China unveiled two major AI initiatives at the 2026 World AI Conference (WAIC) in Shanghai, highlighting efforts to standardize AI agent collaboration while laying the groundwork for space-based computing infrastructure.

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing network following its A-share subscription on July 16. The moves have placed its capacity expansion and next-generation memory roadmap under closer scrutiny from the industry.

Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers seek purchase guarantees, advance payments or direct procurement by end customers before allocating capacity.