Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging...

Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full...

Global memory shortages remain severe, with AI and cloud applications intensifying demand for scarce supply. Prices for both DRAM and...

SK Hynix is pushing deeper into logic design as it develops a next-generation 3D DRAM architecture that could separate memory-cell processing...

Samsung Electronics is reportedly preparing to at least double production of its HBM4-family memory in 2027, accelerating a shift toward...

China's CXMT has begun mass production of its fifth-generation DRAM platform, or G5, claiming process capabilities comparable with the...

Growing memory requirements are increasing interest in Compute Express Link (CXL) as a way to add capacity beyond locally attached memory...

Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate...