Global supply chain: Key components

Key components news coverage

IN THE NEWS

Friday 2 October 2026

Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop

When the underlying economics of infrastructure commitments meet the financing muscle of the companies supplying foundational compute, the traditional boundary between supplier and...

Friday 2 October 2026

China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute

Cambricon Technologies' equity dispute with former deputy general manager and chief technology officer Liang Jun has escalated sharply, with Liang...

Friday 2 October 2026

TSMC, NTU deepen R&D ties through nearly 50 projects a year

National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...

Friday 2 October 2026

Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds

The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED...

Friday 2 October 2026

Hygon, Sugon deepen integration under one chairman after US$17.3B merger collapse

Chinese AI chipmaker Hygon Information Technology has appointed Jun Li as its new chairman following a recent board reshuffle. Li only took over...

Friday 2 October 2026

Onsemi revises Synaptics takeover deal after rival bid

Onsemi has amended its agreement to buy Synaptics in an all-cash deal, a move that could reshape semiconductor competition and affect global technology supply chains. The revised cash...

Friday 2 October 2026

CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era

Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note...

Friday 2 October 2026

Commentary: AMD challenges Nvidia in embodied AI as Lisa Su acquires Fei-Fei Li's World Labs

Advanced Micro Devices (AMD) has agreed to acquire World Labs in an all-stock transaction valued at approximately US$8.2 billion. Following the closing, World Labs will operate as...

Thursday 1 October 2026

SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure

DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric...

Thursday 1 October 2026

Ascend now ahead of Nvidia in China, with domestic supply driving AI chip substitution, says Huawei chairman

Huawei rotating chairman Eric Xu said the company's Ascend AI accelerators have surpassed Nvidia in both sales and market share in China, highlighting how US export controls on advanced...

Thursday 1 October 2026

Meta's Muse lifts server CPU demand, with AMD EPYC orders extending into 2028

Meta's rapid rollout of its Muse AI agent is emerging as an early test of how agentic AI could reshape server infrastructure demand, with CPU suppliers already seeing longer lead times...

Thursday 1 October 2026

Synopsys and Amazon sign US$1 billion-plus deal to speed custom chip development

Synopsys announced a strategic agreement with Amazon on September 30, a multi-year deal valued at more than US$1 billion that is intended to speed up Amazon's custom silicon work and...

Thursday 1 October 2026

Machvision's dual-track strategy enters early growth as semiconductor, substrate visibility reaches 3 years

Machvision said its "dual-track, four-line" strategy has entered an early growth phase as demand for AI servers, high-speed transmission, and advanced packaging continues to rise....

Thursday 1 October 2026

MediaTek TPU orders rise as chip capacity war intensifies

MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers...

Thursday 1 October 2026

Qualcomm, Samsung redesign chip packaging as heat limits phone performance

Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...

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