Global supply chain: Key components

Key components news coverage

IN THE NEWS

Tuesday 30 June 2026

HKC IPO gives China's display sector a third heavyweight

HKC Corporation has debuted on the Shenzhen Stock Exchange main board, cementing a three-way leadership structure in China's display...

Tuesday 30 June 2026

IC design firms brace for uncertain peak season as prices rise

The 2026 peak season for IC design firms remains unclear, with global readers likely to feel the effects through pricier smartphones, PCs, and other devices. Supply-chain costs are...

Tuesday 30 June 2026

Expected MCU price hike drives early 1H26 pull-ins

Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply...

Tuesday 30 June 2026

Arm says it tops 50% share in hyperscale cloud as x86 grip slips

Arm Holdings says its chip architecture has crossed the 50% threshold in the hyperscale cloud market, a milestone in a segment long...

Monday 29 June 2026

Baidu subsidiary Kunlunxin seeks US$50B IPO valuation, asks investors to buy its chips

Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong...

Monday 29 June 2026

BYD's 4nm smart-driving chip signals deeper EV supply-chain integration

BYD plans to install its first in-house smart-driving chip in a Denza production model in 2027, marking a key step in the Chinese automaker's...

Monday 29 June 2026

BOE's military designation hands South Korean panel makers a strategic opening

The US government's move to add Chinese panel makers BOE and Tianma to a military-related list is raising concerns that Washington's...

Monday 29 June 2026

Weekly news roundup: South Korea takes physical AI push from policy to practice; Europe aggressively pursues non-red supply chains

Below are the most-read DIGITIMES Asia stories from the week of June 22-28, 2026:

Monday 29 June 2026

Onsemi's Synaptics acquisition intensifies competition for physical AI leadership

Onsemi's acquisition of Synaptics underscores how global chipmakers are racing to build broader edge AI platforms, with implications that could ripple through data centers, industrial...

Monday 29 June 2026

Qualcomm stirs AI data center competition with CPUs, ASICs, and accelerators

Qualcomm officially unveiled its Dragonfly data center platform at this week's annual investor day, laying out a four-pronged push into cloud AI that spans SerDes, PAM4 DSP, and other...

Sunday 28 June 2026

Apple's first foldable iPhone reportedly on track for September 2026 launch

Apple's long-rumored foldable iPhone remains on schedule for a September 2026 debut, despite earlier reports that hinge-related issues could delay the device's release.

Sunday 28 June 2026

2nm advanced process waste surges 13x, Techzone targets semiconductor ESG waste treatment market

As advanced semiconductor processes rapidly transition from 28nm to 3nm and 2nm nodes, more frequent chemical cleaning procedures are driving an increase in demand for liquid chemical...

Saturday 27 June 2026

Apple's reported 1.4nm roadmap signals prolonged race for advanced-node capacity

Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could...

Saturday 27 June 2026

MediaTek frames orbit compute and NTN as next strategic R&D priorities

MediaTek hosted MARC Workshop 2026 on June 24 through the MediaTek Advanced Research Center (MARC), recognizing the year's university-industry collaboration outcomes while outlining...

Friday 26 June 2026

OpenAI, Anthropic, and Google turn to deployment engineers as AI focus shifts to enterprise use

AI companies are racing to hire forward deployed engineers, or FDEs, as the industry shifts from model-building to implementation. For global readers, the trend signals that the next...

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