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    NEWS TAGGED MEMORY CHIPS
    Friday 11 September 2026
    Kioxia eyes US listing amid NAND profit rebound
    Kioxia's planned US listing could broaden the Japanese memory maker's access to global institutional investors as a sharp recovery in NAND profitability coincides with stronger data-center...
    Friday 11 September 2026
    Memory makers gain the upper hand as Apple's iPhones pay the price
    Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.
    Friday 11 September 2026
    Micron brings forward record pay amid Taiwan strike threat
    Micron has announced its FY26 pay package for more than 60,000 employees worldwide, the largest in the company's history. For the first time, every employee will receive merit-based...
    Friday 11 September 2026
    Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit
    Apple has unveiled its latest iPhone 18 Pro and the A20 Pro, its first 2nm chip. According to Apple's official specifications, the A20 Pro features a six-core CPU, seven-core GPU,...
    Friday 11 September 2026
    SK Hynix raises cash portion of bonuses after 25-vote union rejection

    SK Hynix has increased the cash portion of its profit-sharing bonus in a revised tentative wage agreement, after production workers...

    Friday 11 September 2026
    AI server tracker: Taiwan's August filings say demand is still accelerating
    The clearest read yet on whether the AI build-out is still accelerating arrived this week in a batch of unaudited Taipei filings, and it accelerated. The 49 Taiwan-listed companies...
    Friday 11 September 2026
    Rayzher rides semiconductor fab buildout to record revenue
    Rayzher Industrial, a high-tech factory gas supply system solutions provider, reported consolidated revenue of NT$369 million (approx. US$11.7 million) in August 2026, up 83.26% year-over-year...
    Friday 11 September 2026
    China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
    Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip...
    Friday 11 September 2026
    Samsung, SK Hynix eye 2028 High-NA DRAM rollout

    SK Hynix is targeting 2028 to apply High-NA extreme ultraviolet lithography to DRAM mass production and is considering joining an industry...

    Friday 11 September 2026
    TPK, GIS post mixed August sales as 2H26 demand stays cautious
    Touch panel makers TPK and General Interface Solution Holding reported diverging August revenue trends, but both remained cautious on consumer electronics demand in the second half...
    Friday 11 September 2026
    More memory won't fix AI's bottleneck, says Microsoft's Azure hardware chief
    Microsoft's AI accelerator was never designed to compete with Nvidia. It was designed to run Microsoft's own inference workloads across its own fleet, and that scoping decision —...
    Thursday 10 September 2026
    Foxsemicon hits record 2Q26 revenue on Thailand ramp-up
    Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter...
    Thursday 10 September 2026
    Apple added flat US$100 to every iPhone and rebuilt A20 Pro around memory
    Two things happened at Apple's September 9 launch that belong in the same story: the company raised the price of every iPhone it sells by exactly US$100, and it introduced a chip whose...
    Thursday 10 September 2026
    China's Nvidia rivals raise prices as HBM shortage bites
    Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding...
    Thursday 10 September 2026
    AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
    AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
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    BIZ FOCUS
    Sep 11, 08:00
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Thursday 10 September 2026
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
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