Chinese DRAM maker ChangXin Memory Technologies (CXMT) is expanding into higher-value memory markets, introducing DDR5 server modules, mass-produced LPDDR6 chips, and automotive DRAM...
SK Hynix is working with Intel and other industry partners to develop memory-centric computing architectures that would allow AI servers to share memory resources, as agentic AI drives...
Intel is courting South Korea's AI ecosystem on two fronts: a 23-company alliance built around Korean-made servers and an inference GPU that swaps costly high-bandwidth memory (HBM)...
Samsung Electronics is expanding its high-bandwidth memory (HBM) packaging operations in South Korea as its Cheonan campus runs short of space, prompting the company to develop nearby...
SK Hynix's sixth-generation high-bandwidth memory (HBM4) production yield has reportedly surpassed 70%, Chosun Biz reported on November 12, citing semiconductor industry sources,...
Micron Technology has responded to an open letter from the Taoyuan Union, a labor group in Taiwan, about its ongoing contract talks. Taoyuan is a city in northern Taiwan where Micron...
Samsung Electronics said on November 12 it had moved up the planned opening of its new high-bandwidth memory (HBM) packaging plant in South Korea by one year to June 2028 to meet rising...
Taiwan’s glass fiber exports to South Korea rose 54.0% year-over-year in the first nine months of 2026 as demand for high-bandwidth memory (HBM) and advanced packaging expanded...
China is advancing its domestic semiconductor ambitions while continuing to access restricted US AI processors, exposing the limits of Washington's export controls and the challenges...
AP Memory Technology reported record-breaking third-quarter 2026 revenue and net profit, driven by surging demand for its integrated passive device (IPD) silicon capacitors under the...
As AI servers and data centers expand, rising DRAM demand is driving up memory prices and supply pressures, making memory an increasingly important infrastructure cost. AMD has introduced...
Charles Kau, chairman of IEMC, said TSMC "cannot make 3D DRAM," dismissing reports that the foundry is evaluating entry into the next-generation memory market at Nvidia's request....
Smaller electronics manufacturers are relying on the spot market for memory as major customers lock in future supply through long-term agreements, according to independent electronic...
South Korean memory chipmaker SK Hynix has named former development chief Hyun Ahn to lead a new Americas unit as competition for custom high-bandwidth memory (HBM) pushes suppliers...
Qualcomm has identified Samsung Electronics and Micron Technology as its primary memory suppliers for certain products, including automotive applications, in its fiscal 2026 annual...
