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REALTIME NEWS
LG Electronics's three strategies to counter competition from Chinese brands
Tomorrow's Headlines
33min ago
China's SeeYA wins Meta’s MR panel order as BOE misses certification
Tomorrow's Headlines
33min ago
Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
Tomorrow's Headlines
33min ago
InP enters a capacity race as TCL moves into indium phosphide laser chips
Tomorrow's Headlines
33min ago
Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
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Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
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NEWS TAGGED DIGITIMES ASIA
Monday 6 July 2026
Weekly news roundup: Anthropic tightens controls; Innoscience-Infineon clash shows the weaponization of China's courts
Below are the most-read DIGITIMES stories from the week of June 29-July 5, 2026:
Tuesday 30 June 2026
SK Hynix accelerates Yongin fab timeline by 12 years as HBM strains memory capacity
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster...
Monday 29 June 2026
Weekly news roundup: South Korea takes physical AI push from policy to practice; Europe aggressively pursues non-red supply chains
Below are the most-read DIGITIMES Asia stories from the week of June 22-28, 2026:
Friday 26 June 2026
Inside Corning: a century of R&D bets, and why optical fiber is paying off again
Preface
Monday 22 June 2026
Weekly news roundup: Micron CEO turns visa rejection into US$1 trillion milestone; Taiwan LED makers look beyond lighting
Below are the most-read DIGITIMES Asia stories from the week of June 15-21, 2026:
Monday 15 June 2026
Weekly news roundup: Samsung foundry profit rebound may come in 3Q26; Nvidia unveils AI PC vision
Below are the most-read DIGITIMES Asia stories from the week of June 8-14, 2026:
Monday 8 June 2026
Weekly news roundup: Taiwan ecosystem strengthens AI chip supply chain as MediaTek, Nvidia deepen cooperation
Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
Monday 1 June 2026
Weekly news roundup: Nvidia CEO hosts trillion-dollar dinner; TSMC CEO to address bonus backlash in person
Below are the most-read DIGITIMES Asia stories from the week of May 25-31, 2026:
Monday 25 May 2026
Weekly news roundup: TSMC faces its first real rivals; Agibot claims 100% success rate in factory deployment
Below are the most-read DIGITIMES Asia stories from the week of May 18-24, 2026:
Monday 18 May 2026
Weekly news roundup: TSMC faces AI supply strain as Samsung, Intel, and Apple test foundry alternatives
Below are the most-read DIGITIMES Asia stories from the week of May 11-17, 2026:
Monday 11 May 2026
Weekly news roundup: Taiwan freezes trading in MediaTek; 2D NAND shortage spirals
Below are the most-read DIGITIMES Asia stories from the week of May 4-10, 2026:
Monday 4 May 2026
Weekly News Roundup: Terafab already affecting wafer fab landscape; Intel launches multi-year reset
Below are the most-read DIGITIMES Asia stories from the week of April 27-May 4, 2026:
Monday 27 April 2026
Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea
Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
Monday 20 April 2026
Weekly news roundup: Samsung launches voluntary retirement; Qualcomm moves into custom DRAM with CXMT
Below are the most-read DIGITIMES Asia stories from the week of April 13-19, 2026:
Monday 13 April 2026
Weekly news roundup: Shortages spread to MLCCs; SK Hynix reportedly in talks with Microsoft and Google
Below are the most-read DIGITIMES Asia stories from the week of April 6-April 13, 2026:
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BIZ FOCUS
Sep 1, 08:00
Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
Monday 31 August 2026
NewPower Worldwide expands credit facility to $750M for growth
Monday 31 August 2026
Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
Thursday 27 August 2026
ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
2027 memory capacity reportedly sold out as buyers quietly lock in supply
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Interview: Nvidia exec on progress of CPO production and pluggable optics
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
Taiwan manufacturing moves into the prosperity zone as US export growth slows
SK Hynix explores Intel as second source for HBM base dies
South Korea-India joint venture opens semiconductor materials plant, targets China-free supply chain
Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion
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