India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer...
ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
Samsung Electronics' board has approved a 2026 shareholder return plan estimated at KRW90 trillion to KRW110 trillion (approx. US$64-79 billion), which the company says is the largest...
South Korean President Lee Jae-myung has begun a fresh round of talks with the country's leading business figures, starting with a private dinner with SK Group chairman Chey Tae-won,...
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision...
As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent...
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
Micron's new US research hub could influence how future AI systems are built, stored, and scaled, with implications that extend well beyond America. The planned US$10 billion effort...
Nitto Denko said it will invest JPY28 billion (US$176.68 million) through fiscal 2028 to expand production of thin-film metal base boards for hard disk drives, raising capacity by...
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...
A former Samsung Electronics researcher has testified that ChangXin Memory Technologies (CXMT) intended from its earliest days to develop DRAM using Samsung process data, an account...
