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NEWS TAGGED MEMORY CHIPS
Monday 27 July 2026
Samsung converts AMD and OpenAI ties into HBM4 supply wins

Samsung Electronics is showing renewed momentum in the AI memory race as it deepens ties with both OpenAI and AMD, two partnerships...

Monday 27 July 2026
Samsung to use 2nm process for HBM5 base die as heat challenge grows

Samsung Electronics plans to manufacture the base die for its next-generation HBM5 memory using a 2nm gate-all-around foundry process,...

Monday 27 July 2026
CXMT tops A-share market cap on IPO debut
Chinese DRAM maker ChangXin Memory Technologies (CXMT) listed on the STAR Market of the Shanghai Stock Exchange on July 27, with its market capitalization briefly topping CNY3.6 trillion...
Monday 27 July 2026
Weekly news roundup: Samsung and SK Hynix favor DDR5, Intel accelerates 18A, Alibaba deepens CXMT ties
AI infrastructure, memory and advanced chipmaking led this week's tech agenda, with Intel, Samsung, SK Hynix, CXMT, Alibaba and Foxconn reshaping capacity and supply chains. Below...
Monday 27 July 2026
CXMT's US$8.6 billion IPO sets off new spending cycle across China's DRAM supply chain
China's leading DRAM producer CXMT listed on Shanghai's STAR Market on July 27 after raising about CNY57.9 billion (approx. US$8.6 billion), the board's largest initial public offering...
Monday 27 July 2026
Apacer 2Q26 profit tops full-year record on memory shortage
Memory module maker Apacer Technology posted record quarterly profit in the second quarter of 2026, lifted by the memory shortage and surging prices. Net profit reached NT$2.7 billion...
Monday 27 July 2026
eSSD contracts surge as AI data centers shift spending from memory to storage
Enterprise SSDs are emerging as a bigger priority in AI infrastructure as generative AI workloads move from training to inference and data centers need faster storage. Reports from...
Monday 27 July 2026
Samsung, LG Display chiefs talk 2H26 memory headwinds and OLED push
Samsung Display's (SDC) and LG Display's (LGD) presidents told media at the K-Display 2026 show that memory-related cost pressure will persist into the second half of 2026, even as...
Sunday 26 July 2026
Toshiba cuts Kioxia stake as memory maker's valuation swings
Toshiba reduced its holding in Kioxia Holdings to 15.1% as of July 15, according to filings reported by Nikkei and Reuters. The change report, submitted to Japan's...
Saturday 25 July 2026
SK Hynix and Nvidia strike long-term deal to co-develop next-generation HBM
SK Group and Nvidia have announced a comprehensive partnership valued at more than $500 billion, spanning AI factory construction and next-generation memory supply, with letters of...
Saturday 25 July 2026
Samsung, SK, Hyundai join Jensen Huang and Korea's President Lee at San Francisco AI Summit
South Korean President Lee Jae-myung and a delegation of the country's most powerful business leaders convened with NVIDIA founder and CEO Jensen Huang in Silicon Valley this week,...
Saturday 25 July 2026
Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
Saturday 25 July 2026
NAND price rally enters plateau as supply stays tight despite weaker spot demand
The pace of NAND Flash price increases has moderated in the second half of 2026, prompting speculation that the memory market may be approaching a turning point. Supply-chain sources,...
Saturday 25 July 2026
Transcend posts record NT$11.9 billion profit in 2Q26, surpassing any prior full-year earnings
Memory module maker Transcend Information posted record-high profit in the second quarter and first half of 2026. Second-quarter consolidated revenue reached NT$18.82 billion (approx...
Saturday 25 July 2026
South Korea unveils AI cooperation agenda as Nvidia partnerships expand
South Korean President Lee Jae Myung launched an AI-focused visit to Silicon Valley by announcing a "San Francisco AI Declaration" aimed at promoting international cooperation in artificial...