TSMC updates

Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.

IN THE NEWS

Tuesday 30 June 2026

TSMC fast-tracks CoPoS—whole supply chain under gag order

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to...

Tuesday 30 June 2026

TSMC 2nm, CoWoS, and CoPoS broadly lift Taiwan's equipment, materials, and packaging suppliers

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating...

Tuesday 30 June 2026

AI hands foundries pricing power: TSMC leads, but the boom spreads industry-wide

AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs,...

Monday 29 June 2026

AI demand drives Foundry 2.0 market revenue up 23% in 1Q26, says Counterpoint

Global revenue for the semiconductor industry's "Foundry 2.0" market reached US$86 billion in the first quarter of 2026, up 23% year-over-year, driven by strong demand for AI accelerators...

Monday 29 June 2026

Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS

ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment...

Saturday 27 June 2026

ShunSin sees CPO potential, adds TSMC veterans as independents

ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging,...

Friday 26 June 2026

Analysis: Why Apple can't wait out this memory shortage

Apple raised prices across its Mac and iPad lineup on June 25, and the timing wasn't a choice so much as a deadline.

Friday 26 June 2026

Apple reportedly revamps Mac chip roadmap to accelerate AI push

Apple is preparing its biggest shift yet to the release strategy for its in-house Mac processors, opting to skip high-end M6 Pro and M6 Max chips and instead bring more powerful AI-focused...

Thursday 25 June 2026

TSMC-Amkor alliance jolts packaging map as ASE races to expand

The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...

Thursday 25 June 2026

Nvidia CPO roadmap positions TSMC COUPE for next AI infrastructure wave

Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...

Thursday 25 June 2026

TSMC 3nm lead times surpass one year as Samsung faces Intel in foundry push

As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics'...

Thursday 25 June 2026

OpenAI debuts Broadcom-designed, TSMC-built inference chip as model makers diversify silicon

OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model...

Wednesday 24 June 2026

MediaTek-Global Unichip tie-up talk puts TSMC's AI ASIC ecosystem on watch

Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the...

Monday 22 June 2026

TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026

Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation

TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...

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