Sonix Technology expects consumer IC and MCU sales to keep growing in the second half of 2026, but memory shortages could slow imaging-product shipments. AI-driven demand is also squeezing...
SEMICON Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...
ChangXin Memory Technologies (CXMT) has escalated its defense against the US government, shifting from supply-chain and technological competition into a full-scale courtroom battle...
Seven listed Chinese memory-module and memory-distribution companies have filed first-half 2026 results, and the headline numbers are the largest the tier has ever reported. The more...
The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
Micron's plant at the Southern Taiwan Science Park, which it purchased from AUO for NT$7.4 billion (US$233.8 million) in August 2024, is now officially in operation, marking a key...
Nine listed Chinese memory and memory-adjacent chip companies have now filed their first-half 2026 results, and together they measure the depth of the current DRAM and NAND upcycle...
China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle...
South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device...
Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...
India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
