TSMC updates

Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.

IN THE NEWS

Wednesday 12 August 2026

DB HiTek profit jumps 43% as TSMC, Samsung scale back 8-inch capacity

DB HiTek posted a 43% jump in second-quarter operating profit as tighter 8-inch foundry supply and stronger power semiconductor demand kept its fabs running near full capacity, with...

Wednesday 12 August 2026

OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Wednesday 12 August 2026

Apple's shadow looms over TSMC's Sony sensor deal

TSMC's board formalized its image-sensor tie-up with Sony on Tuesday as part of a broader capacity mandate that underscores how much...

Wednesday 12 August 2026

TSMC-Sony's US$4.69B sensor venture is a defensive play against Samsung and China

TSMC and Sony Group are betting that closer integration, not just closer proximity, is what it will take to keep their combined lead...

Wednesday 12 August 2026

OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year

AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...

Wednesday 12 August 2026

Panel makers turn to AI packaging as old fabs gain value

Taiwanese panel makers broadly reported weaker July revenue as some customers pulled in shipments in advance in the first half of the year and memory price increases weighed on consumer...

Tuesday 11 August 2026

TSMC commits JPY282 billion to Sony sensor JV as AI demand outruns Sony's 40nm process

TSMC and Sony Semiconductor Solutions have signed a legally binding definitive agreement to establish Advanced Vision Semiconductor...

Tuesday 11 August 2026

OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year

AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...

Tuesday 11 August 2026

Microsoft seeks expanded Maia 300 production to tap into demand for cheaper compute

Microsoft plans to unveil its new Maia 300 accelerator chip this fall, with a public announcement possible as early as next month, according to The Information. Although Microsoft...

Tuesday 11 August 2026

Amkor reportedly weighs China stake sale as multinationals reassess footprint

Amkor Technology is exploring options, including the sale of a stake in its China business, according to people familiar with the matter, adding the US chip packaging and testing giant...

Monday 10 August 2026

Sony, TSMC to spend US$6.3 billion on Japan image sensor venture, Nikkei says

Sony Group and Taiwan Semiconductor Manufacturing Company (TSMC) plan to invest around JPY1 trillion (approx. US$6.3 billion) in a joint...

Monday 10 August 2026

TSMC July revenue jumps 44.7% to record US$14.5B, 2026 growth forecast tops 40%

Taiwan Semiconductor Manufacturing Company (TSMC) reported record monthly revenue of NT$467.58 billion (approx. US$14.5 billion) for July...

Monday 10 August 2026

Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography

AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...

Saturday 8 August 2026

TSMC vs. UMC and beyond: the hostile bids that forged Taiwan's chip dominance

Powerchip chairman Frank Huang, who spent much of his career mirroring the trajectory of Taiwan's memory and foundry industries and...

Friday 7 August 2026

Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push

TSMC is expanding Japan's role in its global network as it prepares to add 3nm production in Kumamoto and deepens local capabilities in advanced packaging, chip design and next-generation...

1/414 pages