Winbond to break ground for new fab in southern Taiwan

Taipei, Saturday, April 4, 2020 17:09 (GMT+8),

20°C

中文繁體 | 簡體

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Asian Edge: On the Frontline of the ICT World

Bits + chips

Winbond to break ground for new fab in southern Taiwan

Siu Han, Taipei; Jessie Shen, DIGITIMES

Tuesday 12 June 2018

DRAM and flash memory maker Winbond Electronics will start constructing a new fab in Kaohsiung, southern Taiwan in September followed by equipment move-in slated for 2020.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Sponsored links

Coronavirus impact special report: Mobile devices
The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.
Global server shipment forecast and industry analysis, 2020
Digitimes Research estimates that global server shipments moderately declined 1.4% in 2019 but will turn to show positive growth of 6.6% in 2020, totaling 16.01 million units.
Global AP demand forecast, 2017-2022
Worldwide shipments of smartphone application processors are expected to fall.

Digitimes Research Quarterly Data services

© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.

Members only