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Wednesday 16 September 2026
Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI
MediaTek has officially launched the Dimensity 9600 Pro, introducing a major architectural overhaul for its 2026 flagship mobile chip. Beyond the shift to a 2nm process, the new platform...
Wednesday 16 September 2026
South Korean NPU startups face validation hurdle in push for global sales

South Korea's neural processing unit (NPU) startups are moving from chip development toward commercial deployment, but limited experience...

Wednesday 16 September 2026
Apple's foldable phone faces durability test as suppliers eye crease risks

Apple's first foldable phone is drawing worldwide attention because its design choices could shape how future bendable devices are built...

Wednesday 16 September 2026
ITRI showcases AI robots, drones to push commercialization in southern Taiwan

The Industrial Technology Research Institute (ITRI) held its ITRI Innovation Day on September 15 in Tainan, Taiwan, bringing together...

Wednesday 16 September 2026
DeepSeek to hire its first CFO as it aims for public listing, expands workforce

DeepSeek is reportedly set to hire Wentao Yan, a partner at venture capital firm GL Ventures, as its first CFO. If the appointment takes...

Wednesday 16 September 2026
DIGITIMES Insight: Taiwan's small IC design firms face a weaker second half after rebound

Taiwan's smaller IC design firms posted a strong revenue recovery in the first half of 2026, but the gains may prove difficult to extend...

Wednesday 16 September 2026
Amodei's AI slowdown call is unlikely to dent chip demand, industry sources say

Anthropic CEO Dario Amodei's call to slow frontier AI development has stirred debate over safety, but chip industry sources say global...

Tuesday 15 September 2026
Apple's foldable debut set to further widen Samsung Display's OLED lead
Samsung Display could emerge as one of the biggest supply-chain beneficiaries of Apple's entry into foldable smartphones, as the Korean panel maker already accounts for about two-thirds...
Tuesday 15 September 2026
China's Guoxin Micro buys its way into power-chip manufacturing

Unigroup Guoxin Microelectronics plans to acquire WeEn Semiconductors for CNY1.9 billion (≈ US$283 million), giving the Chinese...

Tuesday 15 September 2026
MediaTek unveils first 2nm chip to run 30 billion AI models on phones arriving this quarter

MediaTek has become the first merchant silicon vendor to announce a 2-nanometer smartphone processor, unveiling the Dimensity 9600 Pro...

Tuesday 15 September 2026
Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

Tuesday 15 September 2026
Beyond H100: China's GPU makers chase scale, not just parity

China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must...

Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

Tuesday 15 September 2026
AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows
Taiwan's copper-clad laminate (CCL) makers significantly outpaced printed circuit board (PCB) and IC substrate suppliers in August, as stronger server demand, pricing and product-mix...
Tuesday 15 September 2026
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply...