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IN THE NEWS
Tuesday 28 July 2026
Eiso raises NT$300M to accelerate AI, aerospace, defense PCB expansion

Printed circuit board (PCB) manufacturer Eiso Enterprise has completed its annual fundraising plan. To strengthen working capital for...

Tuesday 28 July 2026
Cadence raises 2026 outlook after record quarter, flags major Intel deal as revenue driver

Cadence Design Systems posted stronger-than-expected second-quarter results on July 27 and raised its full-year revenue growth outlook...

Tuesday 28 July 2026
Smart glasses ignite AI device battle as China nears 80% global brand share
Smart glasses are emerging as a major next-generation consumer device as breakthroughs in generative AI and large language models (LLMs) reshape the wearable market. Once constrained...
Tuesday 28 July 2026
Robot boom heats up as Taiwan chipmakers race to catch up
Cloud AI chip giants are stepping up investment in robot applications, putting robots back at the center of industry debate. For Taiwanese chipmakers, the broad range of robot use...
Tuesday 28 July 2026
Nvidia's Vera targets AI server growth, with CSP adoption the key test
Nvidia is pushing into the server CPU market with its Vera chip as AI infrastructure competition enters a new phase, seeking to evolve from a chip supplier into a full AI computing...
Tuesday 28 July 2026
China faces AI compute divide as advanced capacity falls short and lower-tier resources sit underused
China's AI computing infrastructure is developing along two sharply divergent paths. As large language models and AI agents gain traction across industries, rapidly rising token consumption...
Monday 27 July 2026
South Korea, AMD team up to integrate homegrown NPUs with CPUs and GPUs
South Korea and AMD have agreed to build and demonstrate heterogeneous AI computing infrastructure integrating AMD CPUs and GPUs with homegrown neural processing units, as Seoul seeks...
Monday 27 July 2026
Samsung converts AMD and OpenAI ties into HBM4 supply wins

Samsung Electronics is showing renewed momentum in the AI memory race as it deepens ties with both OpenAI and AMD, two partnerships...

Monday 27 July 2026
Rebellions readies Rebel100 shipments as AI inference demand grows
South Korean AI chip designer Rebellions plans to begin shipping its next-generation Rebel100 accelerator in the second half of 2026, betting that wider use of AI agents and commercial...
Monday 27 July 2026
India's NIELIT and SCL expand access to indigenous semiconductor design kit through eChipHub
India's National Institute of Electronics and Information Technology (NIELIT) and the Semiconductor Laboratory (SCL) have collaborated to make SCL's indigenous 1.2-micrometer Process...
Monday 27 July 2026
Qualcomm tells customers chip prices will rise by double digits from September

Qualcomm plans to raise chip prices by a double-digit percentage from September 1, passing higher supplier costs into a smartphone market...

Monday 27 July 2026
IndieSemiC, Semtech partner on RISC-V IoT platform as India expands semiconductor design ecosystem
Gujarat-based fabless semiconductor startup IndieSemiC has partnered with US-based semiconductor supplier Semtech Corporation to develop a new RISC-V-based system-in-package (SiP)...
Monday 27 July 2026
Samsung’s Broadcom AI chip pact expected to top US$200 billion as Hyundai expands robotics push

Samsung Electronics and Hyundai Motor Group used the San Francisco AI Summit to outline separate artificial intelligence (AI) expansion...

Monday 27 July 2026
IDMs target AI margins, boosting Taiwan power suppliers
International IDMs such as Texas Instruments (TI) and STMicroelectronics are leaning into AI data-center demand, while the market's shift toward 400V and 800V power architectures is...
Monday 27 July 2026
AMD widens robotics push with Taiwan IPC partners as it targets Nvidia lead
AMD is deepening its robot and physical AI ambitions, and the move could matter far beyond Taiwan's industrial PC sector. By building a broader partner network in edge AI and robotics,...