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NEWS TAGGED MEMORY CHIPS
Monday 20 July 2026
HBM4 battle shifts to cooling as hybrid bonding slips
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...
Monday 20 July 2026
Samsung to cut over 800 US jobs amid market headwinds

Samsung Electronics is cutting over 800 jobs in the US from its smartphone, display, and consumer electronics business units. The division,...

Monday 20 July 2026
Memory is becoming a national security priority, SK chair warns

The global scramble for AI memory is fast becoming a matter of national economic security, with governments intervening in supply and...

Monday 20 July 2026
Commentary: China's DRAM comes of age with CXMT's IPO — but a trio of hurdles remains

CXMT's STAR Market IPO marks a coming-of-age moment for China's DRAM industry, but the listing is only the beginning. Having proved...

Monday 20 July 2026
Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand

Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory...

Monday 20 July 2026
Weekly news roundup: AI chip race widens across silicon photonics, HBM, memory fabs, and frontier models

AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

Monday 20 July 2026
Networking demand remains resilient, but component shortages threaten shipment schedules

AI data center expansion and high-speed network upgrades continue to support demand for networking equipment. However, as the industry...

Monday 20 July 2026
CXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing...

Monday 20 July 2026
Micron's 10-year deal with GlobalWafers signals tighter 12-inch supply

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...

Monday 20 July 2026
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
Sunday 19 July 2026
Memory must adopt foundry model to fix AI inference bottleneck, says Korean scholar

AI development is driving larger data transfers and higher GPU efficiency demands, pushing memory toward customization and prompting...

Saturday 18 July 2026
Commentary: Samsung, SK Hynix in Washington's crosshairs over memory fabs
On a recent podcast, DIGITIMES analyst Luke Lin reviewed two major updates in the chip industry: Intel's Ireland fab expansion and rising US scrutiny of Samsung Electronics and SK...
Saturday 18 July 2026
As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment
Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...
Friday 17 July 2026
Oppo cuts OnePlus from North America and Europe, and Realme from China

OnePlus is exiting the North American and European markets for its future product launches, while sales of new Realme products will...

Friday 17 July 2026
Montage Technology forecasts stronger first-half profit as AI demand lifts chip sales and discloses Korean prosecutors' search
China-based Montage Technology said its first-half results are expected to rise sharply, underscoring continued demand for AI-linked memory and interconnect chips that matter to data...