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Friday 2 January 2026
Memory shortages to persist through 2026 as AI server demand surges

Global memory markets are expected to remain tight through 2026 as aggressive spending by cloud service providers (CSPs) on AI infrastructure...

Friday 2 January 2026
CXMT logs first annual profit on DRAM price rebound

ChangXin Memory Technologies (CXMT) returned to profitability in 2025, recording its first full year of net income after a rebound in...

Friday 2 January 2026
Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests
Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen...
Friday 2 January 2026
China's CXMT moves toward IPO with global DRAM share nearing 4%
China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to...
Friday 2 January 2026
Samsung rolls out 7,200Mbps DDR5 samples as SK Hynix, CXMT intensify competition
Samsung Electronics has reportedly begun sampling next-generation DDR5 memory, delivering speeds that are approximately 30% faster than current mass-produced offerings. Industry observers...
Friday 2 January 2026
Samsung aims for 2026 HBM4 mass production after customer validation
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...
Friday 2 January 2026
Smartphones and notebook prices could increase as memory lead times extend
Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers, including Micron, Samsung, and...
Friday 2 January 2026
SanDisk, Micron vie for PSMC's Tongluo fab capacity
Market rumors and formal statements indicate two major memory companies, SanDisk and Micron, have approached PSMC about capacity cooperation at PSMC's new 12-inch fab in Tongluo,...
Friday 2 January 2026
South Korea's semiconductor bill risks weakening competitiveness as rivals roll out cash subsidies
South Korea's ruling and opposition parties have reached a preliminary consensus on the Semiconductor Special Act, though its passage may be delayed until 2026, and the law faces...
Friday 2 January 2026
2026 electronics industry outlook
As 2026 begins, DIGITIMES has conducted in-depth analyses of sectors within the electronics industry. The current landscape theme can be described as "one core, two keys, three drivers."...
Friday 2 January 2026
Server ODMs remain bullish through the end of 2026 despite bubble concerns
Although AI bubble concerns persist, server ODMs remain optimistic about 2026. Nvidia's GB300 began shipping in the fourth quarter of 2025, and the new Vera Rubin architecture expected...
Friday 2 January 2026
Samsung raises 2025 bonuses for DS division amid memory boom
Samsung Electronics' Device Solutions (DS) division is set for a strong 2025, driven by robust performance in general-purpose DRAM and high-bandwidth memory (HBM).
Wednesday 31 December 2025
Samsung reportedly poised to clear KRW20 trillion profit mark in 4Q25

Samsung Electronics is reportedly on track to post sharply higher operating profit in the fourth quarter of 2025 as demand tied to artificial...

Wednesday 31 December 2025
China's CXMT eyes US$4.2B Shanghai IPO to fuel memory chip expansion

China's leading domestic DRAM maker, ChangXin Memory Technologies (CXMT), is seeking to raise CNY29.5 billion (approx. US$4.2 billion)...

Wednesday 31 December 2025
Samsung reportedly plans 50% HBM output surge through 2026

Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according...