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IN THE NEWS
Wednesday 5 August 2026
Samsung, SK Hynix reportedly test AMEC tools to guard against tighter US curbs
Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese...
Wednesday 5 August 2026
Taiwan fund launches US$800M guarantee plan for US investment

Taiwan's National Development Fund said it will commit US$800 million to a financing guarantee mechanism aimed at helping local companies...

Wednesday 5 August 2026
Macroblock returns to profit as display demand and new products support outlook
Macroblock's return to profitability in the second quarter points to a steadier recovery in the LED display supply chain, with implications for customers and competitors across Asia,...
Wednesday 5 August 2026
CXMT-SK Hynix LPDDR6 race shifts to yields, customers and capacity

China's CXMT is preparing limited production of LPDDR6 smartphone memory around the end of 2026, narrowing a technology gap with Samsung...

Wednesday 5 August 2026
PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production

Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially...

Wednesday 5 August 2026
Taiwan launches NT$10B fund to back biotech commercialization

Taiwan's National Development Fund Management Committee on the 4th approved a new NT$10 billion (US$308 million) investment program...

Wednesday 5 August 2026
Wistron sees AI demand widening as Taiwan ODMs gain pricing power

AI demand is giving Taiwan's contract manufacturers a rare opening, and Wistron expects the opportunity to broaden in the second half...

Wednesday 5 August 2026
Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging
Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging
Wednesday 5 August 2026
From factories to consumers: Samsung's long retreat from China enters its final chapters

Samsung Electronics' latest move to scale back its smartphone retail network in China marks another milestone in a years-long restructuring...

Wednesday 5 August 2026
South Korea's KRW500B SiC push stalls as low returns deter major companies

South Korea's planned KRW500 billion(US$349,398) research and development initiative for silicon carbide (SiC) power semiconductors...

Wednesday 5 August 2026
From chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era
Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global...
Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
Tuesday 4 August 2026
Nvidia RTX 50 graphics card prices climb as TSMC and memory costs rise
Nvidia GeForce RTX 50 series graphics card prices in South Korea were set to rise by as much as 30% starting in August 2026 as higher wafer costs at Taiwan Semiconductor Manufacturing...
Tuesday 4 August 2026
Samsung Foundry nears full utilization, but 2nm yields remain a hurdle
Samsung Electronics' contract chipmaking business could approach full utilization in the second half of 2026, marking a potential turning point after prolonged underuse weighed on...
Tuesday 4 August 2026
HP, Asus and Acer reportedly turn to CXMT for laptop memory

HP, Asus and Acer have begun using limited quantities of DRAM from China's ChangXin Memory Technologies (CXMT) in selected budget notebooks...