649 news items tagged capex
Light guide plate maker GLT back to MacBook Pro supply chain
Thursday 5 December 2019Light guide plate (LGP) maker Global Lighting Technologies (GLT) has returned to the glowing keyboard supply chain of MacBook Pro and is set to add two production lines at its plant...
Nan Ya may double capex in 2020 to hike ABF, SiP substrate capacity
Thursday 5 December 2019Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...
UMC sees clear growth momentum for 5G in 2020
Monday 2 December 2019Taiwan's pure-play foundry UMC will see clear growth momentum in 2020 come from ever-increasing chips foundry demand for 5G applications, with clients moving actively to pull in shipments...
DRAM, NAND flash supply may see double-digit shortfalls in 2H20
Monday 2 December 2019The memory sector is expected to resume growth momentum in 2020 thanks to steady increase in demand for 5G and server applications, with DRAM and NAND flash to see supply shortfalls...
TSMC Nanjing swings to quarterly profit
Tuesday 26 November 2019TSMC Nanjing Company has reported its first quarterly profit for the third quarter, which narrowed its losses to NT$1.41 billion (US$46.1 million) in the first three quarters of 2019...
Acter to gain from renewed IC plants construction in China in 2020
Friday 22 November 2019Taiwan-based clean room engineering specialist Acter is expected to see its revenues pick up steadily in 2020 as major clients in Taiwan and China will boost capex to step up major...
Gudeng, Marketech to gain from strong EUV equipment demand in 2020
Friday 22 November 2019Taiwan-based semiconductor equipment suppliers Gudeng Precision and Marketech International are expected to enjoy bright shipment prospect for 2020 as they have joined the supply...
PTI chair sees FOPLP as alternative solution for IC scaling
Thursday 21 November 2019FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that...
ShunSin to ramp up capex in 2020 for SiP capacity expansion
Friday 15 November 2019ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...
Tong Hsing sees CIS packaging as major growth driver for 2020
Friday 15 November 2019Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors and other niche ICs, expects its 2020 revenues to hit a new high on...
TSMC to build advanced packaging fab in northern Taiwan in 2020
Thursday 14 November 2019TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in...
PCB maker Zhen Ding plans record capex for 2020
Wednesday 13 November 2019Taiwan's top PCB maker Zhen Ding Technology (ZDT) will budget a record high capex for 2020 and expects its revenues for the year to grow significantly from 2019 on stronger shipments...
TSMC board approves US$6.6 billion for advanced process capacity
Wednesday 13 November 2019The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of about US$6.62 billion for the construction of new fab facilities, installation...
Pegatron mulling more production in Southeast Asia
Friday 8 November 2019Pegatron will not rule out setting up new factory sites in Vietnam and India to satisfy customer demand, according to company president and CEO SJ Liao.
Top 5 share of semi industry capex to set new record in 2019
Wednesday 6 November 2019The share of semiconductor industry capital spending held by the top-5 companies (Samsung, Intel, TSMC, SK Hynix and Micron) is forecast to reach an all-time high of 68% this year,...
Taiwan backend firms expanding testing capacities for 5G chipsets
Wednesday 6 November 2019Taiwan's backend specialists ASE Technology, Powertech Technology (PTI), King Yuan Electronics (KYEC) and Sigurd Microelectronics are all moving to ready additional capacities to...
Some flat panel makers in Korea, Taiwan to slash capex for 2019
Monday 4 November 2019Some flat panel makers in Korea and Taiwan, notably LG Display, AU Optronics (AUO) and Innolux, are cutting their capex for 2019 as they seek to improve their bottom lines in the...
Samsung reportedly to step up capacity expansion pace
Friday 1 November 2019Samsung Electronics is reportedly looking to place new equipment orders for its memory fabs in Pyeongtaek (South Korea) and Xian (China), gearing up to resume its aggressive capacity...
VIS stays cautious
Friday 1 November 2019Vanguard International Semiconductor (VIS) remains cautious about its outlook for the rest of 2019, citing still high inventory levels at its customers, according to the Taiwan-based...
ASE eyes bright 1Q20 amid strong 5G-driven backend demand
Thursday 31 October 2019IC backend house ASE Technology Holding expects to enjoy a better-than-regular performance for the first quarter of 2020 thanks to strong high-end chips packaging orders for 5G phones,...
ABF substrate supply may fall short of 5G-driven demand in 2020
Tuesday 29 October 2019ABF substrate demand will stay robust throughout 2020 and beyond thanks to a diversity of applications arising with the advent of the 5G era, according to Jiang Xugao, a PCB expert...
Gudeng, Marketech enjoy strong orders for EUV tools
Monday 28 October 2019Taiwan-based Gudeng Precision and Marketech International, which provide ASML equipment parts and components, are being identified as some of the beneficiaries of TSMC's capex ramp-up...
Robust 7nm and 5nm chip demand to drive TSMC 2020 growth
Friday 18 October 2019TSMC is set to enjoy another year of record-high sales in 2019, but net profits are unlikely to break the record high set last year due mainly to disappointing results during the...
TSMC expects 9% sales growth to hit another record in 4Q19
Thursday 17 October 2019TSMC expects to enjoy another quarter of record high revenues, while adding an additional US$4 billion in its full-year capital budget. The pure-play foundry has forecast revenues...
Intel CEO Bob Swan in Taiwan to meet suppliers
Tuesday 8 October 2019Intel CEO Bob Swan is in Taiwan meeting with the chip vendor's supply chain partners, tightening relationships and talking about future development directions.
- Samsung slashes capex, calls end to chip boom after record third quarter (Oct 31, 2018) - Reuters
- Intel: Spending for Apple, or just cause they like to spend? asks Instinet (Nov 28) - Barron's
- Samsung to cut semi capex; Intel and TSMC to increase it (Jan 8) - Electronics Weekly
- US chipmakers rein in spending - Citi (Nov 16) - The Financial Times
- Samsung deploys cash pile with US$10 billion buyback, capex boost (Oct 29) - Bloomberg
- TSMC overtakes Intel in chip capex ranking (Jul 6) - EE Times
- Applied Materials, Lam, KLA rise despite Intel cutting capex view (Jan 15) - Barron's
- Xilinx and NXP collaborate to reduce capex and opex costs of wireless infrastructure radios (Nov 19) - Company release
- Apple spends way less than Microsoft on R&D (November 20) - CNNMoney
- Toshiba considers ramping up NAND chip capacity (June 25) - Reuters