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Thursday 8 October 2026
27 Samsung, SK Hynix veterans joined China's CXMT, study shows
An investigation by a South Korean lawmaker's office revealed that former Samsung Electronics and SK Hynix personnel who transitioned to Chinese DRAM maker ChangXin Memory Technologies (CXMT) spanned key stages of semiconductor development and mass production, including circuit design, process integration, and defect analysis...
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Saturday 10 October 2026
Unified memory lifts AI PC ambitions as Chinese open models gain local-inference ground
The hardware boundary separating cloud-scale AI from local inference is becoming increasingly porous as PC vendors expand memory capacity and software platforms make larger open-weight models easier to run directly on devices.
Saturday 10 October 2026
Semco moves glass substrates to package-level testing
Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking progress toward commercializing next-generation packaging technology as AI accelerators grow larger and more complex. The development comes as the company expands its existing semiconductor substrate business while facing uncertainty over the commercialization timeline for glass substrates.
Saturday 10 October 2026
SK Hynix sends memory chips into orbit for testing
SK Hynix's dynamic random-access memory (DRAM) and Universal Flash Storage (UFS) products have reached orbit aboard a South Korean satellite that successfully established communication with the ground following the country's fifth Nuri rocket launch. The mission opens the way for in-orbit reliability testing as the memory maker explores potential opportunities in the space electronics market. No in-orbit test results for SK Hynix's memory products have been announced.
Saturday 10 October 2026
China's GW satellite network clears dual-polar test, signaling broader push toward sovereign LEO communications
China's state-backed Guowang (GW) low-Earth-orbit (LEO) satellite network has completed its first communications test during the country's 16th Arctic expedition, enabling a live video call linking vessels in the Arctic with Qinling Station in Antarctica with reported latency under one second.
Friday 9 October 2026
Samsung HBM4E wins NVIDIA nod for AI accelerator push
Samsung Electronics' next-generation 12-layer HBM4E product, a type of high-bandwidth memory (HBM), has reportedly cleared customer quality validation from Nvidia and major hyperscale data center operators. If confirmed, the result would strengthen Samsung's bid to supply memory for next-gen AI accelerators, though order timing and mass production plans remain unclear.
Thursday 8 October 2026
LG to test five commercial components in space aboard South Korea's fifth Nuri launch
LG Group is preparing to test five commercial components developed by LG Electronics, LG Innotek, and LG Energy Solution (LGES), including cameras and batteries, aboard a CubeSat carried as a secondary payload on South Korea's fifth Nuri rocket launch. The mission aims to assess whether commercially available components can operate reliably in space.
Thursday 8 October 2026
AI PCs face memory squeeze as server demand takes priority
Microsoft's October 7 opening of pre-orders for Surface Laptop Ultra, featuring up to 128GB of unified memory, highlights a potential new source of dynamic random-access memory (DRAM) demand as PC makers bring larger AI models and autonomous agents onto local devices. But the opportunity comes as PC shipments decline and memory manufacturers prioritize server customers, raising questions about whether high-capacity PCs can secure enough supply to become a meaningful growth market.
Thursday 8 October 2026
China pushes six-network buildout as AI strains power links
China is accelerating construction of its so-called "six networks" — water, a new power grid, computing, next-generation communications, urban underground pipelines, and logistics — as data centers driven by AI and the digital economy create new demand for electricity and infrastructure. The latest push is turning coordination between computing, power, and telecommunications into a new policy challenge.
Thursday 8 October 2026
Samsung to exit in-house automotive AP, focus on high-margin chips
Samsung Electronics' System LSI division is reportedly planning a retreat from the automotive application processor (AP) business and launching a major restructuring, with a future focus on high-margin areas such as image sensors and mobile system-on-chip (SoC) products. Analysts say Samsung is seeking to improve profitability in its non-memory businesses through a selection and concentration strategy after years of losses at System LSI and its foundry operations.
Thursday 8 October 2026
Witchbox eyes Taiwan channels, hospitals for AI posture platform
South Korean health tech company Witchbox is extending AI posture analysis into gym operations management, using its iPosture Pro platform to integrate body assessments, workout programs, and member tracking as competition in the category intensifies. The company has already built a Pilates education partnership base in Taiwan and now wants to work with local channels and hospitals to expand brand visibility and use cases.
Wednesday 7 October 2026
Commentary: Qualcomm patent deal puts spotlight on Huawei's broader IP push
Huawei and Qualcomm announced on Oct. 5 that they had signed a multi-year patent licensing agreement covering technologies including 5G, computing, AI and networking.
Wednesday 7 October 2026
AMD expands Korea push after Taiwan supply talks
AMD CEO Lisa Su moved from supply-chain talks in Taiwan to South Korea this week, broadening the chipmaker's Asia push from efforts to secure more CPU, GPU and advanced-wafer capacity to building an open computing ecosystem around its processors, Korean AI accelerators and software.
Wednesday 7 October 2026
Towa returns strategic chip packaging production to Japan as AI demand accelerates
Towa plans to build a new factory in Kyoto Prefecture to produce assembly and packaging equipment for advanced semiconductors used in artificial intelligence applications.
Wednesday 7 October 2026
Z.ai takes GLM-5.3 global through Amazon Bedrock's enterprise channel
Chinese AI company Z.ai is expanding its overseas commercialisation through Amazon Bedrock, with AWS adding GLM-5.3 on October 6 and sharing revenue with Z.ai based on model usage.
Wednesday 7 October 2026
Starship reaches orbit on 14th test as Chinese rocket makers race toward low-cost reusability
SpaceX's Starship reached Earth orbit for the first time on its 14th test flight and deployed 26 next-generation Starlink V3 satellites. Whereas the previous 13 flights primarily focused on orbital testing, Flight 14 marked a further step into operational orbital missions.