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Thursday 9 July 2026
Samsung, SK Hynix rethink hybrid bonding timeline for next-gen HBM

Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as...

Thursday 9 July 2026
SK Hynix supplier talks show AI memory boom shifting pricing power

The AI data center boom is reshaping the memory supply chain, giving Samsung Electronics, SK Hynix, and Micron greater pricing power...

Thursday 9 July 2026
Team Group posts record first-half revenue on industrial and AI demand
Memory module maker Team Group reported a June 2026 consolidated revenue of NT$3.0 billion (US$94.2 million), up 18.1% from May and 35.0% from a year earlier. The Taiwan-based company...
Thursday 9 July 2026
Macronix and Winbond post record June revenue as memory prices stay firm
Macronix and Winbond Electronics reported record consolidated revenue in June 2026 and for the second quarter of the year as memory chip demand and pricing strengthened. The Taiwanese...
Wednesday 8 July 2026
Samsung's Jae-yong Lee heads to Sun Valley Conference for likely AI talks

Samsung Electronics Chairman Jae-yong Lee departed for the Sun Valley Conference in the US on July 7, marking his second straight year...

Wednesday 8 July 2026
AI memory boom turns price hikes into antitrust flashpoint across supply chain
As AI demand drives record price increases in the memory market, the aftermath of such volatility is weighing on the wider supply chain, rippling into downstream industries where manufacturers...
Wednesday 8 July 2026
Samsung widens Nvidia Vera Rubin memory play with PCIe 6.0 eSSD

Samsung Electronics has started mass production of its PM1763 enterprise SSD, a PCIe 6.0-based drive built for AI infrastructure and slated...

Wednesday 8 July 2026
Samsung's HBM4 comeback hinges on one chip-level advantage

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...

Wednesday 8 July 2026
Apple tests CXMT DRAM, thrusting China's memory champion into AI spotlight

China's CXMT has moved from a little-known state-backed DRAM maker to one of the most closely watched companies in the global memory...

Wednesday 8 July 2026
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
Wednesday 8 July 2026
Enterprise SSD shortage lifts DDR4 8Gb 3Q26 contract prices

Memory prices are rising faster than expected as global AI demand strains DRAM and flash supply, with knock-on effects for PCs, data...

Wednesday 8 July 2026
ADATA revenue tops 2025 full-year total as memory supercycle gains pace
ADATA Technology posted another record month in June 2026, pushing its first-half 2026 consolidated revenue to NT$64.27 billion(US$2.0 billion) and surpassing its full-year 2025 total...
Tuesday 7 July 2026
Memory prices defy cooling hopes as AI demand drives fresh 3Q26 hikes

Memory contract prices are poised for another sharp rise in the third quarter of 2026, even after several quarters of hikes have already...

Tuesday 7 July 2026
Micron, Ford sign long-term memory supply agreement
Micron Technology and Ford Motor Company have entered into a long-term supply agreement to strengthen access to automotive memory and storage products. The deal underscores how chip...
Tuesday 7 July 2026
Transcend posts record revenue in 2Q26 on strong demand

Memory module maker Transcend Information reported consolidated revenue of NT$5.07 billion (approx. US$138.66 million) for June 2026...