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NEWS TAGGED COPOS
Thursday 18 September 2025
CoPoS emerges as successor to CoWoS: K&S aligns with AI chip demands
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
Friday 15 August 2025
Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp
TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...