Winbond to break ground for new fab in southern Taiwan

Taipei, Sunday, July 21, 2019 06:03 (GMT+8),

28°C

中文繁體 | 簡體

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Asian Edge: On the Frontline of the ICT World

Bits + chips

Winbond to break ground for new fab in southern Taiwan

Siu Han, Taipei; Jessie Shen, DIGITIMES

Tuesday 12 June 2018

DRAM and flash memory maker Winbond Electronics will start constructing a new fab in Kaohsiung, southern Taiwan in September followed by equipment move-in slated for 2020.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Sponsored links

Global AIO PC shipment forecast and industry analysis, 2019
Global AIO PC shipments will continue shrinking in 2019. With issues such as US-China trade tensions and Intel
Global server shipment forecast and industry analysis, 2019
According to Digitimes Research, Taiwan-based server vendors, including suppliers of motherboards, end systems, storage devices and related network equipment, continue to enjoy growth in 2018. In terms of volume, global server shipments will show continuing growth throughout 2018 and 2019.
Global mobile device shipment forecasts, 2019 and beyond: Smartphones, notebooks and tablets
This Digitimes Research Special Report offers global shipment forecasts for three major mobile device market segments - smartphones, notebooks and tablets - for the year 2019 and beyond. It gives in-depth analyses of their respective market outlooks, with shipment forecasts extending to 2023.

Global mobile device shipment forecasts, 2019 and beyond: Smartphones, notebooks and tablets

© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.

Members only