Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its in-house developed...

Samsung Electronics will be making significant efforts to strengthen the competitiveness of its logic IC business, and is also eyeing to become the world's largest logic chipmaker...

IC backend house ASE Technology Holding's newly-developed fan-out panel-level packaging (FOPLP) technology has obtained orders from HiSilicon, according to sources familiar with the...

Vanguard International Semiconductor (VIS) remains cautious about its outlook for the second quarter of 2019, as the specialty IC foundry has seen its customers adjust inventory at...

Taiwan-based Tripod Technology has disclosed it has signed a contract worth NT$2 billion (US$64.8 million) for the construction of additional production lines at its manufacturing...

Powertech Technology (PTI) expects to post flat or slight sequential growth in revenues for the second quarter, followed by a substantial increase in the third quarter, accordin to...

TSMC will see its 7nm process utilization rate climb substantially in the second half of 2019, driven by a seasonal pick-up in demand for smartphones, as well as chip demand for HPC,...

Taiwan-based Nanya Technology has cut its capex outlook this year to approximately NT$7 billion (US$226.8 million) from the previously-set NT$10.6 billion. The downward revision was...

Major Taiwan-based backend houses ASE Technology Holding and Powertech Technology (PTI) have both reported sequential decreases of 22.1% and 13.2%, respectively, in consolidated revenues...

PCB and IC substrate supplier Unimicron Technology expects about 60% of its capex this year to be spent on IC substrate production.

Memory market demand is expected to pick up in the second half of 2019, according to Miin Wu, chairman for flash memory and mask ROM chipmaker Macronix International.

Apple has recently released its new iPad Air and iPad mini, but sources from the upstream supply chain have pointed out that the new tablets' shipments are unlikely to pick up until...

Specialty IC foundry Vanguard International Semiconductor (VIS) is expected to see its revenues rebound to sequential growth in the second quarter of 2019, as the visibility of its...

DRAM chipmaker Nanya Technology saw its revenues fall to a 19-month low in January 2019, while niche-market DRAM specialist Winbond Electronics' revenues...

ASE Technology Holding expects revenues to drop in the first quarter of 2019, due to inventory correction at customers engaged in the handset- and communication-related IC sector...

PCB and IC substrate supplier Unimicron Technology has decided to increase its capex budget this year by NT$2.32 billion (US$75.5 million) to total NT$8.3 billion, according to a...

Despite its dim business and industry outlook this year, Taiwan Semiconductor Manufacturing Company (TSMC) continues to make progress in the development of sub-7nm process technologies...

DRAM contract prices are set to fall nearly 20% sequentially in the first quarter of 2019, according to DRAMeXchange, which estimated previously a smaller 15% price decrease.

Taiwan-based DRAM chipmaker Nanya Technology has estimated 2019 capex at about NT$10 billion (US$324.3 million), significantly lower than the NT$20.4 billion spent in 2018.

The global market for NAND flash memory will remain in oversupply in 2019, as the outlook for end-market demand stays weak, according to DRAMeXchange. NAND flash chipmakers have moved...

The semiconductor industry is expected to allocate the largest portion of its capex spending for flash memory again in 2019, marking the third consecutive year that flash has led...

Major DRAM chipmakers will slow down their capacity expansion pace in 2019 with lower capex than year-ago levels, judging from end-market demand weakness this year, according to DR...

Memory chipmakers had a good year in 2018, but the outlook for 2019 is marred by uncertainties arising from the US-China trade war and concerns about over-supply. Samsung Electronics...

Wafer probing specialist Ardentec will likely budget NT$1.6-1.7 billion (US$52-55 million) in capex for 2019, down from about NT$3 billion this year, according to sources familiar...

The board of directors of flexible PCB specialist Flexium Interconnect has approved plans to budget NT$8 billion (US$259.5 million) in capex for 2019, which will be utilized for capacity...