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Tuesday 16 June 2026
TSMC PLP timeline faces skepticism from Taiwan industry sources

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

Tuesday 16 June 2026
Taiwan drones advance to Green UAS certification, accelerate US market push
Taiwan's drone industry is set for a major milestone in the second half of 2026, as the Industrial Technology Research Institute (ITRI) has secured qualification from the Association...
Tuesday 16 June 2026
CATL's Hungary plant set to eclipse Europe's cell production capacity

Contemporary Amperex Technology Ltd. announced it would soon begin production at its new Hungary lithium battery plant, a facility...

Tuesday 16 June 2026
AI chip race sends WF6 prices soaring after Japan supply shock
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used...
Tuesday 16 June 2026
SK Hynix reportedly readies HBM4E samples for Nvidia as Samsung pulls ahead
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market....
Tuesday 16 June 2026
Taiwan marks 500th offshore wind turbine milestone, total capacity hits 4.8GW

Taiwan has reached another milestone in its offshore wind power development, with the Ministry of Economic Affairs (MOEA) announcing...

Tuesday 16 June 2026
Yaskawa eyes physical AI boom with JPY25 billion capex
Yaskawa Electric is betting heavily on physical AI, the field that enables robots to operate autonomously, as it positions itself for a boom in AI robots. Since starting work with...
Tuesday 16 June 2026
Rapidus signs UK chip pact in push for 2nm customers

Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...

Tuesday 16 June 2026
Interview: From language to motion— Japanese startup APTO builds the data backbone for physical AI

Physical AI is emerging as a new frontier of model development. Any model, however, is only as good as the data used to train it. Because...

Monday 15 June 2026
SAP says human-in-the-loop review is key to moving enterprise AI agents from POC to production
SAP reported that enterprise AI agents are shifting from proof of concept to real-world deployment as companies aim to embed generative AI into operational workflows such as finance...
Monday 15 June 2026
Samsung foundry chief sees 2028 profit path as bonus costs mount

Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business...

Monday 15 June 2026
South Korea's chip equipment players ride the HBM4 wave

South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics...

Monday 15 June 2026
Taiwan's IC design sector posts sharpest gains in years; May data hints at further acceleration into 2H26
Taiwan's fabless semiconductor design sector posted its strongest year-over-year growth figures in years as of May 2026, with a cluster of memory-adjacent and storage chip makers leading...
Monday 15 June 2026
China's new EV rules push European luxury PHEVs to the exit

European luxury automakers are pulling back from China's plug-in hybrid vehicle (PHEV) market after Beijing tightened eligibility requirements...

Monday 15 June 2026
Southeast Asia shifts from test-and-pack to multi-center advanced packaging hub

As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient,...