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NEWS TAGGED MEMORY CHIPS
Tuesday 26 May 2026
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...
Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...

Tuesday 26 May 2026
Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to...
Tuesday 26 May 2026
SK Hynix moves cooling directly to D2D PHY to tackle rising HBM heat challenges
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control...
Tuesday 26 May 2026
Micron expands US DDR4 output as AI keeps global supply tight
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging...
Tuesday 26 May 2026
ADATA outlines cloud-to-edge AI ecosystem and cost-cutting AI Scaler at COMPUTEX 2026
ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming...
Tuesday 26 May 2026
Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK...
Monday 25 May 2026
Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
Monday 25 May 2026
Nvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix
Nvidia's decision to sell its Vera CPU as a standalone chip could create a new source of demand for low-power DRAM, adding another pressure point to the already tight memory supply...
Monday 25 May 2026
Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies...

Monday 25 May 2026
Samsung's China exit shows Korean brands under pressure

Samsung Electronics' retreat from China's TV and home-appliance market is raising broader questions for South Korean industry, as Chinese...

Monday 25 May 2026
AI server boom lifts memory interface chip leader, but DDR5 risks linger
Montage Technology, a company that does not manufacture memory chips itself but instead supplies the interface chips linking CPUs and memory, has quietly emerged as one of the semiconductor...
Sunday 24 May 2026
China smartphone sales plunge 16% around May Day holidays as memory price hikes squeeze demand
China's smartphone sales fell 16% year‑over‑year during the two weeks surrounding the 2026 May Day holiday, a drop that signals wider implications for global supply chains...
Sunday 24 May 2026
Geopolitics disrupts chips — can Taiwan and South Korea cooperate to hold the line?
The global semiconductor industry is being pulled in two directions. On one side, the cost of building a single advanced chip factory has ballooned to as much as US$40 billion, concentrating...