Winbond to break ground on new 12-inch fab in mid-2018

Jessie Shen, DIGITIMES, Taipei Wednesday 27 September 2017 0

Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to break ground on a new 12-inch wafer plant at the Kaohsiung Science Park (KSP), southern Taiwan around the end of second-quarter 2018 or the middle of...

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