Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation...
Samsung is in talks to invest about EUR1 billion (approx. US$1.14 billion) in French AI startup Mistral as part of a wider fundraising...
Chinese chip designer GigaDevice is investing another CNY500 million (approx. US$73.9 million) into its wholly owned subsidiary to support...
SK Hynix said in a July 22 disclosure that it had neither pursued nor decided on an acquisition of Intel's under-construction semiconductor...
Rising memory prices and higher costs for other key upstream components are forcing smartphone brands to reduce mid- and low-end models...
