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Friday 12 June 2026
Samsung's packaging gap clouds chip comeback as TSMC, Intel push ahead

Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports

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Monday 15 June 2026
Visionox pushes ViP OLED commercialization as China's flexible OLED utilization slumps

Chinese OLED panel maker Visionox is accelerating the commercialization of its proprietary Visionox intelligent Pixelization (ViP) technology even as utilization rates at China's flexible OLED fabs continue to decline amid weaker smartphone demand and lingering inventory pressure

Monday 15 June 2026
Samsung's Exynos 2600 doubles on-device AI performance in MLPerf benchmarks
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and image-generation workloads
Monday 15 June 2026
SK Hynix readies HBM4 packaging push as Nvidia demand grows

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure

Monday 15 June 2026
LG Energy Solution secures patent licensing deal with Sunwoda, ending two-year dispute
LG Energy Solution (LGES) reached a patent licensing agreement with Chinese battery maker Sunwoda, ending a two-year legal battle that had involved courts in Germany, China, and South Korea, the firms announced. The settlement, disclosed through a joint statement handled by patent manager Tulip Innovation, did not include financial or royalty terms
Monday 15 June 2026
X app age rating raised to 19+ on South Korean Google Play Store after Grok's adult-content policy change
On South Korea's Google Play store, the X app (formerly Twitter) was reclassified to "19 and up" after the social platform updated its community guidelines to permit consensual adult content and embedded the Grok AI model. The change was reported on June 3, and the reclassification added warnings including "not allowed for teenagers" and "extreme violence," according to Chosun Biz
Sunday 14 June 2026
Taiwan's Eris expects order surge after sanctions on Chinese competitor
The global power semiconductor supply chain is undergoing another reshuffling, after Chinese chipmaker Nexperia triggered disruptions in 2025 and, more recently, China's Yangjie Technology was added to the European Union sanctions list
Saturday 13 June 2026
Samsung to review strategy as memory boom pressures devices

Samsung Electronics is set to hold its semiannual global strategy meeting from June 16 to 18, with executives expected to review a split operating environment: strong memory demand is supporting the chip business, while higher component costs are putting pressure on smartphones, PCs, and other consumer devices

Saturday 13 June 2026
SK Hynix weighs supplier price hikes as HBM boom lifts equipment makers

SK Hynix is reviewing rare price increase requests from several tier-one equipment suppliers, a sign that the high-bandwidth memory boom is beginning to reshape pricing power in South Korea's semiconductor equipment supply chain

Saturday 13 June 2026
DeepSeek hiring points to AI infrastructure ambitions beyond rented compute
DeepSeek's hiring activity is drawing almost as much attention as its model releases, with roles for internet data center (IDC) design and planning engineers, senior data center operations engineers and senior delivery managers appearing on major Chinese recruitment platforms
Saturday 13 June 2026
PCIM 2026: Why Western carmakers cannot have 'China-free' SiC at subsidized prices

During a panel discussion between executives and research experts from Bosch, Infineon, Rohm Semiconductor, Nexperia, Wolfspeed, and Omdia at PCIM Europe 2026, one reality was made clear: frictionless, globalized chip manufacturing is ending. While the conversation reflected industry enthusiasm for new applications such as AI servers and industrial motor drives, it was tempered by macroeconomic realities of international trade protectionism, regional resilience mandates, and aggressive tariffs

Saturday 13 June 2026
Nvidia turns to Vera CPU in China as H200 sales stall

Nvidia has begun telling Chinese clients that its new Vera central processing unit (CPU) could be available as soon as August and that they can start placing orders, Reuters reported, citing three people familiar with the matter

Friday 12 June 2026
South Korea concrete strike clouds chip supply: Samsung, SK Hynix fabs construction reportedly stalls

A strike by South Korea's ready-mix concrete transport union is disrupting major semiconductor construction sites and raising concerns about wider industrial spillovers. If the stoppage continues, delays could spread beyond building projects and affect production schedules that matter to global technology supply chains and investors

Friday 12 June 2026
Aver South Korea push signals a broader bid for direct sales, local service, and higher-end AV demand
Global video solutions provider Aver is accelerating its expansion in South Korea, planning to formally establish a local subsidiary in June 2026 to meet rising demand from companies and educational institutions. The move could strengthen its access to corporate collaboration, professional AV, and hybrid learning markets
Friday 12 June 2026
SK Hynix readies 375-layer NAND as US listing plan advances

SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead with a broader capacity buildout and moving toward a US listing as early as August

Friday 12 June 2026
Chinese chip foundry United Nova bets US$3B on AI power, optical interconnects
United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch mixed-signal fab project