Bits + chips
Winbond board approves capex for new 12-inch fab in southern Taiwan
Jessie Shen, DIGITIMES, Taipei

Winbond Electronics' board of directors has approved a capex budget of approximately NT$13.13 billion (US$463.83 million) to invest in the company's new 12-inch wafer plant located in Kaohsiung, according to the maker of specialty DRAM and flash memo...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Login to continue
  • Save my User ID and Password

    Save my User ID and Password

    Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

    Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

  • NEW users please register first.
Realtime news
This website adheres to all nine of NewsGuard's standards of credibility and transparency.
© 2021 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.