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Saturday 13 June 2026
Taiwan IC distributor Edom eyes four growth engines beyond cloud AI

As cloud service providers ramp up investment in AI infrastructure, Edom chairman Wayne Tseng said rising costs for materials, production...

Saturday 13 June 2026
Commentary: Five things I noticed at SuperAI Singapore that the keynotes did not tell you
Ten thousand attendees. One hundred and fifty speakers. Three exhibition floors. Two days. SuperAI Singapore 2026 generated enough keynote content, panel discussion, and product announcements...
Saturday 13 June 2026
ITE Tech wins design slots in US AI computing platform, raising global PC supply chain stakes
ITE Tech said its embedded controller chip and HDMI 2.1 retimer have been adopted by a US agentic AI computing platform, with mass production expected as early as the second half of...
Saturday 13 June 2026
PCIM 2026: Why Western carmakers cannot have 'China-free' SiC at subsidized prices

During a panel discussion between executives and research experts from Bosch, Infineon, Rohm Semiconductor, Nexperia, Wolfspeed, and...

Saturday 13 June 2026
Nvidia turns to Vera CPU in China as H200 sales stall

Nvidia has begun telling Chinese clients that its new Vera central processing unit (CPU) could be available as soon as August and that...

Friday 12 June 2026
Taiwan PMIC maker Global Mixed-mode to raise prices as chip shortages persist

Taiwanese power management IC supplier Global Mixed-mode Technology (GMT) will follow peers in seeking price increases from customers...

Friday 12 June 2026
Taiwan compute suppliers rise on booming AI demand, with several firms extending strong growth
Taiwan's semiconductor and electronics supply-chain companies continued to post generally firm sales in May, according to monthly revenue data and company disclosures, with the strongest...
Friday 12 June 2026
Silicon Labs expands India presence as smart infrastructure demand grows ahead of TI acquisition

Silicon Labs is deepening its presence in India through expanded research operations and a greater commercial focus on smart infrastructure...

Friday 12 June 2026
PCIM 2026: Accepting local component deficits for system-level benefits

In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth),...

Friday 12 June 2026
Alibaba's stealth model launch, Meitu's outsourcing play — China's visual AI market defies a single playbook

One of China's largest visual AI consumer platforms has deliberately chosen not to build its own models; a startup competing against...

Friday 12 June 2026
Cadence deepens Intel Foundry partnership on next-generation chip design
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The...
Friday 12 June 2026
SuperAI 2026: From turbine backlogs to copper limits, AMD maps infrastructure walls closing in on AI
The artificial intelligence (AI) industry is expanding at a pace that the physical world cannot match, and the gap between digital demand and real-world supply is widening across every...
Friday 12 June 2026
Google TPU orders shift as MediaTek, Marvell, and Broadcom split market
Broadcom has acknowledged it will not win all of Google's TPU orders, highlighting how tensor processing units have become a competitive arena for multiple chipmakers. For global readers,...
Friday 12 June 2026
SuperAI Singapore: Arm and Cerebras push system-wide fixes to cut inference AI bottlenecks

Breaking the inference barrier requires a rethink of the whole system architecture, not just faster compute. This was the key takeaway...

Friday 12 June 2026
SuperAI Singapore: Physical AI accelerates as cheaper hardware and AI models drive robot data demand

Robotics has progressed rapidly in the past few years, but major obstacles — including data collection and trust infrastructure...