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Monday 3 August 2026
CXMT closes in on LPDDR6 mass production, challenging Samsung, SK Hynix
CXMT is nearing the end of research and development validation for LPDDR6, bringing it closer to mass production of next-generation mobile DRAM and intensifying competition with Samsung Electronics, SK Hynix and Micron.
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Monday 3 August 2026
Memory makers lift capex as Kioxia holds spending to defend NAND lead
Major memory suppliers are increasing capital spending as AI-related demand from U.S. technology companies accelerates, but Kioxia is keeping investment comparatively tight. According to Nikkei Asia, the Japanese NAND maker is prioritizing technology leadership over a rapid expansion of equipment spending, reflecting caution shaped by earlier downturns in the memory market.
Monday 3 August 2026
TCL Technology to take full ownership of TCL CSOT
TCL Technology Group plans to pay CNY9.32 billion (approx. US$1.38 billion) for the 45% of China Star Optoelectronics Semiconductor Display Technology it does not already own, according to the registration-stage draft of the company's share-issue-and-cash asset purchase report, dated July 2026. The sellers are three Guangdong state-linked shareholders: Hengjian Investment (25.00%), Chengfa Investment (7.50%) and Science City Investment (12.50%).
Monday 3 August 2026
Renesas plans to phase out Takasaki factory production and expand R&D focus

Renesas Electronics plans to gradually end production at its Takasaki factory in Japan over the next two to three years while strengthening research and development there. The move reflects wider supply-chain strain in legacy semiconductor manufacturing and could affect customers, workers, and global users of analog and power chips.

Monday 3 August 2026
South Korea accelerates LEO satellite ambitions, targets sovereign communications network by 2035
As Starlink's subscriber base has surpassed 12 million and rivals such as OneWeb and Amazon's Project Kuiper continue expanding their constellations, South Korea only officially launched its low-Earth orbit (LEO) satellite communications initiative in July 2026.
Monday 3 August 2026
India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility in Visakhapatnam, supporting New Delhi's broader effort to build a domestic semiconductor ecosystem beyond chip design.

Monday 3 August 2026
India expands chip talent pipeline amid surging global chip demand
India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply chains are global, and shortages in skilled engineers, fab workers, and packaging specialists can slow production, innovation, and investment worldwide.
Monday 3 August 2026
IBM and Sarvam team up on India's sovereign AI push

IBM and Sarvam have announced a collaboration to advance sovereign AI technologies in India, a move that could influence how governments and regulated industries worldwide deploy trusted artificial intelligence. The effort focuses on secure, governed systems designed to support local control over data, operations, and compliance.

Monday 3 August 2026
Dixon sees mobile, IT hardware, and component push lift export and margin outlook

Dixon Technologies said its push into displays, camera modules, SSDs, and telecom hardware could deepen domestic value addition, even as near-term margins stay under pressure from input costs and the end of mobile PLI 1 incentives. The company expects joint venture-led expansion with Vivo and Inventec, plus PLI 2 and exports, to support growth.

Monday 3 August 2026
Rising component costs, new Indian incentives, and export push shape Dixon's outlook
Dixon Technologies said rising component prices pressured margins in the first quarter of fiscal 2027. Still, strong order inflows, a shift toward higher-value manufacturing, and new policy support could help offset the hit. The company sees mobile volumes improving, exports rising, and component localization deepening across its expanding portfolio.
Monday 3 August 2026
India roundup: R&D hubs, domestic tooling, OSAT investments, and AI hubs are powering India’s chip push

India is expanding its semiconductor ambitions through new R&D centers, indigenous design tools, packaging facilities and AI infrastructure investments, aiming to strengthen domestic capabilities and reshape global technology supply chains.

Monday 3 August 2026
FICG launches Singapore-Malaysia dual-core strategy
FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions provider. FICG also signed an MOU with JTC, Singapore's government agency for industrial master planning and infrastructure development.
Monday 3 August 2026
Beijing's AI 'golden circle' draws Moonshot, Z.ai, US$14B in funding
Beijing is emerging as one of China's most prominent artificial intelligence clusters as competition in large language models intensifies. Moonshot AI's recently released open-source Kimi K3 model has climbed global open-source rankings, while Z.ai, DeepSeek, and other companies continue to expand. With talent, capital, policy support and technical resources increasingly concentrated around China's political decision-making center, Beijing is rapidly taking shape as a major AI hub.
Sunday 2 August 2026
MiniMax H3 pairs 2K video with native stereo audio in China's multimodal AI race
Chinese AI start-up MiniMax launched MiniMax H3 on July 31, expanding its position in multimodal generative AI as competition among China's model developers spreads beyond large language models into video, audio, and AI agents.
Sunday 2 August 2026
Xiaomi adds SkyNomad N90 and N70 with 370,000 deliveries still needed for 2026 target

Xiaomi has entered China's range-extended electric vehicle market with two large intelligent SUVs, expanding beyond battery-only models as it confronts slowing deliveries, renewed losses and intensifying competition from technology groups including Huawei and ByteDance.

Saturday 1 August 2026
Huawei's Kirin X90 Plus and XE90 power its lightest laptop and next foldable PC
Huawei has introduced two PC processors, the Kirin X90 Plus and Kirin XE90, alongside new HarmonyOS laptops designed to extend its in-house chip strategy across high-performance and ultra-light computing.