CONNECT WITH US
NEWS TAGGED MEMORY CHIPS
Tuesday 8 September 2026
US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
Tuesday 8 September 2026
US chip investment push puts ownership at center of Korea's $200 billion deal

A US push for additional Korean semiconductor manufacturing investment has entered bilateral negotiations just as the first project under...

Tuesday 8 September 2026
CXMT sees tight DRAM supply through 2H26, accelerates server memory and China-made tool validation
Chinese DRAM maker ChangXin Memory Technologies (CXMT) expects global memory supply to remain tight through the second half of 2026, with AI-driven demand supporting prices while the...
Tuesday 8 September 2026
Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

Tuesday 8 September 2026
Samsung allocates more than half of 4nm foundry capacity to HBM4
Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
Tuesday 8 September 2026
Macronix, Winbond, Etron see revenue surge through August as memory price rally continues
Memory manufacturers Macronix International, Etron Technology, and Winbond Electronics all reported surging revenue for the first eight months of 2026. As the memory upcycle continues,...
Tuesday 8 September 2026
Adata, Team Group post record August revenue as memory module makers build inventory for 2027
Major Taiwanese memory module manufacturers saw revenue remain at high levels in August 2026, as memory prices continued to rise. Adata Technology and Team Group both posted record-high...
Monday 7 September 2026
SK Hynix reportedly ends LG eSSD talks as ASICLAND deal expands
SK Hynix reportedly ended talks with LG Electronics over outsourcing part of the backend design for a next-generation enterprise SSD (eSSD) controller, but the memory maker told DIGITIMES...
Monday 7 September 2026
HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days
Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...
Monday 7 September 2026
Phison snaps up low-cost China NAND inventory, AI revenue share set to top 40%
Phison CEO K.S. Pua expects NAND Flash supply to remain tight into 2027 despite capacity expansion across major memory makers, arguing that forecasts of a rapid return to oversupply...
Monday 7 September 2026
Micron scores seventh PTAB win in YMTC patent fight
Micron Technology has scored a seventh favorable Patent Trial and Appeal Board (PTAB) outcome in its wide-ranging patent fight with China's Yangtze Memory Technologies (YMTC), while...
Monday 7 September 2026
SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
Monday 7 September 2026
Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV
China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...
Monday 7 September 2026
Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
Sunday 6 September 2026
Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...