fourth-generation 1a process. The...

Sunday 18 January 2026
South Korea signs IP pact again, China-linked tech leaks still dominate
South Korea's Intellectual Property Office (KIPO) signed a new Memorandum of Understanding (MOU) on intellectual property cooperation with China's National Intellectual Property Administration...
Sunday 18 January 2026
SK Hynix accelerates advanced packaging from Korea to Indiana
SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven...
Saturday 17 January 2026
Internal memo reveals Micron has locked in PSMC HBM capacity through prepayment

Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant...

Saturday 17 January 2026
Micron to buy PSMC Taiwan fab in $1.8bn deal as both recalibrate AI memory strategies

Micron Technology and Powerchip Semiconductor Manufacturing Corporation have reached a preliminary agreement under which Micron will acquire...

Saturday 17 January 2026
Micron's new fabs target 2030 rollout as supply shortages linger

Micron is scheduled to begin construction on its planned New York state megafab site on January 16, 2026, advancing its US manufacturing...

Saturday 17 January 2026
NAND makers hike prices up to 100%, squeezing low-end consumer drives
The large-scale deployment of artificial intelligence servers has driven a sharp increase in demand for mass storage, with market sources saying NAND flash contract prices for the...
Saturday 17 January 2026
Samsung DS rebounds to record KRW20 trillion under new leadership
Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company's Device Solutions (DS) division, reversing...
Saturday 17 January 2026
TSMC sees memory price hikes unlikely to curb demand as Apple and Samsung adapt
Tight memory supply has driven market prices sharply higher, prompting industry expectations that 2026 PC and smartphone end-demand will face downward pressure. However, TSMC stated...