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Tuesday 28 April 2026
Indian startup targets AI inference opportunity with full-stack compute platform
While global AI infrastructure investment remains concentrated around massive GPU clusters for training frontier models, Indian startup Turiyam.ai is betting on a different commercial reality: the dominance of inference
Tuesday 28 April 2026
LG reportedly plans to expand its India manufacturing footprint
New Daily reports that LG Electronics has decided to expand its manufacturing footprint in India, with a major investment of about KRW1.4 trillion (approximately US$1.0 billion) to upgrade its home appliance production facility in Greater Noida. The move comes as LG Group Chair Koo Kwang-mo participates in a presidential economic delegation visiting India and Vietnam, underscoring the strategic importance of the investment timing
Monday 27 April 2026
HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor assembly and testing (OSAT) facility in Uttar Pradesh, according to people familiar with the matter cited by The Economic Times. The project marks a further step in India's push to localize semiconductor packaging capacity amid a global supply chain diversification
Monday 27 April 2026
Foxconn's 48% export surge cements India's role in Apple's supply chain
India's smartphone manufacturing expanded 8% year on year in 2025, driven by a 28% surge in exports and modest domestic sell-in growth of 1%, according to Counterpoint Research. Exports accounted for about one-third of all phones made in India, underscoring the sector's deepening export orientation
Monday 27 April 2026
India roundup: Micron ramp, Dholera SEZ push India toward full-stack chip manufacturing

India is accelerating its semiconductor ambitions, from Micron Technology's Sanand ramp to new fabrication and advanced packaging projects, while expanding design partnerships. At the same time, regulatory pressure on Apple, weakening smartphone demand, and solar policy tensions highlight challenges alongside growing global supply-chain integration

Monday 27 April 2026
Tata's India chip fab faces leadership churn and engineering hurdles amid uneven but continuing progress
Tata Electronics' flagship semiconductor fabrication project in Dholera, Gujarat—long viewed as India's most ambitious attempt to build a domestic chip manufacturing ecosystem—continues to move forward but remains marked by repeated setbacks alongside visible progress. While construction activity and regulatory milestones indicate momentum, leadership exits and complex site conditions underline the challenges of executing a greenfield fab at global scale
Saturday 25 April 2026
India's solar growth faces policy tension between local manufacturing push and rapid capacity expansion
India's push to localize solar manufacturing while rapidly expanding capacity is creating a structural bottleneck, as stricter domestic sourcing rules risk constraining supply just as renewable deployment accelerates. Industry groups warn that the mismatch between solar cell production and demand could delay projects, even as the government accelerates its clean energy transition
Friday 24 April 2026
Apple faces US$38B antitrust fine in India, eyes Trump card for relief
Apple faces a potential US$38 billion antitrust fine in India as Tim Cook prepares to hand leadership to John Ternus, raising both legal and business implications for the company and for India's approach to regulating global tech firms
Thursday 23 April 2026
IndieSemiC partners with Nordic on wireless modules as India expands design-led semiconductor push
IndieSemiC, an Indian semiconductor and chip design company, has partnered with Nordic Semiconductor to design and commercialize wireless modules for connected devices, as Indian firms seek to capture more value in the semiconductor chain through design, RF integration, certification, and module-level manufacturing
Wednesday 22 April 2026
Naver, TCS partner on AI and cloud in India during Korea-India summit
Naver has signed a strategic partnership with Tata Consultancy Services (TCS) to jointly develop artificial intelligence (AI) and cloud services in India, marking one of the cooperation deals concluded during a Korea-India summit visit
Wednesday 22 April 2026
Micron's Sanand ramp shifts India chip debate from milestone to manufacturing system
Micron Technology's Sanand assembly, test, marking, and packaging plant has given India something it lacked until recently: a live semiconductor manufacturing operation with global supply-chain relevance
Tuesday 21 April 2026
India and Korea deepen strategic cooperation across technology, energy, and sustainability
The state visit of South Korea President Lee Jae-Myung to India on April 20, 2026, marked a broad effort by both countries to expand cooperation across trade, technology, and strategic sectors. He was hosted in New Delhi by Droupadi Murmu, who welcomed him at Rashtrapati Bhavan and later hosted a banquet in his honor
Monday 20 April 2026
India notifies Dholera chip SEZ, signaling diversification of global semiconductor supply chain
India's notification of a special economic zone in Dholera for the country's first chip fabrication plant marks a potential turning point in global semiconductor supply chains, promising a new manufacturing hub that could attract investment, create skilled jobs, and reduce import dependence — part of a broader international effort to diversify electronics production worldwide
Monday 20 April 2026
India's smartphone shipments fall 3% amid cost pressures and weak demand
India's smartphone shipments fell 3% year-on-year in the first quarter of 2026, signaling strain across global supply chains and consumer markets as rising component costs and sluggish demand squeezed volumes and margins. The downturn — and the further price pressures expected ahead — could affect device availability, pricing strategies, and earnings across manufacturers and retailers
Monday 20 April 2026
Odisha to break ground on India's first advanced 3D chip packaging unit
Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous integration capacity in South Asia, attracting investment for aerospace, defense, artificial intelligence (AI), 5G, and data center applications, and creating jobs