
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports
Chinese OLED panel maker Visionox is accelerating the commercialization of its proprietary Visionox intelligent Pixelization (ViP) technology even as utilization rates at China's flexible OLED fabs continue to decline amid weaker smartphone demand and lingering inventory pressure
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure
Samsung Electronics is set to hold its semiannual global strategy meeting from June 16 to 18, with executives expected to review a split operating environment: strong memory demand is supporting the chip business, while higher component costs are putting pressure on smartphones, PCs, and other consumer devices
SK Hynix is reviewing rare price increase requests from several tier-one equipment suppliers, a sign that the high-bandwidth memory boom is beginning to reshape pricing power in South Korea's semiconductor equipment supply chain
During a panel discussion between executives and research experts from Bosch, Infineon, Rohm Semiconductor, Nexperia, Wolfspeed, and Omdia at PCIM Europe 2026, one reality was made clear: frictionless, globalized chip manufacturing is ending. While the conversation reflected industry enthusiasm for new applications such as AI servers and industrial motor drives, it was tempered by macroeconomic realities of international trade protectionism, regional resilience mandates, and aggressive tariffs
Nvidia has begun telling Chinese clients that its new Vera central processing unit (CPU) could be available as soon as August and that they can start placing orders, Reuters reported, citing three people familiar with the matter
A strike by South Korea's ready-mix concrete transport union is disrupting major semiconductor construction sites and raising concerns about wider industrial spillovers. If the stoppage continues, delays could spread beyond building projects and affect production schedules that matter to global technology supply chains and investors
SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead with a broader capacity buildout and moving toward a US listing as early as August
