Global supply chain: Key components

Key components news coverage

IN THE NEWS

Tuesday 14 July 2026

Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization...

Tuesday 14 July 2026

Taiwan IC designers join forces to capture bigger prize in AI vision solutions

Taiwan's IC design companies are stepping up investment in AI imaging solutions, with both industry leaders and smaller players accelerating...

Tuesday 14 July 2026

Innolux 1H26 revenue hits 5-year high on auto, advanced packaging

Taiwanese panel manufacturer Innolux reported unaudited consolidated revenue of NT$21.7 billion (approx. US$675.4 million) for June 2026, up 5.1% from the previous month and 17.25%...

Tuesday 14 July 2026

C Sun sees advanced packaging and PCB demand driving 2026 revenue

C Sun said its 2026 revenue growth will be led by advanced packaging and advanced printed circuit board equipment as AI infrastructure spending continues to support industrial investment...

Tuesday 14 July 2026

Tripod posts record second-quarter revenue as 2026 capex plan tops NT$10 billion

Tripod Technology said its business stayed strong in the first half of 2026, helping second-quarter revenue hit a new quarterly high. June sales still topped NT$8 billion (approx....

Tuesday 14 July 2026

Analysis: Why Meta's AI strategy sparked a market misread

Reports that Meta is considering leasing out idle AI computing capacity have rattled investors. But treating Meta's predicament as...

Tuesday 14 July 2026

Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan

As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the...

Monday 13 July 2026

Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

Monday 13 July 2026

Trump admin reportedly urged Apple to procure chips from Intel in exchange for dropping tariffs

Reports have emerged that Apple may have managed to avoid 100% tariffs imposed by US President Donald Trump, partly by agreeing to...

Monday 13 July 2026

Apple reportedly accelerates AI chip roadmap as next-gen Macs prioritize neural processing

Apple is reshaping its Mac chip roadmap to prioritize AI, accelerating development of future processors as the company seeks to strengthen...

Monday 13 July 2026

MediaTek revenue beat lifts second-quarter outlook as seasonal demand builds

MediaTek reported June 2026 revenue of NT$58.012 billion (US$1.81 billion), up 22.30% month over month and 2.80% year over year, and said second-quarter revenue reached NT$152.183...

Monday 13 July 2026

Sitronix sees zero-capacitance TDDI and automotive DDI drive growth

Sitronix Technology said this week that zero-capacitance touch with display driver integration (TDDI) and automotive display drive IC (DDI) will drive its growth in 2026, as the chipmaker...

Monday 13 July 2026

Arm CEO: AI agents to drive CPU demand as infrastructure shifts beyond GPUs

GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory...

Monday 13 July 2026

AI infrastructure demand lifts WPG, WT Microelectronics to record Q2 revenue

Monday 13 July 2026

Egis sells part of iCatch stake as ASMedia becomes largest shareholder

Egis Technology on July 9 said it sold part of its stake in iCatch Technology as part of a routine adjustment to its group equity holdings. The IC design company said the move was...

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