1774 news items tagged 2017
Xintec halts 12-inch wafer-level packaging productionWednesday 20 June 2018
Image sensor packaging specialist Xintec has decided to suspend its 12-inch wafer-level packaging production line for one year due to disappointing CMOS image sensor (CIS) demand...
FPCB firm Flexium looks to double-digit revenue growth in 2018Tuesday 19 June 2018
Taiwan-based flexible PCB (FPCB) maker Flexium Interconnect expects to enjoy another year of double-digit revenue growth in 2018.
VIS says no plans to build additional production capacityFriday 15 June 2018
Eight-inch foundry Vanguard International Semiconductor (VIS), which has seen its fabs run at full utilization, will continue to boost production efficiency, according to company...
Wireless technologies to comprise 55% of connectivity IC shipments in 2018, IHS saysThursday 14 June 2018
Driven by the colossal Internet of Things (IoT) opportunity, wireless technologies - including wireless local area network (WLAN), Bluetooth, cellular and low-power wireless - will...
PSI expanding wafer thinning businessThursday 14 June 2018
Phoenix Silicon International (PSI), which specializes in wafer reclaim services, expects steady growth in its wafer thinning business in 2018. The product segment has expanded to...
UMC Xiamen operation to remain unprofitable in 2018Wednesday 13 June 2018
Pure-play foundry United Microelectronics (UMC) expects its fab operation in Xiamen, China to remain unprofitable in 2018 due to insufficient economies of scale.
Globalfoundries to cut 5% of workforceWednesday 13 June 2018
Globalfoundries has disclosed plans to cut 5% of its global workforce, or about 900 employees, with the layoff to take place mainly in Europe and the US.
Topco enjoys strong silicone demandWednesday 13 June 2018
Taiwan-based Topco, which mainly distributes silicone materials for Japan's Shin-Etsu Chemical, expects to enjoy double-digit revenue growth in 2018 thanks to robust silicone deman...
Winbond to break ground for new fab in southern TaiwanTuesday 12 June 2018
DRAM and flash memory maker Winbond Electronics will start constructing a new fab in Kaohsiung, southern Taiwan in September followed by equipment move-in slated for 2020.
UMC May revenues up 5%, VIS hits recordMonday 11 June 2018
Pure-play foundry United Microelectronics (UMC) has reported May consolidated revenues increased 5.3% sequentially to NT$13.08 billion (US$438.3 million), while revenues at specialty...
Global semiconductor sales increase 20% in April, says SIAFriday 8 June 2018
Worldwide sales of semiconductors reached US$37.6 billion for the month of April 2018, an increase of 20.2% from the April 2017 total of US$31.3 billion and 1.4% more than last month's...
Yageo May revenues jump 151%Friday 8 June 2018
Passive component maker Yageo has reported consolidated revenues for May 2018 surged 151% from a year ago to a record high of NT$6.35 billion (US$213.6 million).
Zhen Ding expects to post record high revenues in 2018Thursday 7 June 2018
Flexible PCB (FPCB) maker Zhen Ding Technology expects to see its monthly revenues register on-year increases through October, according to company chairman Charles Shen. Revenues...
MLCC supply to remain tight through 2019, says YageoWednesday 6 June 2018
Yageo has seen its supply of MLCCs fall short of demand, which will likely persist through 2019, according to company chairman Pierre Chen.
Chang expresses trust in new TSMC leadership as he bids farewellWednesday 6 June 2018
Morris Chang said at TSMC's annual shareholders meeting on June 5 that he believes the dual leadership of Mark Liu and CC Wei will create another "miraculous" growth for the pure-play...
Global semiconductor equipment billings reach record US$17 billion in 1Q18, says SEMITuesday 5 June 2018
Worldwide semiconductor manufacturing equipment billings came to US$17 billion in the first quarter of 2018, up 12% sequentially and 30% on year, and hitting a record high, according...
TSMC names new chairmanTuesday 5 June 2018
Taiwan Semiconductor Manufacturing Company (TSMC) has announced Mark Liu, currently co-CEO and president of the pure-play foundry, has been promoted to chairman effective immediate...
Arm China JV planning IPOTuesday 5 June 2018
Arm China will be dedicated to developing products exclusively for the China market, and plans for an IPO on the local stock exchange, according to Rene Haas, president of Arm's IP...
Memory module maker Team Group plans to apply for listing on TWSE mainboardTuesday 5 June 2018
Memory module maker Team Group expects to list on the mainboard of the Taiwan Stock Exchange (TWSE) as early as the end of 2018.
Taiwan 2nd-tier backend firms enjoy pick-up of ordersMonday 4 June 2018
Taiwan-based second-tier packaging and testing houses have enjoyed a pick-up of orders for flash memory, and 3D sensing and other optical components recently as their downstream clients...
Mosel profits surge in AprilMonday 4 June 2018
Mosel Vitelic, a pure-play foundry specializing in power semiconductors and analog chips, saw its profits surge in April with EPS exceeding that for the first quarter.
China IC backend output value to exceed US$30 billion in 2018, says Digitimes ResearchFriday 1 June 2018
The output value of China's IC packaging and testing industry will exceed US$30 billion for the first time in 2018, according to Digitimes Research.
Arm intros new Cortex-A76 CPU suiteFriday 1 June 2018
Arm has introduced its Cortex-A76 CPU, a new microarchitecture enabling 35% more performance and 40% less power, and the ARM Mali-G76 GPU and Mali-V76 VPU to deliver "laptop-class...
Global 2017 smartphone AP market drops while growth resumes in tablet AP sector, says Strategy AnalyticsThursday 31 May 2018
The global smartphone applications processor (AP) market declined 5% on year to US$20.2 billion in 2017, while the tablet AP market grew 3% to US$2 billion, according to Strategy...
Taiflex optimistic about flexible PCB marketThursday 31 May 2018
Taiwan-based Taiflex Scientific, which supplies flexible copper clad laminates (FCCL), expects the flexible PCB (FPCB) market to continue growing.