At the Linley Fall Processor Conference, Intel revealed the first architectural details related to Tremont. Intel's newest and most advanced low-power x86 CPU architecture, Tremont offers a significant performance boost over prior generations. Tremont next-generation low-power x86 microarchitecture delivers significant IPC (instructions per cycle) gains gen-over-gen compared with Intel's prior low-power x86 architectures, said the chip vendor. Designed for enhanced processing power in compact, low-power packages, Tremont-based processors will enable a new generation of innovative form factors for client devices, creative applications for the Internet of Things (IoT), and efficient data center products, said Intel.

Samsung Electronics has ntroduced a 0.7-micrometer-pixel image sensor, the 43.7-megapixel (Mp) ISOCELL Slim GH1. Thanks to advanced ISOELL Plus technology, the new ultra-high-resolution GH1 image sensor embraces 43.7-million 0.7-micron-sized pixels in a small package. By utilizing ISOCELL Plus, Samsung's latest pixel isolation technology that minimizes color cross-talk and optical loss, the tiny 0.7-micron pixels are able to absorb sufficient light information to produce bright and vivid photographs. In low-light environments, the GH1 makes use of pixel-merging Tetracell technology that enables higher light sensitivity equivalent to that of a 1.4-micron-pixel image sensor, according to Samsung. For video recording at 4K (3,840x2,160) resolutions, the ISOCELL Slim GH1, with a high resolution of 7,968x5,480, is able to take 4K videos with minimum loss in field of view (FoV), it said. Using Tetracell technology, the GH1 is converted down to 3,984x2,740, a resolution that covers the 4K resolution.

Intel has launched 11 highly integrated 10th Gen Intel Core processors, manufactured via Intel's 10nm process and designed for 2-in-1s and notebooks. The processors bring high-performance artificial intelligence (AI) to the PC at scale, feature new Intel Iris Plus graphics and Intel Wi-Fi 6 (Gig+) and Thunderbolt 3. Systems are expected from PC manufacturers for the holiday season. In addition to performance and responsiveness gains, AI, graphics, connectivity and I/O are optimized on the SoC for a solution that delivers a feature-rich suite of capabilities for OEMs to create notebooks.