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Friday 18 July 2025

SK Hynix may lose HBM crown by 2026 as rivals trigger price showdown

Goldman Sachs recently released a striking report on the high-bandwidth memory (HBM) market, stating that regardless of forecasting scenarios, SK Hynix's monopoly over HBM will eventually come to an end.

Friday 18 July 2025

H20 comeback sparks rush for HBM with Samsung set to benefit

Nvidia's H20 chip has been granted approval by the US government to be sold in China, despite being a lower-spec version compared to its original design. This approval has quickly led to a surge in demand, with Chinese customers placing substantial orders. The H20 is available in two versions: initially featuring Samsung Electronics' HBM3, before switching to SK Hynix's 8-layer HBM3E.

Friday 18 July 2025

GB300 production underway: Nvidia's strategic shift brings relief to ODMs

Nvidia has begun limited production of its next-generation AI server platform, the GB300, with volume shipments expected to ramp up starting in September 2025, according to sources in the supply chain. Industry insiders expect a smooth production trajectory into the second half of the year, thanks to a strategic shift that's easing the burden on manufacturers.

Thursday 17 July 2025

South Korean chipmakers reportedly delay DDR4 phase-out amid supply crunch

Global memory giants are phasing out or discontinuing DDR4 DRAM production to accelerate capacity shifts toward advanced process products such as DDR5 and high-bandwidth memory (HBM), causing severe short-term supply constraints for DDR4. However, recent market reports indicate that major South Korean manufacturers may be slowing their DDR4 discontinuation schedules.

Thursday 17 July 2025

Adata surges on memory boom, eyes AI and Biotech for next growth wave

Taiwanese memory module maker Adata Technology reported after-tax profit of NT$462 million (US$15 million) in June 2025, marking a dramatic turnaround from a loss in the same month last year. The figure is nearly on par with the company's first-quarter earnings of NT$526 million, signaling continued momentum in 2025.

Wednesday 16 July 2025

LG enters hybrid bonding tool race, challenging Samsung and Hanwha

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory (HBM) chips. Often described by industry insiders as the "dream tool" for future memory packaging, HB systems are seen as essential to boosting performance in AI and data-intensive applications.

Wednesday 16 July 2025

Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production

Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company defends its market-leading position against rising competition.

Wednesday 16 July 2025

Goldkey gears up for August IPO as DDR4 demand takes off

A tight supply of DDR4 DRAM has triggered a buying spree. Goldkey Technology chairman Vicky Tseng said that since May and June 2025, DDR4 spot prices have skyrocketed more than 100%, while DDR5 has also shown a mild upward trend.

Tuesday 15 July 2025

China's PIM chip sidesteps HBM restrictions, advanced node barriers

China remains at a disadvantage in high-bandwidth memory (HBM) and other advanced chip technologies, with sanctions on cutting-edge process nodes further delaying domestic semiconductor progress. However, researchers are now turning to processing-in-memory (PIM) as a potential workaround—a path that could allow China to bypass traditional bottlenecks through architectural innovation.

Tuesday 15 July 2025

DDR4 spot prices surge sharply as memory module makers benefit from high inventory in 2Q25

Driven by major DRAM manufacturers focusing on investment and research in high-bandwidth memory (HBM) and gradually phasing out mature process products, DDR4 spot prices have rapidly doubled since the second quarter of 2025. According to market estimates, DDR4 spot prices have nearly doubled over the past three months.

Monday 14 July 2025

Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers.

Monday 14 July 2025

Kioxia, YMTC jump ahead with wafer-bonded NAND in volume production

Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory production. This strategic shift moves the industry beyond the traditional race to increase memory cell layer counts, focusing instead on architectural advances that improve performance, power efficiency, and scalability.

Monday 14 July 2025

Taiwan chip firm Macronix seeks tech edge as US-China rivalry intensifies

Memory chipmaker Macronix is betting on advanced technologies to escape a bruising price war as US-China tensions reshape the global semiconductor landscape.

Monday 14 July 2025

JEDEC's LPDDR6 sets new pace for mobile and AI memory with faster, leaner architecture

On July 9, 2025, the JEDEC Solid State Technology Association, the leading organization for microelectronics standards, introduced LPDDR6 (JESD209-6), its latest low-power DRAM specification. The new standard brings major advances in memory performance, power efficiency, and security, targeting mobile devices, edge AI, and high-performance computing. LPDDR6 marks a pivotal shift toward faster, leaner, and more secure DRAM technology.

Saturday 12 July 2025

Nanya technology posts wider Q2 loss as Taiwan dollar strength weighs

Taiwan's Nanya Technology reported a deeper second-quarter loss despite surging memory chip demand, as currency headwinds and pricing pressures offset volume gains.

Friday 11 July 2025

SK Hynix narrows gap with Samsung as AI boom fuels HBM chip sales in Q2

SK Hynix is rapidly closing the gap with Samsung Electronics in the global memory chip race, driven by surging demand for high-bandwidth memory (HBM) used in AI applications. According to a newly released report by Counterpoint Research, SK Hynix posted US$15.5 billion in combined DRAM and NAND revenue in the second quarter of 2025, placing it in a virtual tie with Samsung for the top spot in the global memory market.

Thursday 10 July 2025

Samsung's chip division weighs on earnings with KRW1T write-down in 2Q25

Samsung Electronics saw its second-quarter 2025 operating profit plunge nearly 56% year-over-year, largely driven by underperformance in its semiconductor unit. The Device Solutions (DS) division, responsible for 50-60% of Samsung's overall revenue, is projected to record an inventory write-down of about KRW1 trillion (US$729 million). The downturn was compounded by prolonged weakness in the NAND flash market and ongoing losses in Samsung's foundry business.

Thursday 10 July 2025

Phison 2Q25 revenue hits record as NAND controller shipments surge

NAND flash manufacturers have been implementing production cuts, leading to urgent orders to surge and leaving a supply shortage for NAND controllers. Phison CEO K.S. Pua explained that as NAND controller supply tightens, the company has been actively coordinating additional upstream capacity with supply chain partners to meet demand from NAND suppliers. The results of these efforts are already reflected in the company's performance for June and the second quarter of 2025, driving quarterly revenue to a new all-time high.

Tuesday 8 July 2025

Adata hits 15-year revenue high on soaring DDR4 demand

Adata Technology, one of Taiwan's top memory module makers, just posted its best monthly revenue in more than 15 years, thanks to surging demand for DDR4 memory chips. As major chipmakers phase out DDR4 production, spot market prices have jumped past contract levels, sparking a wave of urgent buying. That spike in both prices and orders helped Adata deliver what it's calling its strongest June on record.

Tuesday 8 July 2025

CXMT files for IPO to expand DRAM capacity as AI, geopolitics rewire global memory market

CXMT Corp., China's top domestic DRAM manufacturer, has initiated its IPO process, signaling a key step in the nation's pursuit of semiconductor independence. On July 7, 2025, China's securities regulator confirmed that the company had entered IPO counseling, with China International Capital Corporation (CICC) and China Securities Co. (CSC) serving as financial advisors.

Tuesday 8 July 2025

Samsung sees 56% profit plunge by Nvidia HBM chip delays in 2Q25

Samsung Electronics warned on July 5 that its second-quarter 2025 operating profit is likely to plunge 56% year-over-year, dragged down by continued difficulties in gaining Nvidia's certification for its latest high-bandwidth memory (HBM) chips, critical components in the booming AI infrastructure market.

Monday 7 July 2025

Samsung's 1H25 performance incentive rates: Samsung foundry bonus drops to 0

Samsung Electronics' Device Solutions (DS) division, which oversees its semiconductor operations, has capped its performance bonus for the first half of 2025 at just 25% of the base monthly salary — the lowest among the company's major business units.

Sunday 6 July 2025

Yamaha Motor launches robotics division to tap semiconductor equipment demand

Yamaha Motor is accelerating its pivot into the semiconductor equipment space with the launch of Yamaha Robotics, a newly established division focused on robotic systems for electronics manufacturing. The company aims to position the business as its third major revenue pillar, alongside motorcycles and marine engines.

Friday 4 July 2025

AI surge drives Micron to broaden HBM output beyond Taiwan

Micron plans to start operations at its new factory in Singapore in 2026, aiming to expand its production capacity of high-bandwidth memory (HBM). The investment is part of the company's strategy to meet rising demand for advanced memory products driven by artificial intelligence (AI) applications.

Friday 4 July 2025

Intel's new AI accelerator may adopt HBM4? SK Hynix stresses no confirmed details

Intel recently held its AI Summit in South Korea, sharing the latest trends in artificial intelligence (AI) technology and innovative applications across various industries. The event also explored future AI development directions and cross-industry collaboration strategies. Among the highlights, cooperation between SK Hynix and Intel on high-bandwidth memory (HBM) for next-generation AI accelerators attracted significant attention.

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