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Wednesday 28 July 2021
IC substrate maker Kinsus posts 2-fold profit jump in 2Q21
IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...
Wednesday 28 July 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...
Friday 23 July 2021
PCB firms shipping in small volumes for upcoming AirPods
Shipments of flexible PCBs (FPCB) and SiP modules for use in the next-generation AirPods have kicked off in small volumes, and will be scaled up between late third-quarter and fourth-quarter...
Monday 12 July 2021
ASE Technology to score big in 3Q21 from serving heavyweights
Taiwan's leading OSAT ASE Technology Holding will see big orders from major clients Apple, Qualcomm and MediaTek further power its revenue growth in the third quarter after posting...
Thursday 8 July 2021
Arrival of new capacity drives Nan Ya, Kinsus revenue growth
Nan Ya PCB and Kinsus Interconnect Technology both saw their June revenue climb over 30% from a year earlier, driven mainly by the arrival of new production capacity, according to...
Friday 2 July 2021
Zhen Ding to set up 4 new plants mainly for IC substrates, HDI boards
Taiwan's PCB maker Zhen Ding Technology has disclosed plans to set up four new plants in Taiwan and China in 2021, mostly dedicated to production of high-end IC substrates and rigid...
Wednesday 30 June 2021
Apple reportedly enlists five suppliers of AiP substrates for new mmWave iPhnones
Apple reportedly has enlisted AT&S as a new supplier of BT-based AiP (antenna in package) substrates for new 5G mmWave iPhones to be released later in the year, expanding to five...
Friday 25 June 2021
IC substrate makers see supply stay tight despite cryptomining slowdown
IC substrate makers continue to see their output fall short of demand, despite a recent slowdown in cryptomining demand, according to industry sources.
Thursday 24 June 2021
BT substrate suppliers kicking off shipments for new Apple devices
BT substrate vendors in the supply chain of Apple devices are all gearing up shipments for next-generation Apple Watch, AirPods and iPhone devices, which will all massively adopt...
Thursday 24 June 2021
New Apple Watch reportedly to adopt double-sided SiP for PMICs
The upcoming Apple Watch series reportedly will massively adopt double-sided SiP packaging for power management ICs, with ASE Technology as the main backend partner, according to...
Tuesday 22 June 2021
BT substrate supply may fall short of demand in 2H21
The supply of BT substrates is likely to fall short of demand in the second half of this year, but the shortage will be less severe than that of ABF substrates, according to industry...
Friday 18 June 2021
ShunSin gearing up for 400G transceiver module packaging services
Backend house ShunSin Technology, a subsidiary of Foxconn Technology (Hon Hai Precision) specializing in system-in-package (SiP) modules, is poised to reap handsome income by rendering...
Friday 11 June 2021
ASE Technology posts record revenues for May
ASE Technology has reported revenue grew 2.3% sequentially and about 18% on year to NT$42.27 billion (US$1.53 billion) in May 2021, a record high for the same month, and its January-May...
Friday 4 June 2021
Texas Instruments remains top analog IC supplier
With analog sales of US$10.9 billion and 19% marketshare, Texas Instruments (TI) maintained its firm grip as the leading supplier of analog devices in 2020, according to IC Insights...
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...