Bits + chips
PTI remains focused on FOPLP for advanced logic ICs
Julian Ho, Taipei; Jessie Shen, DIGITIMES

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out panel level packaging (FOPLP) in the era of 3D-chip stacking and other...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.