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Tuesday 14 July 2026
TASC reshuffles management as PASC targets 2027 Taiwan Innovation Board listing
Taiwan-Asia Semiconductor (TASC) has announced senior management changes at its group companies as ProAsia Semiconductor (PASC) prepares for a Taiwan Innovation Board listing, now...
Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
Tuesday 14 July 2026
WeLeader Biomedical posts record 1H26 revenue on stronger health screening demand
WeLeader Biomedical reported that June 2026 consolidated revenue reached NT$113 million (US$3.52 million), its second-highest monthly level on record, as Taiwan's health screening...
Tuesday 14 July 2026
Fiber filter maker sees June and first-half revenue rise on tech demand
Taiwan-based filter maker Fusheng International said on July 10 that stronger investment by high-tech customers lifted its June and first-half revenue to their second-highest levels...
Tuesday 14 July 2026
Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan

As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the...

Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

Monday 13 July 2026
Taiwan's auto parts makers pivot to high-tech as AI cooling, chip equipment demand surges

Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced...

Monday 13 July 2026
Chiayi Science Park Phase 2 breaks ground for advanced packaging hub
The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced...
Monday 13 July 2026
Samsung targets 2029 Yongin fab opening as infrastructure timetable tightens
Samsung Electronics plans to begin operations at its first Yongin fab in 2029, one to two years ahead of the original schedule, increasing pressure on South Korea to accelerate the...
Monday 13 July 2026
SK Group chair: US investment plan will far exceed US$35B

SK Group chairman Chey Tae-won said the South Korean conglomerate is preparing a US investment plan that would far exceed US$35 billion—the...

Monday 13 July 2026
Leadsun pursues strategic partnerships as Xiangyin targets top-tier power retail status
Taiwanese renewable energy developer Leadsun Greentech said that as global supply chains continue to move toward net-zero carbon emissions and RE100 commitments, and Taiwan's semiconductor...
Monday 13 July 2026
AI, LEO, and broadband upgrades lift Taiwan networking makers

Taiwan networking equipment makers posted strong results in June 2026, with rising demand for AI data center expansions, high-speed...

Monday 13 July 2026
US chip factory buildout faces possible delays as labor shortage nears 157,000 by 2030

A shortage of skilled workers could slow construction of new US semiconductor plants, raise costs, and limit chip output for global...

Monday 13 July 2026
Exclusive: China's notebook ODMs are closing in fast on Taiwan's manufacturing crown

Notebook ODMs enjoyed stronger-than-seasonal demand in the first half of 2026, but the traditional peak season is losing momentum....

Monday 13 July 2026
Infineon urges TSMC to consider a second Dresden fab as demand outlook evolves

A push by Infineon for TSMC to expand further in Dresden could reshape Europe's role in advanced chipmaking and ripple through the...