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Bits + chips
FOPLP ideal for heterogeneous integration IC packaging, says Powertech chairman
Julian Ho, Taipei; Willis Ke, DIGITIMES
Taiwan IC backend service provider Powertech Technology is aggressively developing fan-out panel level packaging (FOPLP) technology in line with the "heterogeneous integration" trend looming to dominate the packaging sector during the 2020-2030 period,...
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Amid bleak outlook for downstream vendors, uncertainties surrounding the US-China trade tension, factory relocation and exchange rate volatility, global smartphone AP shipments may experience further decline in 2019, down two years in row, according to Digitimes Research estimates.
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