Global supply chain: Key components

Key components news coverage

IN THE NEWS

Friday 2 October 2026

Samsung's Galaxy Tab S12 taps MediaTek Dimensity 9500 as 2nm successor arrives

MediaTek announced on September 30 that its flagship Dimensity 9500 chip powers Samsung's new Galaxy Tab S12 Ultra and Galaxy Tab S12+ tablets. The deal continues a long-running partnership...

Friday 2 October 2026

Bull's France factory doubles capacity to capture growing orders as EU pushes AI sovereignty

Supercomputer maker Bull will double its production capacity using an expanded factory that reopened on October 1. The French creator of Europe's fastest supercomputers described unprecedented...

Friday 2 October 2026

Nvidia weighs PTFE and HC for glass-free PCBs in Rubin Ultra

Nvidia is testing glass-free PCB material systems for its next-generation AI server platforms, evaluating polytetrafluoroethylene (PTFE) and hydrocarbon (HC) resin formulations for...

Friday 2 October 2026

AMD bets on AI demand by buying World Labs

Under Lisa Su's 12-year tenure at Advanced Micro Devices (AMD), the company has gradually moved beyond its role as Intel's challenger in the CPU market. But in the accelerator market...

Friday 2 October 2026

China financing chain linked to Nvidia Blackwell chips, 32 Asus servers exposed

A China-backed leasing firm appears to have helped Chinese companies buy restricted Nvidia Blackwell platform chips through financial leasing, according to a recent report. The transactions...

Friday 2 October 2026

Taiwan government backs 7 semiconductor schools to upgrade equipment

To address chip talent shortages, Taiwan has a law in place to promote industry-academia collaboration by establishing semiconductor schools. However, the current financing scheme...

Friday 2 October 2026

Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop

When the underlying economics of infrastructure commitments meet the financing muscle of the companies supplying foundational compute, the traditional boundary between supplier and...

Friday 2 October 2026

China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute

Cambricon Technologies' equity dispute with former deputy general manager and chief technology officer Liang Jun has escalated sharply, with Liang...

Friday 2 October 2026

TSMC, NTU deepen R&D ties through nearly 50 projects a year

National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...

Friday 2 October 2026

Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds

The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED...

Friday 2 October 2026

Hygon, Sugon deepen integration under one chairman after US$17.3B merger collapse

Chinese AI chipmaker Hygon Information Technology has appointed Jun Li as its new chairman following a recent board reshuffle. Li only took over...

Friday 2 October 2026

Onsemi revises Synaptics takeover deal after rival bid

Onsemi has amended its agreement to buy Synaptics in an all-cash deal, a move that could reshape semiconductor competition and affect global technology supply chains. The revised cash...

Friday 2 October 2026

CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era

Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note...

Friday 2 October 2026

Commentary: AMD challenges Nvidia in embodied AI as Lisa Su acquires Fei-Fei Li's World Labs

Advanced Micro Devices (AMD) has agreed to acquire World Labs in an all-stock transaction valued at approximately US$8.2 billion. Following the closing, World Labs will operate as...

Thursday 1 October 2026

SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure

DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric...

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