Japan's power semiconductor sector is moving toward consolidation, with Rohm, Toshiba, and Mitsubishi Electric entering negotiations to integrate their power chip businesses, according to Yomiuri Shimbun and Nikkei. The talks target scale in electric vehicles, AI data centers, and power infrastructure, where demand for power control semiconductors is rising
SEMICON China 2026 spotlighted the scale of the AI investment boom, with Handel Jones, CEO of International Business Strategies (IBS), estimating that global AI and data center capital expenditure has surged from about US$110 billion in 2020 to roughly US$600 billion in 2026
Samsung Electronics' next-generation high-bandwidth memory (HBM4) program is entering a customer validation phase, according to NewDaily, as major technology firms reportedly begin on-site audits of its production lines
OmniVision Group said on March 20 it will invest CNY1 billion (US$145 million) in Rong Semiconductor (Ningbo) Co. (RongSemi) via a capital increase, taking a 5.88% stake based on a CNY4 billion funding round. The move targets tighter upstream integration, aiming to secure wafer capacity and improve supply chain resilience
Nexchip reported 2025 revenue of CNY10.89 billion (approx. US$1.58 billion), up 17.69% year-over-year, with net profit rising 32.16% to CNY704 million and earnings per share increasing 33.33% to CNY0.36. Growth was driven by higher shipment volumes, expanding revenue scale, and gains from the transfer of photomask-related technologies
SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial projections as it advances its next-generation roadmap amid evolving market conditions
