Micron Technology's fiscal fourth quarter showed a memory maker whose growth now comes mainly from price rather than volume, with customers committing cash years in advance to secure...
Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.
DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of...
Phison Electronics CEO Pua Khein-Seng says he tells himself every day that the memory shortage will ease tomorrow. In reality, he says, AI-driven demand has opened a gap between memory...
Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
Netlist has begun legal proceedings against Micron and downstream customers Nvidia, Broadcom, and Google to stop them from allegedly using the company's patented high-bandwidth memory...
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...
China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
