News tagged 12-inch at DIGITIMES

NEWS TAGGED 12-INCH

Wednesday 8 October 2025

China and Taiwan chart diverging paths in the 12-Inch SiC market

In the high-stakes arena of silicon carbide (SiC) innovation, a quiet transformation is underway. While much attention has focused on non-Chinese supply chains entering advanced packaging...

Tuesday 7 October 2025

China's SiC industry finds high-value exit in Meta's AR supply chain

As the global semiconductor industry eyes the rise of 12-inch silicon carbide (SiC) wafers as potential game-changers in advanced packaging,...

Thursday 2 October 2025

CoWoS creates turning point for 12-inch SiC

Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...

Wednesday 1 October 2025

China's 12-inch SiC leap: SICC, Jingsheng in spotlight

The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance...

Tuesday 30 September 2025

GlobalFoundries opens Beijing office, doubles down on localizing production for China market

US-based foundry GlobalFoundries (GF) has faced numerous challenges in its China strategy, from halting investment in a 12-inch fab in Chengdu to shifting toward mature process partnerships...

Tuesday 30 September 2025

Non-China supply chain pushes 12-inch SiC into advanced packaging, but China stands to gain

The surge in AI chips fueling CoWoS packaging demand has put silicon carbide (SiC), a third-generation semiconductor, on the verge of entering this high-value arena. The shift is...

Tuesday 23 September 2025

12-inch SiC substrates poised for two-phase entry onto CoWoS packaging

After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips...

Sunday 21 September 2025

Non-China market opportunities remain despite no involvement in advanced packaging, say Episil and EPI

The surge of 12-inch silicon carbide (SiC) materials entering advanced packaging processes has drawn significant market attention to Episil Technology, which spans first- and third-category...

Saturday 20 September 2025

TSMC, Largan, Episil push back on hype with blunt market outlooks

SiC applications recently gained attention following reports that TSMC and Nvidia are pushing for advancements, elevating companies like Episil and its subsidiary EPI into the market...

Monday 15 September 2025

Taiwan's government-built 12-inch fab to come online in 2028, integrating industry and academia capabilities

TSMC has donated several sets of used 12-inch chipmaking equipment to the government, which has had the Industrial Technology Research Institute (ITRI) under the Ministry of Economic...

Wednesday 10 September 2025

China's NSIG to absorb loss-making wafer subsidiaries in US$967M restructuring

China's top silicon wafer maker, National Silicon Industry Group (NSIG), has unveiled a major restructuring, taking full control of three loss-making 12-inch wafer subsidiaries. The...

Tuesday 9 September 2025

RongSemi denies fab halt as YMTC Veteran takes key role in Ningbo expansion

Simon Yang, the former YMTC CEO and later deputy chairman, has joined Rong Semiconductor (Ningbo) Co. (RongSemi) as head of its technical expert committee. The announcement came alongside...

Tuesday 9 September 2025

China's JFSemi cracks 12-inch SiC wafer barrier with homegrown laser technology

The global silicon carbide (SiC) market remains centered on 6-inch wafers, with only a few Chinese players moving into 8-inch lines....

Thursday 4 September 2025

GlobalFoundries finds new road in China: Zensemi partnership anchors auto chip strategy

GlobalFoundries (GF), the US-based contract chipmaker, is accelerating its "China for China" strategy through a partnership with Guangzhou Zen Semiconductor (Zensemi). The collaboration...

Wednesday 3 September 2025

Taiwan targets new growth in AI chip packaging with silicon carbide substrates

As AI chips advance, managing their high thermal output has become a key performance bottleneck. Semiconductor suppliers recently indicated that the advanced packaging sector is considering...

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