Advanced Micro-Fabrication Equipment Inc., China (AMEC) has delivered the world's first Primo Menova 12-inch metal etching system to a top domestic IC design and manufacturing service...
On June 18, 2025, Texas Instruments (TI) announced it will invest over US$60 billion in seven semiconductor fabs across the US. This historic investment aims to boost TI's domestic...
Taiwanese IC design houses report a steady reduction in 8-inch wafer capacity by local foundry partners. Several foundries are now urging clients to transition select products to...
Micro OLED technology development in China has accelerated, driven by substantial government subsidies to enhance display manufacturing. Chinese firms are now increasing investments...
Reports indicate that the Trump administration is considering revising incentive agreements under the CHIPS and Science Act (commonly referred to as the 'CHIPS Act'), potentially...
The historical separation of Silicon carbide (SiC) material supply chains between the US and China in the military sector has been completed for years, particularly in applications...
Chinese foundries have stepped up 12-inch fab capacity expansions, which is poised to result in more heated price competition in the mature process market in 2025, according to industry...
Yandong Microelectronics (YDME) announced plans on December 31, 2024, to issue up to 225 million shares at CNY17.86 (US$2.45) per share to Beijing Electronic Holding Co. (BEHC), targeting...
Taiwan-based pure-play foundries have implemented various strategies to counter China's competitive pricing in mature process nodes, according to industry sources.
GlobalWafers has disclosed that its two US subsidiaries will receive up to US$406 million in direct funding from the US Department of Commerce under the Chips Act.
The second phase of Hua Hong Semiconductor's 12-inch wafer fab expansion in Wuxi held a production ceremony on December 10. This event garnered significant attention following the...
VisionPower Semiconductor Manufacturing Company (VSMC), a joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors formed in September 2024, celebrated...
Chinese outsourced semiconductor assembly and test (OSAT) providers have intensified their capacity expansion for advanced packaging to support the country's semiconductor self-sufficiency...
Following a previous donation of two sets of 12-inch wafer equipment to Taiwan's National Science and Technology Council (NSTC), TSMC has donated an additional three sets to the Ministry...
