Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its in-house developed...

Taiwan-based Phoenix Silicon International (PSI), dedicated to wafer reclaim, wafer thinning and MEMS mid-end process services, plans to set up a new plant to fulfill robust orders...

Silicon wafer suppliers have seen 12-inch wafer demand plummet recently, due mainly to weak demand coming from the memory chip sector, according to industry sources. Prices for 12-inch...

Despite a ramp-up of orders for 7nm chips, TSMC is still seeing orders for other advanced process nodes remain sluggish which has kept its overall 12-inch fab capacity in oversupply,...

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...

Globalfoundries and ON Semiconductor have entered into a definitive agreement for ON Semi to acquire a 300mm fab located in East Fishkill, New York, according to the companies.

Memory market demand is expected to pick up in the second half of 2019, according to Miin Wu, chairman for flash memory and mask ROM chipmaker Macronix International.

Alpha & Omega Semiconductor (AOS), which designs and manufactures power semiconductors for a broad range of applications, will start production at its new 12-inch wafer plant...

Silicon wafer company GlobalWafers continues to see its 8- and 12-inch wafer manufacturing lines run at full capacity utilization, as the majority of orders is based on long-term...

SJ Semiconductor (SJSemi) has unveiled its ultrawideband dual-polarization antenna-in-package (AiP) technology for 5G millimeter-wave applications.

The number of 300mm wafer fabrication facilities in operation continues to increase. With nine new 300mm wafer fabs scheduled to open in 2019, the worldwide number of operational...

The silicon wafer market will likely become oversupplied later in the first quarter of 2019, and the situation may worsen in the following quarter,...

Recent rumors circulating in the chipmaking industry have claimed that Globalfoundries is looking to sell another Singapore-based fab, likely a 12-inch one, following the deal it...

Infineon, now the world's largest supplier of MOSFET chips, is ramping up production of such chips at its new 12-inch plant, inspiring more IDMs to follow suit in 2019, a move that...

A batch of 6-inch silicon wafers has been recalled recently by a China-based company due to concerns about quality, according industry sources.

GlobalWafers has disclosed revenues for January 2019 hit the third highest monthly levels in the company's history, while Formosa Sumco Technology (FST) saw its January revenues slip...

DRAM chipmaker Nanya Technology saw its revenues fall to a 19-month low in January 2019, while niche-market DRAM specialist Winbond Electronics' revenues...

Specialty DRAM and flash memory chipmaker Winbond Electronics has said plans to build a new 12-inch wafer plant in southern Taiwan are still on track despite some near-term headwin...

Taiwan Semiconductor Manufacturing Company (TSMC) has seen the delivery time for chips produced on its advanced node processes reduced to less than two months compared with over three...

Winbond Electronics, a maker of specialty DRAM and flash memory, saw its December revenues fall to a 20-month low of NT$3.69 billion (US$119.6 million).

Taiwan-based Macronix International has announced it will continue working with IBM to jointly develop phase-change memory and other new advanced technologies under a new agreement...

Foxconn Electronics' (Hon Hai Precision Industry) ambition in the chipmaking sector is taking shape. The Taiwan-based conglomerate reportedly has stuck a deal with China's Zhuhai...

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have both seen their fabless customers particularly those engaged in the TDDI (touch and display...

Silicon wafer market growth for 2019 will depend on chipmakers' 12-inch fab expansions and smartphone demand, Digitimes Research believes.

The board of directors of United Microelectronics (UMC) has authorized a capital budget execution of NT$27.406 billion (US$889.4 million) for capacity deployment.