Bits + chips
NAND vendors to enter production race for over-100-layer offerings in 2021
Siu Han, Taipei; Willis Ke, DIGITIMES

As NAND flash stacking technology continues to advance, vendors will be racing for mass production of 3D TLC/QLC (triple/quad-level cell) NAND chips with over 100 layers in 2021 after sticking to mainstream process for 92/96-layer offerings in 2020,...

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