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Wednesday 23 September 2026
US, China diverge on AI guardrails ahead of Trump-Xi summit
The US and China are moving toward different models for governing increasingly capable artificial intelligence, even as the US proposes a limited safety mechanism with China ahead of President Donald Trump and Chinese President Xi Jinping's September 24 summit in Washington. AI is expected to be among the issues discussed at the meeting.
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Wednesday 23 September 2026
SKC raises Absolics stake to 82% as glass substrates remain in testing
SKC is increasing its investment in its US glass substrate subsidiary Absolics, raising its stake to more than 82%, as the South Korean materials group commits more capital to a business that remains in customer evaluation and testing ahead of volume production.
Wednesday 23 September 2026
With Xi's Washington visit incoming, trade data show how the tariff war has reshaped US-China tech flows

When Chinese President Xi Jinping meets US President Donald Trump at the White House on September 24, trade will be the most measurable front of their rivalry. Since the first Section 301 tariffs took effect in July 2018, US imports of Chinese technology hardware have fallen sharply. Rare earth magnets are the exception: Washington cannot easily replace them, which gives Beijing leverage as the one-year Busan truce nears its November 10 expiry.

Wednesday 23 September 2026
YMTC wins German injunctions against Micron in latest round of NAND patent battle
Micron is facing fresh pressure on multiple fronts after Germany's Munich I Regional Court sided with Chinese memory maker YMTC and issued two injunctions over alleged infringement. Industry sources said enforcement of the injunctions could restrict Micron's supply in Germany and reshape the European automotive and industrial-control NAND market.
Wednesday 23 September 2026
Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration

Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging and testing project, expanding 2.5D integration and compute-memory co-packaging capacity as AI and high-performance computing lift demand for advanced packaging.

Wednesday 23 September 2026
Hygon takes China's CPU ambitions beyond servers, into physical AI

China's Hygon Information Technology is extending its processor ambitions beyond servers and data centers with the launch of its first embedded industrial CPU family, targeting robotics, machine vision, smart manufacturing, and other edge AI workloads.

Wednesday 23 September 2026
China Steel expands recycled steel into EV motor market amid growing low-carbon demand

Taiwan's largest steelmaker China Steel (CSC) is actively expanding its high-recycled-content steel products, as the global automotive industry accelerates its transition toward net-zero emissions and electrification, boosting demand for low-carbon materials worldwide. The move allows the company to move beyond general industrial applications into automotive sheet metal, electric vehicle (EV) motors, high-strength fasteners, and vehicle body structures.

Wednesday 23 September 2026
Nexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset

Nexperia China is accelerating production on its domestic 12-inch wafer platform as it rebuilds a locally controlled semiconductor supply chain spanning design, wafer production, packaging, and testing.

Wednesday 23 September 2026
Sharp reportedly to develop universal satellite antenna for multi-network connectivity

Sharp is developing a compact satellite communications antenna capable of connecting to multiple satellite networks, aiming to commercialize terminals around 2030 for applications including defense, autonomous driving, and remote operation of construction machinery, according to Nikkei Asia.

Wednesday 23 September 2026
Li Auto opens Mach chips, SiC modules to external customers

Li Auto's move to open its in-house technologies to outside customers marks a broader shift in the electric vehicle maker's strategy, turning years of internal research into a possible new revenue stream. The company is now seeking external buyers for its Mach intelligent-driving chip, silicon carbide (SiC) power modules, and range-extender system, according to Chinese media reports.

Wednesday 23 September 2026
Commentary: Zhengfei Ren rumors expose a deeper chill across China's tech sector

Online rumors that Huawei founder Zhengfei Ren and his family had disappeared from public view have reignited concern over the fate of Chinese technology executives. Ren's younger daughter, Annabel Yao, appeared at a Beijing press conference on September 14, but China's new exit-and-entry rules took effect the next day, drawing fresh attention to executives who have fled, vanished, or faced restrictions.

Wednesday 23 September 2026
US energy storage faces a costly China battery exit
The US is accelerating its shift toward domestic battery manufacturing as the energy storage market expands, but the market's current growth still depends heavily on low-cost Chinese cells.
Wednesday 23 September 2026
Seven Chinese AI companies hit US$10.7 billion ARR, but the harder race is paying for scale

China's leading AI developers are scaling revenue rapidly, but the gap with their US rivals remains substantial — and the cost of keeping pace is rising even faster. Rhodium Group estimates that seven major Chinese AI companies had combined annualized recurring revenue (ARR) of about US$10.7 billion, based on estimates dated between March and August 2026, roughly one-tenth of the more than US$100 billion attributed to OpenAI and Anthropic combined.

Wednesday 23 September 2026
Ascend 950 clears higher security bar in China's latest chip assessment: who else qualified?
China has tightened the security and reliability framework around its domestic computing stack, with the latest official evaluation placing Huawei's Ascend 950 at Level II and Kunlunxin's M100 at Level I among AI training and inference chips. The same assessment also gave the highest Level III rating to several general-purpose CPUs, including Loongson and HiSilicon Kunpeng products, signalling that certification is becoming a more structured gatekeeper for China's locally developed compute infrastructure.
Tuesday 22 September 2026
Vivo unveils X500 strategy to bolster premium phone push

Vivo unveiled its new X500 series imaging flagship phones in Shanghai on September 21, 2026, aiming to build a stronger moat in mobile imaging and break through more aggressively in the premium smartphone market. As rising memory prices force handset makers to lift retail prices, IDC expects worldwide smartphone shipments to fall 16.7% in 2026 to just over 1 billion units.

Tuesday 22 September 2026
China prepares business delegation as Xi seeks steadier US trade ties

China is preparing a business delegation for President Xi Jinping's Washington visit as Beijing pursues more predictable trade relations and opportunities for companies facing US market-access barriers. The preparations combine official economic talks with a proposed corporate entourage, although the sources reviewed have not publicly confirmed the individual executives attending.