Subscribe to newsletter

REALTIME NEWS

IPC maker Getac sees orders pull in for US government project

Before Going to Press

Samsung expects foldable smartphone sales in Taiwan to surge

Before Going to Press

Telecom specs upgrades in China to buoy Realtek

Before Going to Press

Sunplus cautious about 2H22 amid macro headwinds

Before Going to Press

More Chinese manufacturing hubs impose power restrictions

Before Going to Press

Wi-Fi 6 SoC demand stays robust, say IC distributors

Before Going to Press

EIH on track to expand capacity

Before Going to Press

CCL firm Iteq warns of price competition

Before Going to Press

IC design houses to see revenue register another on-month drops

Before Going to Press

Home Tech Chips + Components

Kioxia breaks ground for new 3D NAND wafer fab

Jessie Shen, DIGITIMES, Taipei Friday 26 February 2021 0

Kioxia held a groundbreaking ceremony for a semiconductor fabrication facility, dubbed Fab 7, at its factory site in Yokkaichi, Japan on February 24. The facility will be dedicated to the production of 3D NAND flash memory.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

LOGIN

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Before Going to Press.
Asia Supply Chain 100 dataset access.
Access to research insights.

Categories

Chips + components IT + CE IT components, peripherals Memory chips

Tags

3D fab flash innovations Japan joint venture Kioxia NAND NAND flash semiconductor wafer wafer fab Western Digital

Related stories

Global wafer foundry industry analysis and forecast, 2022

2022 RISC-V Taipei Day to be held in September to explore RISC-V driven developments in EV, smart vehicles

Premium Supply Chain Forum in Asia

Noodoe looking to expand in global EV charging service market

TOP STORIES
MOST-READ 2021