Winbond board approves capex for new 12-inch fab in southern Taiwan

Jessie Shen, DIGITIMES, Taipei Wednesday 17 March 2021 0

Winbond Electronics' board of directors has approved a capex budget of approximately NT$13.13 billion (US$463.83 million) to invest in the company's new 12-inch wafer plant located in Kaohsiung, according to the maker of specialty DRAM and flash memo...

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