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Thursday 1 October 2026
Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion
China's rapid expansion of AI applications is driving a fresh wave of data center construction. SemiAnalysis estimates that the country has already delivered more than 24GW of data center capacity and will remain above that level by the end of 2026, making China the world's second-largest data center market after the US.
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Thursday 1 October 2026
Taiwan aligns green certifications with Japan and EPEAT to speed electronics market entry
Taiwan is moving to align its Green Mark ecolabel with international certification systems in an effort to reduce green trade barriers and shorten time to market for electronics products.
Thursday 1 October 2026
China ramps up Micro OLED capacity ahead of proven smart glasses demand
As smart glasses draw growing market attention, Chinese suppliers including BOE, SeeYA Technology and Sidtek are expanding Micro OLED production. Display industry sources caution, however, that demand for the panels remains uncertain and that capacity coming online ahead of proven demand could leave the market oversupplied.
Thursday 1 October 2026
Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity
Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction is intended to establish a new core production hub dedicated to high-end semiconductor packaging, addressing surging global demand for AI accelerators and data center applications.
Thursday 1 October 2026
DB HiTek raises foundry prices by up to 30% as Chinese demand strains 200mm capacity
DB HiTek has raised foundry prices by as much as 30%, with Chinese customers facing the steepest increases as rising orders push the South Korean foundry's 8-inch capacity close to full utilization, according to The Elec.
Thursday 1 October 2026
Ascend now ahead of Nvidia in China, with domestic supply driving AI chip substitution, says Huawei chairman
Huawei rotating chairman Eric Xu said the company's Ascend AI accelerators have surpassed Nvidia in both sales and market share in China, highlighting how US export controls on advanced AI chips are accelerating the shift of China's data center and AI industries toward domestic suppliers.
Thursday 1 October 2026
China's 'BEST' fusion reactor enters the engineering endgame
China's next-generation fusion programme has entered a new engineering phase with the formal opening of the campus for the Burning Plasma Experimental Superconducting Tokamak (BEST) and the start of critical main-device assembly in Hefei, Anhui.
Thursday 1 October 2026
China's share of global solar module demand falls below 40% as Europe, India gain ground
The global solar module market is undergoing a significant geographic shift in 2026. China remains the world's largest source of module demand, but its share of global shipments is set to fall below 40%, down 12 percentage points year-over-year, while Europe and India continue to gain ground.
Thursday 1 October 2026
China's chip-tool localization accelerates: ACM Research backlog jumps 88%
ACM Research (Shanghai)'s order backlog has surged alongside China's semiconductor equipment expansion, giving the Shanghai-listed chip-tool maker a larger base of future deliveries while AI-related capacity investment and localization continue to support demand.
Thursday 1 October 2026
Samsung raises Galaxy S26 prices in South Korea seven months after launch
Under pressure from rising memory prices, Samsung Electronics has raised the South Korean launch prices of its Galaxy S26 series about seven months after release. Most models went up by KRW149,600(US$110), while the top-end Galaxy S26 Ultra 1TB rose to KRW2.8215 million.
Thursday 1 October 2026
Huawei makes Mate 90 showcase for its Tau chip strategy
Huawei unveiled its Mate 90 smartphone series on October 1, with Richard Yu, Huawei executive director and chairman of the Consumer BG, introducing the new devices alongside a new generation of in-house chips and imaging hardware. Every model in the Mate 90 lineup, from the standard version to the flagship tier, uses Huawei's latest self-developed Tau (τ) chip platform.
Thursday 1 October 2026
BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced packaging.
Thursday 1 October 2026
Samsung AI Forum 2026 puts agentic AI at center of transformation across devices, robotics, and chipmaking
Samsung Electronics brought global AI experts and researchers together in Seoul on September 30 for the Samsung AI Forum 2026, exploring how agentic AI and physical AI can deliver measurable business value across enterprise workflows, device-side applications, and semiconductor design and manufacturing.
Thursday 1 October 2026
OpenAI claims to thwart model distillation attack tied to Moonshot
OpenAI said it detected and blocked an organized adversarial distillation attack, with some activity linked to Chinese AI startup Moonshot AI. The company said it first spotted the effort on July 1 and saw a peak on July 24 and 25, when it detected about 16,000 related requests from more than 4,000 users.
Thursday 1 October 2026
Qualcomm, Samsung redesign chip packaging as heat limits phone performance
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling capacity of mobile devices.
Thursday 1 October 2026
China Rare Earth Group moves downstream, linking rare-earth magnets to robot direct-drive systems
China Rare Earth Innovation Technology and Beijing-based Direct Drive Tech signed a strategic cooperation agreement on September 29 to jointly develop high-performance magnetic materials for direct-drive motors, including neodymium-iron-boron magnets, flux-concentrating rings, and radially oriented magnetic rings, linking upstream rare-earth resources with robot drive modules.