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    Samsung SDI cashes out Samsung Display stake to fund battery expansion
    4min ago
    OpenAI narrows gap as Anthropic's Fable 5 loses enterprise momentum
    13min ago
    Russia's reusable Amur SPG rocket slips to 2031
    16min ago
    Taiwanese suppliers expand China capacity with AI components in focus
    Aug 24, 18:36
    Commentary: YMTC IPO highlights strong profits but three hurdles remain
    Aug 24, 18:36
    Foxconn's China investment returns lead Taiwan peers on AI and HPC demand
    Aug 24, 18:36
    Nvidia and SK Hynix diverge on CPO as 3D optics-centric design may arrive after 2030
    Aug 24, 18:36
    NEWS TAGGED MEMORY CHIPS
    Tuesday 25 August 2026
    AI infrastructure boom drives Taiwan export orders, exposing power bottleneck, net-zero tech needs

    Global artificial intelligence infrastructure buildouts and rising capex by cloud service providers pushed Taiwan's July export orders...

    Tuesday 25 August 2026
    SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
    The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...
    Tuesday 25 August 2026
    Nvidia memory demand widens the gap between SK Hynix and Samsung

    Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

    Monday 24 August 2026
    Etron chair sees memory boom extending to 2028-2030
    The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...
    Monday 24 August 2026
    Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

    Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line...

    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Monday 24 August 2026
    Analysis: SK Hynix pushes beyond HBM with HBF and CPO
    SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
    Monday 24 August 2026
    Nvidia server prices to rise up to 17% as memory costs climb
    Prices for some Nvidia-based server systems due for delivery in 2027 are set to rise by more than 15%, with certain flagship configurations increasing about 17%, as higher memory and...
    Monday 24 August 2026
    Shanghai accepts YMTC's STAR Market listing application
    China's largest NAND flash maker is moving toward a major Shanghai listing, but global investors will be watching more than the size of the deal. YMTC's IPO comes as chip demand rises,...
    Monday 24 August 2026
    Podcast highlights: TSMC Arizona's profit turnaround, US manufacturing viability pressures South Korean memory makers
    DIGITIMES analyst Luke Lin noted on a recent podcast that when reviewing TSMC's semiannual and first-quarter 2026 financial reports, the operational health and profitability of its...
    Monday 24 August 2026
    India roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test
    India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer...
    Monday 24 August 2026
    Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
    ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
    Saturday 22 August 2026
    AI memory windfall: Samsung to hand back up to US$79 billion in 2026
    Samsung Electronics' board has approved a 2026 shareholder return plan estimated at KRW90 trillion to KRW110 trillion (approx. US$64-79 billion), which the company says is the largest...
    Friday 21 August 2026
    Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focus
    South Korean President Lee Jae-myung has begun a fresh round of talks with the country's leading business figures, starting with a private dinner with SK Group chairman Chey Tae-won,...
    Friday 21 August 2026
    Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
    The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
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    BIZ FOCUS
    Aug 24, 08:00
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
    Thursday 20 August 2026
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
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