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Thursday 2 April 2026
Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance
Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo,...
Thursday 2 April 2026
France backs Taiwan's ProLogium with EUR1.5B subsidy to build solid-state battery factory
The French government will provide about EUR1.5 billion (US$1.7 billion) in subsidies to support Taiwanese startup ProLogium Technology's new factory construction in France. According...
Thursday 2 April 2026
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory...

Thursday 2 April 2026
TSMC's US expansion held ransom as JASM takes flight
TSMC is winning quietly in Japan and losing loudly in Washington — and the reason may have nothing to do with chips.
Thursday 2 April 2026
South Korea's market volatility hands Taiwan a rare edge in AI
During a lecture hosted by the Chinese National Association of Industry and Commerce (CNAIC), DIGITIMES Chairman Colley Hwang analyzed the East Asian industrial landscape...
Thursday 2 April 2026
TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active
TSMC's expansion scale in the US has exceeded expectations, prompting Taiwanese suppliers with existing or planned local operations to take a more proactive approach. Reportedly, companies...
Thursday 2 April 2026
Denso targets US$54 billion revenue, Rohm deal faces Toshiba-Mitsubishi alliance hurdle
Japan's auto parts supplier Denso on March 31 unveiled a mid-term business plan through March 2031, targeting revenue of JPY8 trillion (approx. US$54 billion) and a return on equity...
Thursday 2 April 2026
Interview: How Europe's two-year AI lag is becoming a security liability
While North America and Asia race to deploy "physics-bending" AI hardware, Europe has opted for a "wait-and-see" approach, shielded by thick layers of regulation. In a DIGITIMES...
Thursday 2 April 2026
Kioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026
Japan-based NAND flash maker Kioxia has formally issued an end-of-life (EOL) notice for a wide range of legacy NAND products, underscoring an industry-wide shift toward advanced 3D...
Thursday 2 April 2026
Top 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior...

Thursday 2 April 2026
Top 10 Chart: Markets signal AI shift as Taiwan IC designers decouple from early-year revenues

Taiwan's IC design sector is undergoing a decisive shift in 2026, with capital markets effectively validating an industry transition toward...

Thursday 2 April 2026
Taiwan deploys air force and drones for cloud seeding in Hsinchu
Facing drought conditions, Taiwan's government has mobilized the air force and drones to conduct cloud seeding operations near the area over the Hsinchu Science and Industrial Park,...
Thursday 2 April 2026
Salesforce enters Taiwan, eyes local cloud services with AWS and Google Cloud
US CRM software provider Salesforce has established its Taiwan subsidiary and opened a Taipei office in early 2026, underscoring Taiwan's role in the global semiconductor and AI supply...
Thursday 2 April 2026
MG adopts semi-solid batteries to boost EV range in Europe

MG, the European arm of China's SAIC Motor Group, confirmed that its upcoming MG4 Urban will feature semi-solid battery technology to...

Wednesday 1 April 2026
Samsung auctions 123 chip tools during Xi'an NAND upgrade to V8
Samsung Electronics is reportedly overhauling its production lines, offering 123 idle semiconductor tools for sale across South Korea and Xi'an as it shifts to more advanced process...