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Monday 17 August 2026
LG-Nvidia physical AI partnership speeds up as robotics chief reportedly heads to South Korea

Less than a week after LG Group and Nvidia signed a strategic memorandum of understanding (MOU), Madison Huang, Nvidia's senior director...

Monday 17 August 2026
Nvidia closing in on US$100B credit guarantee deal for OpenAI's Ohio data center
Nvidia is approaching an agreement to provide credit guarantees of around US$100 billion for OpenAI's 10GW data center in Ohio, among the largest AI infrastructure projects ever, according...
Monday 17 August 2026
AMD eyes Taalas: will the system ditch HBM, advanced packaging, and 3D stacking?
The AI compute landscape was jolted in February 2026 by Taalas, a Canadian startup founded by former AMD and NVIDIA architect Ljubisa Bajic. Emerging with an unconventional "Model-Based"...
Monday 17 August 2026
Topoint's high-end drill bits hit 56% share ahead of schedule, aims to double capacity by end of 2028

Printed circuit board (PCB) drill bit manufacturer Topoint Technology stated during its second-quarter 2026 earnings call that strong...

Monday 17 August 2026
Weekly news roundup: AI expansion fuels supernodes, post-HBM memory, liquid cooling and supply-chain shifts
This week's most-read stories traced the AI boom across the stack, from supernodes and next-generation memory to liquid cooling, solar power, telecom services and PCB demand. Below...
Monday 17 August 2026
AI vision sensing demand heats up for Novatek, PixArt, Elan, Realtek
Taiwanese IC design firms that have been building out AI vision sensing businesses are now reaping the rewards, with major players including display driver IC (DDI) leader Novatek...
Sunday 16 August 2026
TV slowdown accelerates panel makers' shift to IT OLED, UBI Research found

With global TV demand slowing and panel prices continuing to fall, display makers are facing intensifying profit pressure. Analysts...

Saturday 15 August 2026
Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

Saturday 15 August 2026
MicroIP sees second-half revenue lift as board approves cash raise
MICROIP, which focuses on AI software design services and ASIC design services, said its first-half 2026 financial report showed continued investment in core technologies and key IP...
Saturday 15 August 2026
Taiwan approves NT$8 billion ocean tech program for security and industry
Taiwan's government approved a four-year ocean technology and industry development program for 2027-2030 and will seek more than NT$8 billion in funding. The plan was designed to strengthen...
Saturday 15 August 2026
Interview: Acrab CEO Ken Phua on building agentic AI silicon in Singapore
Ken Phua, former Arm China co-CEO, spent 25 years abroad building someone else's business model. He came home to Singapore to build his own.
Friday 14 August 2026
China AI chip demand lifts Hygon revenue 67%, Sugon profit 34% as domestic computing expands

Hygon Information posted a 66.5% increase in first-half 2026 revenue as accelerating artificial intelligence deployment and stronger...

Friday 14 August 2026
OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?

For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove...

Friday 14 August 2026
Chinese analog chipmaker Novosense returns to profit on AI server, auto demand
Suzhou Novosense Microelectronics expects to return to profitability in the first half of 2026, with revenue rising nearly 67% as demand for AI computing infrastructure, automotive...
Friday 14 August 2026
AMD reportedly to issue up to US$5B in bonds amid tech debt sale wave
Advanced Micro Devices (AMD) is launching up to US$5 billion in debt offerings, part of a wave of tech companies reaching for capital markets to fund investments in AI-driven technologies...