China is accelerating its push into fourth-generation semiconductors, with the country's first fully integrated industrial project for ultra-wide-bandgap semiconductor materials set to be built in Zhengzhou. The project aims to strengthen domestic capabilities in diamond-based semiconductor materials for AI chips, advanced communications and electric vehicles, while expanding China's presence beyond silicon carbide (SiC) and gallium nitride (GaN).
South Korea is pushing to establish a second national semiconductor production base in its southwestern Honam region, with Samsung Electronics and SK Hynix planning to each build two new large-scale chip fabrication sites as part of a KRW800 trillion (approx. US$517.87 billion) national chip ecosystem project, according to Chosun.
DRAM and NAND Flash supplies are tightening as global AI data centers continue to expand. Apple is actively lobbying the Trump administration to allow it to buy DRAM from Chinese memory maker CXMT, underscoring the cost, supply, and geopolitical pressures bearing down on the global technology supply chain.
China has imposed new export control measures on 40 Japanese entities, placing 20 organizations on its export control list and another 20 on a separate watchlist, citing national security concerns and the need to strengthen oversight of exports of dual-use items.
Generative AI is driving a sharp rise in electricity demand from data centers and AI computing infrastructure, prompting China to release its 15th Five-Year Plan for the Construction of a New Energy System (2026–2030). The plan incorporates AI power demand into China's national energy strategy for the first time, calling for closer coordination between electricity supply and computing capacity to support AI, advanced manufacturing, and other strategic industries.
Samsung Electronics is slowing its investment schedule for 1d DRAM, the seventh-generation 10nm-class DRAM node, as a sharp surge in memory prices makes it more profitable to squeeze output from existing production lines than to rush costly next-generation processes to market, The Bell reported on June 23.
