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Eternal Materials remains cautious about 3Q22 sales prospects
Chips + Components
NEWS TAGGED 12-INCH WAFER
Tuesday 20 September 2022
Taiwan analog IC firms step up transition to 12-inch wafer manufacturing
Taiwan-based analog IC design houses have stepped up their transition to 12-inch wafer manufacturing, and are actively developing 12-inch chip designs, according to industry source...
Wednesday 7 September 2022
China keenly developing homegrown IGBT power chips for vehicles
Chinese chipmakers are keen on developing homegrown automotive power semiconductors, particularly IGBT chips and modules long in shortage, looking to replace part of foreign supplies...
Monday 22 August 2022
IC design houses mull asking TSMC to halve quote hikes for 2023
Taiwan IC design houses are mulling a move to renegotiate with TSMC on foundry prices for 2023, looking to have the chip manufacturing partner halve its quote hike to 3% for mature...
Friday 19 August 2022
SMIC to keep long-term capacity expansion plans unchanged
China's top foundry Semiconductor Manufacturing International Corp (SMIC) has decided not to change its long-term capacity expansion plans despite volatile market environments, sparking...
Monday 18 July 2022
PSMC see DDI clients violate long-term contracts
Powerchip Semiconductor Manufacturing (PSMC) has reported contract violations by its display driver IC clients who would rather honor punitive payments than see their inventories...
Wednesday 6 July 2022
Globalwafers to help ease 12-inch wafer shortage in the US; Sharp buys back SDP as wholly-owned subsidiary
Wednesday 29 June 2022
China makers keen on expanding capacity for 12-inch silicon wafers
China-based silicon wafer makers are aggressively proceeding with capacity expansions for 12-inch offerings, which is expected to improve the country's semiconductor self-sufficiency,...
Friday 24 June 2022
Nanya breaks ground for new 12-inch plant
DRAM maker Nanya Technology has broken ground on its new 12-inch wafer plant designed for production capacity of 45,000 wafers monthly. The plant construction will be in three phases,...
Monday 13 June 2022
TI reportedly expects analog chip shortage to ease in 2H22
Texas Instruments (TI) has notified its clients that the supply-demand imbalance for analog chips, particularly power management ICs (PMICs), will ease in the second half of the year,...
Monday 6 June 2022
China silicon wafer maker NSIG set to double capacity by 2024
China's National Silicon Industry Group (NSIG) has newly disclosed plans to expand production capacity for 12-inch silicon wafers at a total investment of CNY6.79 billion (US$1.017...
Thursday 2 June 2022
Nexperia acquisition of Newport Wafer Fab called into question
Nexperia, a subsidiary of China-based Wingtech Technology, may fail to complete its acquisition of Newport Wafer Fab (NWF), the UK's largest wafer fab, as the deal is being investigated...
Thursday 26 May 2022
Concerns rising over potential foundry overcapacity in 2024
Despite chip demand showing signs of a downturn since the start of 2022, the capacity expansion spree at foundry houses seems unstoppable, sparking concerns that overcapacity may...
Wednesday 25 May 2022
Foxconn to build 12-inch wafer fab plant in Malaysia; Hyundai and Kia investing US$16.5 billion to boost EV production in South Korea
Wednesday 18 May 2022
DNeX and Foxconn subsidiary to build and operate 12-inch wafer fab plant in Malaysia
Dagang NeXchange Berhad (DNeX) and Big Innovation Holdings (BIH), a wholly-owned subsidiary of Hon Hai Precision Industry (Foxconn), plan to set up a joint venture company to build...
Monday 16 May 2022
SMIC no longer discloses revenue by process nodes
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has reported first-quater 2022 sales, but omitted a revenue breakdown by manufacturing process nodes...
Wednesday 30 March 2016
Winbond SpiStack memories
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series is Winbond's first to allow the "stacking" of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements. The Winbond SpiStack W25M series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. Additionally, W25M memories feature the popular, multi-IO SpiFlash interface and command set. SpiStack homogeneous memories are achieved by stacking SpiFlash dies. For example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory in the industry-standard 8-pin 8x6mm WSON package. Winbond's stacked product, W25M512JV, is also available in the widely used 16-pin SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous memories call for the stacking of a NOR memory with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory. Winbond's SpiFlash memory devices are manufactured at the company's 12-inch wafer fabrication facility in Taichung, Taiwan.
Sep 22, 10:43
SG+: Twin to win the supply chain long game with Singapore as the gateway to Southeast Asia
Tuesday 20 September 2022
GCS joins forces with partners to target smart space management market in Singapore while aiming to tap opportunities in Southeast Asia
Tuesday 20 September 2022
Realizing vision of smart transportation with AWS: How Metropia makes Taiwan's MaaS smarter
Thursday 15 September 2022
Silicon Labs new Matter Development Platform simplifies the IoT ecosystem
Suppliers set to enter production race for 3D NAND with 200+ layers
China gearing up to mass purchase IC equipment and materials
Foundries under pressure to renegotiate quotes and orders for 2023 with automotive customers
New MacBook Pro to buoy Apple notebook market share
iPhone 14 Pro series may stabilize Apple market share for high-end models at 60%
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
Top-5 notebook brands see combined shipments went down 5% on month in August, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – August 2022
Tablet shipments in India rise close to 70% on year in 1Q22, says DIGITIMES Research
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