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Thursday 7 March 2024
VCSEL component maker TrueLight attracts investment from Taiwan Mask
Photomask specialist Taiwan Mask Corporation has announced plans to participate in optical components supplier TrueLight's private placement, with a total investment of around NT$410...
Tuesday 31 October 2023
JCET sees growth accelerate in 3Q23
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
Wednesday 18 October 2023
USI sees supply-side challenges facing future cars
Future cars have emerged as a major global technology trend, but chip shortages and other supply-side issues may hinder progress, according to Universal Scientific Industrial (USI),...
Friday 13 October 2023
Amkor opens new factory in Vietnam
Amkor Technology recently inaugurated its newest manufacturing facility in Bac Ninh, Vietnam.
Tuesday 26 September 2023
Miniaturization trend for Wi-Fi modules remains unchanged; packaging testing suppliers rely on SiP
Taiwanese OSAT providers stated that the trend of connectivity in everything will continue in 2024, and it will be combined with trends such as cloud AI, edge computing, and high-speed...
Thursday 14 September 2023
ASE, USI manufacture S9 SiP for new Apple Watch
The new S9 system-in-package (SiP) that powers the just-unveiled Apple Watch is manufactured by Advanced Semiconductor Engineering (ASE) and Universal Scientific Industrial (USI),...
Wednesday 13 September 2023
IC backend houses to see demand recovery in 2024
Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
Friday 18 August 2023
ASE: auto SiP module increases computing capabilities in smart cockpits
The era of software-defined automobiles is approaching, and while electronic control units (ECUs) are becoming more streamlined, the computing and integration capabilities of the...
Monday 24 April 2023
USI develops advanced failure analysis tech to meet demands of SiP miniaturization products
USI has developed advanced electronic component failure analysis (FA) technology to meet the increasingly complex and diverse needs of SiP miniaturized products.
Tuesday 18 April 2023
Chip suppliers see slight pick-up in orders for Android smartphones
Radio-frequency (RF) and power amplifier (PA) chip suppliers have noticed a slight pick-up in orders for Android smartphones as related brand vendors prepare for China's approaching...
Thursday 19 January 2023
Wi-Fi 6E penetration in PCs to rise on new MacBook Pro adoption
The new 14-and 16-inch MacBook Pro models just unveiled by Apple both support the newest Wi-Fi 6E (802.11ax) wireless communication standard, which is expected to notably drive up...
Monday 9 January 2023
New Asustek notebook equipped with SiP CPU module from USI
Design and manufacturing services (DMS) provider Universal Scientific Industrial (USI), a subsidiary of ASE Group, has announced it worked with Asustek Computer to develop the vendor's...
Thursday 22 December 2022
ASE talks about SiP development trends
OSAT ASE Group recently shared its vision regarding development trends for system-in-package (SiP) technology.
Friday 11 November 2022
Nan Ya PCB sees increasing rush orders for BT substrates
Taiwan's IC substrate supplier Nan Ya PCB has witnessed a surge in rush orders for BT substrates needed to process memory and other chip solutions for mobile smart devices and TV...
Tuesday 25 October 2022
ASE cuts into medical care supply chain with SiP
ASE Technology has cut into the medical care industry supply chain with its system in a package (SiP) packaging for ultra-wideband (UWB) modules, according to industry sources.
Research Report Database
Summary of Tech Supply Chain News!
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