Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys,...

Advanced semiconductor manufacturing is progressing toward 2nm and angstrom-era nodes (Å; where 1 nm equals 10 Å), bringing high-numerical-aperture extreme ultraviolet...

As the global smartphone system-on-chip (SoC) market contracts, competition in the high-end application processor (AP) segment is intensifying. MediaTek is accelerating its push into...

This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...

GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...

TSMC reported consolidated revenue of about NT$511.86 billion (approx. US$16.1 billion) for September 2026. That was up 54.6% from NT$330.98 billion a year earlier and down 0.6% from...

Elon Musk has moved to quell uncertainty over Intel's position in the Terafab chip project, stressing that his companies will build and operate the planned semiconductor complex themselves...

Intel will keep working with Elon Musk on Terafab, according to Bloomberg. Intel CEO Lip-Bu Tan stated that the company will stay involved in Musk's plan to make cutting-edge...

Taiwanese integrated circuit (IC) design firms report that passing on costs to customers will likely continue through 2027 as upstream foundry and outsourced semiconductor assembly...

TSMC will hold its third-quarter earnings call on October 15 this year.

TSMC has not officially announced anything, but Taiwan's semiconductor facility engineering supply chain is already rushing to Texas after reports that the company is discussing a...

AMD CEO Lisa Su said the company plans to further increase investment in Taiwan's semiconductor supply chain as demand for CPUs, GPUs, and AI computing continues to outpace available...

The direction of global corporate investment in physical assets is becoming clearer. According to the fDi Report 2026 and an analysis by Visual Capitalist, announced greenfield...

Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management ch...

Da Yi Cheng Technology (DYC) has rapidly expanded in recent years, benefiting from the global semiconductor capacity expansion wave, which has driven demand for second-phase electrical...