News tagged Memory chips at DIGITIMES

NEWS TAGGED MEMORY CHIPS

Monday 13 July 2026

Samsung targets 2029 Yongin fab opening as infrastructure timetable tightens

Samsung Electronics plans to begin operations at its first Yongin fab in 2029, one to two years ahead of the original schedule, increasing pressure on South Korea to accelerate the...

Monday 13 July 2026

Nanya lifts long-term capacity to 50%, eyes 4x capex in 2027

Memory chipmaker Nanya said its second-quarter 2026 operations hit a record high, with President Pei-Ing Lee saying signed long- and short-term agreements now account for 50% of total...

Monday 13 July 2026

Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

Monday 13 July 2026

SK Hynix hybrid bonding push signals next phase of HBM packaging race

SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...

Monday 13 July 2026

Complex Micro Interconnection sees June sales rise as AI-led device demand lifts orders

Flexible circuit board maker Complex Micro Interconnection (CMI) said June 2026 revenue rebounded as consumer electronics shipments...

Saturday 11 July 2026

Record chip profits mask a widening divide inside Samsung

Samsung Electronics' preliminary results for the second quarter of 2026 again underscore a striking split inside the company: surging semiconductor profits driven by AI server demand...

Saturday 11 July 2026

Samsung, SK Hynix margins seen near Micron's 80% level as memory prices surge

Global memory chipmakers are heading toward record revenue and profit in the second quarter of 2026, as AI infrastructure demand keeps...

Saturday 11 July 2026

Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...

Friday 10 July 2026

SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds

SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging...

Friday 10 July 2026

Nanya Technology posts record profit as gross margin nears 80%

Nanya Technology posted record quarterly profit after a more than 60% rise in average DRAM selling prices lifted its gross margin to 79.5%, with the Taiwanese memory chipmaker expecting...

Friday 10 July 2026

Apple iPhone 18 Pro Max BOM could jump US$300 as memory costs soar

New figures from Counterpoint Research estimate that the bill of materials (BOM) for the upcoming iPhone 18 Pro Max could rise nearly...

Friday 10 July 2026

SK AI Summit postponed as SK eyes closer alignment with Nvidia GTC

SK Group, which hosts the annual SK AI Summit as its flagship technology event to showcase its latest AI and semiconductor developments, is reportedly postponing the 2026 edition....

Friday 10 July 2026

Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026

Micron's US$250 billion memory push sharpens three-way race with Korean and Chinese rivals

Micron Technology's decision to lift its planned US investment to more than US$ 250 billion through 2035, unveiled July 9 alongside the first concrete pour at its Clay, New York, site,...

Friday 10 July 2026

GigaDevice's 1H26 profit surges 1,099% on memory chip shortage, higher prices

GigaDevice Semiconductor expects first-half 2026 net profit to reach about CNY6.9 billion (US$960 million), a 1,099% increase from...

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