Below are the most-read DIGITIMES Asia stories from the week of April 27-May 4, 2026:
TeraFab is already changing the semiconductor landscape — before a single chip is made
The April 2026 announcement of TeraFab, a chip fabrication venture in partnership with Intel, follows the same logic that Elon Musk has always abided by: What he cannot buy, he builds himself. When off-the-shelf rockets weren't fast enough, he built SpaceX; when battery supply couldn't keep pace, Tesla built its own cells; and this time, the industry he's aimed at is the one least accustomed to disruptions. However, few in the industry are surprised by this development.
Intel kills three projects in two months as Kechichian launches multi-year reset
Intel's reorganization under executive vice president and general manager of the Data Center Group, Kevork Kechichian, backed by CEO Lip‑Bu Tan, aims to reposition amid Nvidia's AI dominance and Arm's rise, signaling a shift to CPU-centric orchestration alongside GPUs and ASICs, an opportunity with major worldwide implications for data-center economics, AI deployment strategies, and competition in the next two to three years.
Tata's India chip fab faces leadership churn and engineering hurdles amid uneven but continuing progress
Tata Electronics' flagship semiconductor fabrication project in Dholera, Gujarat—long viewed as India's most ambitious attempt to build a domestic chip manufacturing ecosystem—continues to move forward but remains marked by repeated setbacks alongside visible progress. While construction activity and regulatory milestones indicate momentum, leadership exits and complex site conditions underline the challenges of executing a greenfield fab at a global scale.
TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first, but the company has held back. TSMC executives stated that there are currently no plans to introduce High-NA EUV before 2029, mainly because "it's too expensive." This decision also reflects how TSMC is shifting competition focus from equipment to process integration and cost efficiency.
Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions to rapidly improve yield.
According to The Elec, which cited industry sources, Samsung produced 10a process wafers in March 2026 and confirmed the emergence of working dies during chip characterization testing. This milestone marks the first implementation of the 4F Square architecture combined with Vertical Channel Transistor (VCT) technology.
Cerebras files for IPO after AI chip breakthrough, G42 partnership shapes supply chain
Cerebras Systems filed for an initial public offering (IPO) on April 17, 2026, aiming to list on the Nasdaq. The company reversed its fortunes with US$510 million in revenue and a net profit of US$87.9 million in 2025, compared to US$290 million in revenue and a net loss of US$484.8 million in 2024.
Two days before the IPO filing, The Information revealed that OpenAI's procurement agreement for Cerebras' AI compute chips could expand to US$20 billion, granting OpenAI warrants to subscribe up to 10% equity in Cerebras.
Texas Instruments executive discusses high-voltage power architecture for AI data centers
Texas Instruments (TI) plans to showcase its 800V power architecture-based AI data center solutions at Computex 2026, featuring applications in humanoid robots, automotive, and edge AI. Ahead of the event, TI executives have been engaging with local Taiwanese supply chains to explore collaborations.
Article edited by Jack Wu
