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Friday 19 April 2024
SK Hynix announces deepening cooperation with TSMC to develop sixth-generation HBM
On April 19, SK Hynix announced that it had recently signed a memorandum of understanding (MOU) with TSMC. The two companies will collaborate closely on producing next-generation high bandwidth memory (HBM) products and enhancing advanced packaging technologies integrating HBM with logic layers.
Friday 19 April 2024
Samsung makes debut at Beijing auto show to promote car semiconductors
To penetrate the Chinese mobility market, Samsung Electronics' Device Solutions Division is poised to attend the upcoming Beijing International Automotive Exhibition for the first time.
Friday 19 April 2024
Chip wars: can US sanctions shift the semiconductor landscape?
Chinese semiconductor foundry firms are persistently adopting aggressive pricing strategies, putting relentless pressure on the market share of South Korean 8-inch wafer manufacturers. In this evolving landscape, South Korean industry insiders are eyeing potential benefits if the US expands its sanctions on China to encompass more mature semiconductor processes.
Friday 19 April 2024
NAND demand shows signs of recovery as Samsung and SK Hynix adjust production
With NAND Flash demand picking up, leading players like Samsung Electronics, SK Hynix, Kioxia, and Western Digital have started ramping up wafer production in NAND lines. However, to prevent price impacts, memory manufacturers are cautiously adjusting capacity and setting limits on wafer production.
Friday 19 April 2024
Taiwan companies repatriate US$46.3 billion back from China in 2023
Taiwan's Financial Supervisory Commission (FSC) released data showing that as of December 2023, 1,209 Taiwanese companies had invested NT$2,735.6 billion (US$84.2 billion) in China, an increase of NT$32.4 billion from the end of 2022. However, investment repatriation from China last year alone accounted for 17.5% of the accumulated amount over the past, probably due to capital needs for supply chain migration.
Friday 19 April 2024
Samsung top execs visit Taiwan flash controller companies
Samsung Electronics' top executives, led by co-CEO Kyung Kye-Hyun, recently visited Taiwan to meet with local suppliers such as Silicon Motion Technology, a major manufacturer of NAND flash controllers and a long-standing partner of Samsung, according to industry sources.
Thursday 18 April 2024
Toshiba cut 5,000 jobs to fuel digitalization and AI
Japan-based manufacturing giant Toshiba is undergoing a significant restructure following its delisting in December 2023.
Wednesday 17 April 2024
Samsung Foundry plans to provide 'one-stop-service' to compete with TSMC
South Korean tech giant Samsung Electronics has received US$6.4 billion of US CHIPS Act direct funding and disclosed that it will increase its investments to US$40 billion to set up advanced packaging facilities and a research & development (R&D) center. In other words, Samsung aims to build a front-end-to-back-end verticle in the US to attract big fabless orders.
Wednesday 17 April 2024
Winbond on track for growth as PC application demand resumes
Winbond Electronics, a maker of specialty DRAM and flash memory, will see its main products be on track for growth, according to industry sources.
Wednesday 17 April 2024
Samsung at crossroads, seeking ties with Taiwanese peers?
Samsung Electronics reported profits of US$4.89 billion for the first quarter of 2024. The semiconductor division successfully ended a streak of losses spanning four consecutive quarters. In the quarter, the Device Solutions (DS) division, primarily dedicated to semiconductors, had a profit of approximately US$1.6 billion.
Tuesday 16 April 2024
Samsung ready to mass produce industry-leading 290-layer V-NAND for AI apps
Samsung Electronics is reportedly set to mass produce its 290-layer 9th generation V-NAND (3D NAND) products in mid-April.
Tuesday 16 April 2024
Memory chipmakers keep raising prices but some module houses refuse to buy
Memory chipmakers are bent on raising prices, but memory module manufacturers who are unwilling to accept price increases are refusing to buy, according to industry sources.
Monday 15 April 2024
Samsung and SK Hynix reportedly to resume memory capacity expansion plans
Market rumors said Samsung Electronics and SK Hynix are planning to resume the capacity expansion plans at its Pyeongtaek and Cheongju fabs, which were put on hold during the previous business downturn.
Monday 15 April 2024
Samsung executives visited Taiwan and TSMC in secret for HBM collaboration
According to sources in Taiwan's semiconductor supply chain, Samsung Electronics visited Taiwan at the end of March.
Monday 15 April 2024
Hanmi won HBM equipment orders from Micron, Samsung next?
In recent years, due to the development of the High Bandwidth Memory (HBM) market, the thermal compression (TC) bonder equipment produced by Hanmi Semiconductor has attracted attention. Besides supplying SK Hynix, it has recently signed an HBM TC bonder supply contract with Micron and may receive additional orders in the future.
Monday 15 April 2024
Weekly news roundup: JCET has offered advanced packaging services for chips below 5nm, the company says
These are the most-read DIGITIMES Asia stories in the week of April 8 - April 12.
Friday 12 April 2024
Samsung faces first large-scale strike in history amid intensifying global competition
Samsung Electronics is caught in the history of the first collective strike crisis in South Korea amidst intensifying global semiconductor competition. Samsung's five labor unions, should they eventually choose to go on strike, will become Samsung's first largest collective action in the 55 years since its founding.
Friday 12 April 2024
Cadence and Arm come together to drive automotive chiplet ecosystem
Cadence's solution includes a digital twin.
Friday 12 April 2024
Micron solutions qualify for Qualcomm automotive platforms to power vehicle AI
Micron Technology has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies' Snapdragon Digital Chassis, a comprehensive set of cloud-connected platforms designed to power data-rich, intelligent automotive services, according to the memory vendor.
Friday 12 April 2024
Chinese storage startup targets enterprise server apps
HippStor Technology, a Chinese memory and storage startup, plans to mass-produce DDR5 RDIMMs in the second quarter of 2024 in response to data center upgrade requests.
Friday 12 April 2024
South Korea accelerates semiconductor strategy post-Taiwan quake
In the wake of a seismic event rattling Taiwan, and amidst the dawn of the AI era, South Korea's governmental bodies and corporate giants have convened to assess supply chain vulnerabilities. This gathering aims to fast-track the Semiconductor Mega Cluster (SMC) project in South Korea, compelling a comprehensive overhaul of tax relief mechanisms.
Friday 12 April 2024
SK Hynix said to mass produce 10nm 1c DRAM in 3Q24, ahead of Samsung
SK Hynix reportedly is slated to start mass production of the sixth-generation 10nm 1c DRAM in the third quarter of 2024, ahead of Samsung's schedule, drawing significant attention from the industry.
Thursday 11 April 2024
Global semiconductor equipment billings slip in 2023, says SEMI
Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to US$106.3 billion in 2023, from an all-time high of US$107.6 billion in 2022, according to SEMI.
Thursday 11 April 2024
Win Win Precision harnesses new energy and semiconductor innovations as growth driver
With new energy and semiconductor components as its two major operating engines, Taiwan's Win Win Precision Technology is looking to advanced light storage and smart energy management solutions, as well as semiconductor innovations to bolster its growth momentum in 2024 and beyond, according to chairman Davis Chen.
Thursday 11 April 2024
Nearly 70% of Taiwan's IC output originates from 12-inch foundries
Taiwan's Ministry of Economic Affairs (MOEA) announced on April 8 that the country's IC sector has expanded for 11 straight years from 2012.
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