DIGITIMES news archive

Total: 10 items

TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

Tuesday 16 June 2026

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The...

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TSMC PLP timeline faces skepticism from Taiwan industry sources

Tuesday 16 June 2026

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry...

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TSMC Taiwan packaging production FOPLP

TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead

Friday 8 May 2026

TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI...

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TSMC packaging CoWoS expansion capacity

Topco Scientific to showcase key semiconductor materials and equipment at SEMICON Japan

Tuesday 9 December 2025

... on wafer on substrate (CoWoS), and chip on panel on substrate (CoPoS). TSC subsidiary TEAMS collaborates with clients...

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equipment materials Topco 2025 Taiwan

TSMC's retired tools spark fierce demand in China, ASEAN

Thursday 27 November 2025

TSMC's plan to reactivate its 6-inch and 8-inch fabs at Hsinchu Science Park has drawn strong attention from the semiconductor supply chain, according to industry sources. Although the TSMC-certified tools are old, they...

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TSMC demand ASEAN 6-inch supply chain

Weekly News Roundup: US moves to ban Chinese chipmaking equipment; Tesla eyes in-house fab; Intel hires TSMC veteran

Monday 24 November 2025

... interests. TSMC accelerates CoPoS mass production to 2029, Taiwan suppliers win first orders TSMC is accelerating development of its next-generation Chip-on-Panel-on-Substrate (CoPoS) technology as demand climbs for Nvidia AI GPUs...

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DIGITIMES Asia weekly news roundup equipment TSMC Intel Tesla

South Korean tech giants rush into glass substrates despite mounting fears of overinvestment

Friday 21 November 2025

South Korea's largest conglomerates are pouring resources into glass substrates, a next-generation semiconductor packaging material that promises better thermal stability and power efficiency. Samsung, SK, and LG have...

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packaging glass substrate demand materials LG

JCET unveils Singapore blueprint for next-gen semiconductor packaging

Thursday 30 October 2025

Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the world's third-largest, JCET Group, is...

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JCET Singapore packaging demand 5G HPC

CoPoS emerges as successor to CoWoS: K&S aligns with AI chip demands

Thursday 18 September 2025

Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS) process. Many suppliers see...

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AI chip CoPoS CoWoS packaging equipment

Nvidia, TSMC face antitrust scrutiny as US-China tensions spotlight market power

Thursday 18 September 2025

Just as Washington and Beijing are preparing to resume trade talks, China's State Administration for Market Regulation (SAMR) has thrown a wrench into the works. The agency accused Nvidia of violating the country's...

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Nvidia TSMC Beijing antitrust market

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