2018 review and 2019 outlook: Heterogeneous chips integration spurs demand for system-3D backend solutions

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia 0

Heterogeneous integration of diverse semiconductor components to support 5G, AI, automotive electronics, and IoT applications is gaining significant momentum, driving demand for SiP and So3D (system on 3D package) processes and boosting the importance...

The article requires paid subscription. Subscribe Now