TSMC has made changes to its new fab projects in Taiwan, including the suspension of a planned advanced packaging fab in the Hsinchu Science Park (HSP) Tongluo site, according to...
Taiwan is poised to activate one-stop services for foreign technical talent through the International Talent Taiwan Office (ITTO), a newly inaugurated agency under the National Development...
TSMC has become the primary revenue backer of the Southern Taiwan Science Park (STSP), as it is for the Hsinchu Science Park (HSP), which is nearly saturated with land, according...
The Southern Taiwan Science Park (STSP) has seen record revenues driven by the semiconductor industry, with the formerly leading optoelectronics and display panel industries generating...
Government-developed science parks in Taiwan, including Hsinchu Science Park (HSP), Southern Taiwan Science Park (STSP), and Central Taiwan Science Park (CTSP), saw a combined revenue...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
Yongin City in Gyeonggi province of South Korea is poised to become the world's largest semiconductor hub, as it will accommodate an enormous national semiconductor park to be established...
Entegris, a provider of advanced materials and process solutions to the semiconductor and other high-tech industries, has announced the launch of a 54,000-square-meter manufacturing...
United Microelectronics Corporation (UMC) held a groundbreaking ceremony for its Circular Economy & Recycling Innovation Center on March 17. Established at UMC's Fab 12A in Tainan,...
Pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) has expressed caution about its sales prospects for the first quarter of 2023 when its overall fab utilization rate...
Taisic Materials, a subsidiary of the Kenmec group specializing in silicon carbide (SiC) substrates, plans to triple its number of crystal growth furnaces to supply Foxconn's newly...
TSMC is scheduled to hold a ceremony at Fab 18 at the Southern Taiwan Science Park (STSP) on December 29 to mark the start of commercial production of chips using 3nm process technology...