CONNECT WITH US
Wednesday 6 November 2024
To split or not to split: Intel's dilemma has no clear-cut solution
Intel is grappling with an operational crisis as its IDM 2.0 transformation plan has yet to yield results, casting doubt on when its foundry business might finally become profitable. This raises the question of whether Intel should consider abandoning its IDM model and separating its product design and manufacturing divisions—a move with both potential advantages and drawbacks. Industry leaders,...
LATEST STORIES
Friday 17 July 2026
Analysis: Unveiling the low-profile engineer building China's CXMT into a DRAM heavyweight
ChangXin Memory Technologies' (CXMT) STAR Market IPO is more than just one of China's biggest semiconductor listings. It also marks the culmination of Zhu Yiming's two-decade effort to build a domestic memory industry, taking the entrepreneur from founding flash memory designer GigaDevice to creating China's first globally competitive DRAM maker.
Friday 17 July 2026
China's AI chips hit three walls — and bet on 3D memory to break through
China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.
Thursday 16 July 2026
Commentary: Xi Jinping elevates Sovereign AI, diplomacy, ecosystems into China's next AI strategy
The 2026 World Artificial Intelligence Conference (WAIC) opens in Shanghai on July 17, with Chinese President Xi Jinping set to attend and deliver a keynote speech.
Thursday 16 July 2026
Commentary: Ennoconn-Kontron deal highlights physical AI supply chain reshuffle
AI technologies and applications have matured rapidly in recent years. That has driven trends such as edge AI and physical AI. The shift has also affected industrial computer (IPC) makers, which have long focused on end-point applications on the factory floor and at other field sites.
Thursday 16 July 2026
Commentary: CXMT IPO binds China's DRAM supply chain into one ecosystem
CXMT's STAR Market IPO has become more than a fundraising exercise. The strategic placement roster shows how China's largest DRAM maker is using the capital market to connect semiconductor suppliers, AI cloud providers, device brands, automakers, and state-backed investors, reinforcing a domestic memory ecosystem.
Thursday 16 July 2026
Commentary: Chip lead times extend as cloud AI squeezes capacity
Reports of longer chip lead times have been mounting. ADI has notified customers that, as recovering demand tightens supply, lead times for some analog chip products have stretched to six months, and it has urged customers to place orders early to avoid delivery delays. Meanwhile, a channel player said STMicroelectronics (ST) MCU lead times have extended to 52 weeks, prompting distributors to begin asking customers about demand for all of 2027.
Tuesday 14 July 2026
Commentary: AI computing power map reshapes ASEAN, with Singapore still central
In the second quarter of 2025, DIGITIMES visited the rapidly expanding Johor-Singapore Special Economic Zone (JS-SEZ) and Wiwynn's massive AI server system integration (SI) factory. Microsoft also granted a media interview, using the occasion to discuss Singapore's role as the hub of the broader ASEAN AI ecosystem.
Tuesday 14 July 2026
Commentary: Terafab and DRAM reveal Tan's long-term vision for Intel
US President Donald Trump recently claimed that Taiwan's TSMC will double the size of its Arizona fab project, reviving attention on his goal of raising the US share of the global chip market to 50% before the end of his term. TSMC declined to comment on the report, but investors may press the company on the issue at its second-quarter 2026 earnings call.
Tuesday 14 July 2026
Commentary: Huawei builds NPO alliance to shape CPO-era optical interconnect standards
The AI race is expanding from computing power to data transmission, making optical interconnects a critical battleground for next-generation AI infrastructure.
Tuesday 14 July 2026
Analysis: Why Meta's AI strategy sparked a market misread
Reports that Meta is considering leasing out idle AI computing capacity have rattled investors. But treating Meta's predicament as a warning sign for the entire AI industry is a classic case of overgeneralization.
Tuesday 14 July 2026
Commentary: Forget AI chips — China's top science awards reveal what Beijing is actually building
China has nine years left to meet its goal of becoming a global science and technology powerhouse by 2035.
Monday 13 July 2026
AI's new gatekeepers: US and China tighten grip on frontier models
The world's most powerful AI models are encountering a new constraint beyond chips, data and engineering talent: governments increasingly want a say in when frontier systems are released, who may access them and which capabilities should remain restricted.
Thursday 9 July 2026
Commentary: China's AI chip race leaves 15 chipmakers chasing SMIC's 7nm capacity
China's bid to replace Nvidia in AI chips faces a constraint more immediate than design capability: SMIC's limited 7nm-class manufacturing capacity.
Thursday 9 July 2026
Analysis: Sovereign AI is chipmaking's next growth driver — but not everyone gets a seat
Where will cloud AI's next wave of growth come from? Increasingly, the market is answering with two words: sovereign AI.
Monday 6 July 2026
Analysis: AI supercycle could drive semiconductor market beyond US$2 trillion by 2030
The global semiconductor market is entering a historically significant growth phase. According to WSTS's latest June forecast, global semiconductor revenue is projected to grow by nearly 90% in 2026, reaching approximately US$1.5 trillion. Growth is expected to remain exceptionally strong in 2027, with year-on-year expansion of around 27%, pushing total market revenue close to US$1.9 trillion.