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Wednesday 1 April 2026
Huawei revenue hits US$122bn in 2025, nears peak as AI growth becomes key test

Huawei reported 2025 revenue of CNY880.9 billion, up 2.2% year-over-year, its second-highest on record, with net profit rising 8.63% to CNY68 billion (approx. US$9.87 billion). Growth slowed sharply from 22.4% in 2024, leaving revenue just below its 2020 peak of CNY891.4 billion and raising the bar for further expansion, analysts cited by Chinastarmarket.cn said

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Thursday 2 April 2026
South Korea reportedly advances GaAs localization with 95% yield on 4-inch process
South Korea is moving closer to localizing high-performance compound semiconductor components long reliant on imports after achieving a key manufacturing milestone, according to ET News
Thursday 2 April 2026
South Korea exports hit record US$86bn, chip demand drives breakout above US$80bn
South Korea's exports climbed to a record US$86.1 billion in March 2026, marking the first time monthly shipments have exceeded the US$80 billion threshold, even as the Middle East conflict disrupted logistics and energy flows. According to the Ministry of Trade, Industry and Energy (MOTIE), the figure was up 48.3% year on year, extending a 10-month run of record monthly exports and lifting the country's trade surplus to US$25.7 billion — its 14th straight month in the black
Thursday 2 April 2026
Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance
Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo, which holds a 90% market share. Meanwhile, Nippon Electric Glass (NEG) also plans to invest in AI-specific fiberglass cloth, signaling accelerated competition among Japanese materials makers for semiconductor opportunities
Thursday 2 April 2026
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory (HBM), as the two memory makers move to secure key packaging technologies for AI-driven demand, according to The Elec

Thursday 2 April 2026
TSMC's US expansion held ransom as JASM takes flight
TSMC is winning quietly in Japan and losing loudly in Washington — and the reason may have nothing to do with chips
Thursday 2 April 2026
South Korea's market volatility hands Taiwan a rare edge in AI
During a lecture hosted by the Chinese National Association of Industry and Commerce (CNAIC), DIGITIMES Chairman Colley Hwang analyzed the East Asian industrial landscape. While headlines often focus on the chip wars between the US and China, Hwang shed light on a quieter, more structural divergence: the widening "resilience gap" between Taiwan and South Korea, as manifested through the lens of currency
Thursday 2 April 2026
Chinese companies capture nearly 41% of domestic AI accelerator server market
China's AI accelerator server market is gradually shifting away from using Nvidia chips to domestic GPU and AI chip makers, with Chinese companies capturing almost 41% of the market last year, according to an IDC report
Thursday 2 April 2026
Opportunity in DeepSeek's turbulence: Z.ai sets sight on 'Chinese Anthropic' with API, token strategy

In late March 2026, a series of developments converged to reshape sentiment in the large model sector. Anthropic faced a major source code leak of Claude Code due to an engineer error. At nearly the same time, Chinese large model firm Z.ai released its first annual report since listing, with CEO Zhang Peng explicitly naming Anthropic as the company's benchmark; meanwhile, rising contender DeepSeek experienced three consecutive days of service disruptions from March 29 to 31, affecting both web and API access

Thursday 2 April 2026
Deep dive: Huawei 2025 annual report reveals why its AI strategy starts with infrastructure

As the global AI race accelerates, Huawei's 2025 annual report leaves little ambiguity: AI now sits at the core of its strategy. The 147-page filing references "AI" 421 times, an unusually explicit signal of strategic depth. The company is pursuing a "foundation first, expansion later" model, pairing heavy R&D with infrastructure buildout to scale its AI position

Thursday 2 April 2026
Denso targets US$54 billion revenue, Rohm deal faces Toshiba-Mitsubishi alliance hurdle
Japan's auto parts supplier Denso on March 31 unveiled a mid-term business plan through March 2031, targeting revenue of JPY8 trillion (approx. US$54 billion) and a return on equity (ROE) of 11%. The strategy underscores a shift toward semiconductors as a core growth driver, alongside vehicle electrification and intelligent systems, signaling ambitions beyond its traditional role as an automotive supplier
Thursday 2 April 2026
Kioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026
Japan-based NAND flash maker Kioxia has formally issued an end-of-life (EOL) notice for a wide range of legacy NAND products, underscoring an industry-wide shift toward advanced 3D architectures and tighter capacity allocation
Thursday 2 April 2026
China plans display sector consolidation; panel prices seen stabilizing, equipment orders at risk
China is reportedly drafting a consolidation plan for its display industry, with BOE Technology positioned for small- and mid-sized OLED and TCL China Star (CSOT) for large-size LCD, while smaller panel makers face potential mergers or exits
Wednesday 1 April 2026
Samsung auctions 123 chip tools during Xi'an NAND upgrade to V8
Samsung Electronics is reportedly overhauling its production lines, offering 123 idle semiconductor tools for sale across South Korea and Xi'an as it shifts to more advanced process technologies
Wednesday 1 April 2026
Fujitsu plans 1.4nm AI chip Japan-based production with Rapidus
Fujitsu plans to develop a 1.4nm artificial intelligence (AI) chip and outsource its production to Rapidus in Japan, according to Nikkei. The chip is designed for use in servers and related systems, with a focus on low power consumption and domestic manufacturing
Wednesday 1 April 2026
Sharp names Kawamura as CEO, shifts to growth after restructuring

Sharp has named Tetsuji Kawamura as its president and chief executive officer, effective April 1, marking a shift from restructuring to growth as the company looks to expand its global brand alongside parent Foxconn Technology Group