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Tuesday 15 September 2026
Swiss drone maker shifts production to Taiwan
Shinkong Synthetic Fibers Corporation (SSFC) is working with Swiss drone company Jedsy through its investment in Earthbook, bringing in a medical logistics service that has won approval from Taiwan's Civil Aviation Administration and the Ministry of Health and Welfare...
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Tuesday 15 September 2026
Tesla's rare-earth-free Cybercab challenges China's grip on EV magnets
With Tesla's EV ambitions growing amid a years-long push toward full electrification, the deployment of the Cybercab has emerged as a major experiment testing the boundaries of autonomous driving.
Tuesday 15 September 2026
Apple's foldable debut set to further widen Samsung Display's OLED lead
Samsung Display could emerge as one of the biggest supply-chain beneficiaries of Apple's entry into foldable smartphones, as the Korean panel maker already accounts for about two-thirds of global foldable smartphone panel shipments, with Apple set to become a major new source of demand.
Tuesday 15 September 2026
Murata considers bigger MLCC expansion as AI server demand extends beyond 2028

Murata Manufacturing is considering a new, potentially larger expansion of multilayer ceramic capacitor (MLCC) capacity beyond its existing investment plans, as demand from AI servers is expected to remain strong through the end of the decade.

Tuesday 15 September 2026
AI servers are eating MLCC capacity, and Chinese suppliers are taking what's left

AI servers are reshaping the global multilayer ceramic capacitor (MLCC) market. Murata Manufacturing and Samsung Electro-Mechanics (SEMCO) are steering limited capacity toward high-value server components, tightening conventional supply, lifting prices, and creating an opening for Chinese suppliers in PCs.

Tuesday 15 September 2026
China's Guoxin Micro buys its way into power-chip manufacturing

Unigroup Guoxin Microelectronics plans to acquire WeEn Semiconductors for CNY1.9 billion (≈ US$283 million), giving the Chinese specialty IC supplier in-house wafer manufacturing and a faster route into power semiconductors.

Tuesday 15 September 2026
South Korea updates AI safeguards as Microsoft sets shutdown rules

South Korea is updating its artificial intelligence security guidance as companies deploy AI agents capable of operating with limited human supervision, while Microsoft is proposing model-level rules requiring its systems to remain subject to human interruption and shutdown.

Tuesday 15 September 2026
BYD's 2027 triple play could rewrite the EV race

BYD is lining up solid-state batteries, faster charging, and higher-level automated driving around 2027, potentially removing several of the remaining barriers separating electric vehicles from gasoline cars.

Tuesday 15 September 2026
Beyond H100: China's GPU makers chase scale, not just parity

China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must now combine competitive chips with interconnects, software stacks, and clusters capable of training increasingly large AI models.

Tuesday 15 September 2026
DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting
DIGITIMES Intelligence forecasts the global semiconductor market will expand from US$791.7 billion in 2025 to US$1.6 trillion in 2026, representing year-on-year growth of 109.1%.
Tuesday 15 September 2026
Minebea Mitsumi pauses M&A to chase AI hardware demand
Minebea Mitsumi has halted its push for new acquisitions and is shifting resources toward producing ball bearings, motors and actuators for AI hardware, as demand tied to data centers, humanoid robots and Nvidia components accelerates.
Tuesday 15 September 2026
China elevates HBM and HBF in five-year plan, opening a new front in AI memory
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have jointly released the 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry. For the first time, the plan identifies high-bandwidth flash memory and high-bandwidth memory as priority areas for next-generation memory research.
Tuesday 15 September 2026
Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile application processor (AP), and repurposing the equipment for high-bandwidth memory (HBM) production.
Tuesday 15 September 2026
BIS blocks Polestar authorization, forcing new vehicles out of US market from 2027

Polestar, the Swedish electric vehicle (EV) brand backed by Geely Holding, is facing a major restructuring of its US operations. In its first-half 2026 financial report filed with the US Securities and Exchange Commission (SEC) on September 3, Polestar said the US Department of Commerce's Bureau of Industry and Security (BIS) had denied its application for specific authorization under US connected vehicle regulations.

Tuesday 15 September 2026
Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028

Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different cell structures as conventional scaling becomes increasingly difficult.

Tuesday 15 September 2026
China's EV boom enters a phase of overcapacity cleanup
Within a relatively short span of time, China has built a formidable EV industry that has proved difficult for any other country to match globally, nurtured by years of industrial policy, infrastructure investment and government support.