中文網
Taipei
Fri, Jul 30, 2021
12:23
partly cloudy
34°C
CONNECT WITH US
NEWS TAGGED FLASH
Thursday 29 July 2021
DRAM, NAND flash contract prices grow modestly in 3Q21
Contract market prices for DRAM and NAND flash memory have both registered a modest 5-10% growth in the third quarter of 2021, according to industry sources.
Wednesday 28 July 2021
Macronix to expand 12-inch fab capacity
Macronix International, a maker of memory chips, has disclosed plans to expand its 12-inch fab capacity for 3D NAND and NOR flash with an investment of NT$41.5 billion (US$1.48 bil...
Wednesday 28 July 2021
Macronix sees profits more than double in 2Q21
ROM and NOR flash memory maker Macronix International saw its net profits climb 110% sequentially to NT$1.93 billion (US$68.6 million) in the second quarter of 2021, buoyed by rising...
Tuesday 20 July 2021
Taiwan maintains edge as largest base for IC wafer capacity, says IC Insights
As of December 2020, Taiwan led the world with 21.4% of global wafer capacity installed in that country, according to IC Insights. In second place was South Korea, which accounted...
Monday 19 July 2021
Memory channel sales in China sluggish
Memory module houses and channel distributors are less optimistic about the outlook for China's channel sales in the third quarter of 2021, despite an ongoing rally in contract market...
Thursday 15 July 2021
Rising NOR flash prices to boost Winbond 2021 profit
Winbond Electronics is expected to post handsome profits in 2021, buoyed by rising NOR flash prices, as well as growing sales generated by its logic IC subsidiary Nuvoton Technology,...
Monday 12 July 2021
Adata expects double-digit rise in DRAM contract prices
Memory module maker Adata Technology expects DRAM contract prices to register a double-digit sequential surge in the third quarter of 2021, with an over 15% rise in low-power DRAM...
Friday 9 July 2021
Phison to see revenue hit another record high in 3Q21
Phison Electronics is expected to see its revenue hit another record high in the third quarter of 2021, buoyed by rising NAND flash prices and strong SSD sales, according to market...
Friday 9 July 2021
Supreme upbeat about server chip demand in 3Q21
Growth in memory chip demand for servers and data centers is poised to outperform that for handsets in the third quarter of 2021, according to Taiwan-based Supreme Electronics.
Thursday 8 July 2021
Samsung wins almost half of 1Q21 smartphone memory market, says Strategy Analytics
The global smartphone memory market generated revenue of US$11.4 billion in the first quarter of 2021, according to Strategy Analytics. Samsung led the market with a 49% revenue sh...
Thursday 1 July 2021
Six-inch fabs become acquisition target
Six-inch wafer fabs have become acquisition targets of automotive power semiconductor companies, as well as Foxconn Electronics (Hon Hai Precision Industry) and Tesla, both of which...
Tuesday 29 June 2021
DRAM, NAND flash prices to rise about 10% in 3Q21
DRAM and NAND flash prices are expected to rise about 10% sequentially in the third quarter of 2021, but the price outlook for the fourth quarter is still uncertain, according to...
Monday 28 June 2021
Flash device controller suppliers see order visibility stretched
NAND flash device controller suppliers have seen order visibility stretched beyond 2022 to 2023, thanks to strong demand for notebook, Chromebook and handset applications, coupled...
Friday 25 June 2021
YMTC 128-layer 3D NAND process yield rates lower-than-expected
Yield rates for Yangtze Memory Technologies' (YMTC) 128-layer 3D NAND flash process technology remain insufficient for commercial production, according to industry sources.
Friday 18 June 2021
Winbond intros 1.8V 512Mb SPI NOR flash for 5G, server apps
Winbond Electronics has announced it is expanding its total solution of SPI NOR flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash that can support...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.