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Wednesday 19 August 2026
Nvidia H200 chips reach China as imports remain limited
ByteDance and Tencent have each received about 10,000 Nvidia H200 processors in mainland China in recent weeks, the Financial Times reported, marking the clearest sign yet that Beijing's import reviews are translating into meaningful deliveries after months of regulatory uncertainty.
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Thursday 20 August 2026
AMEC profit jumps 300%: China chip equipment maker expands beyond etch with US$520M plan
Advanced Micro-Fabrication Equipment Inc. China (AMEC) posted a 300% surge in first-half 2026 profit and announced a CNY3.5 billion (US$520 million) capacity expansion, accelerating its shift from an etch specialist into a broader semiconductor equipment supplier.
Thursday 20 August 2026
SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts see it as evidence that HBM competition is shifting into a customized, jointly developed phase.
Thursday 20 August 2026
Jusung, PSK China sales plunge over 40% amid China's chip self-sufficiency drive

Jusung Engineering and PSK each lost more than 40% of their China revenue in 2025. The similarity ends there.

Thursday 20 August 2026
Chinese SiC substrate maker SICC hits record Q2; 8-inch wafers top 50% of core revenue

SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting how the industry's migration to larger wafers is beginning to reshape SiC economics across electric vehicles and AI power infrastructure.

Thursday 20 August 2026
Analysis: Unitree IPO exposes the economics behind China's humanoid robot boom

Unitree Robotics' August 19 debut on Shanghai's STAR Market did more than crown China's first mainland-listed humanoid robot maker. It marked a shift in the industry from competition between robot brands to a harder contest over supply-chain cost, AI capability, and mass production.

Thursday 20 August 2026
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea, after the project cleared a provincial urban-planning review. The move advances a broader capacity buildout to meet growing AI memory demand.
Thursday 20 August 2026
LG acquires Mexico TV parts plant to cut production costs
LG Electronics has acquired a local TV parts factory in Mexico. The move strengthens cost competitiveness and tightens control over its supply chain at one of its key North American production bases. It also gives the company an existing manufacturing facility and inventory already suited to its TV operations, bringing production of selected components closer to final assembly.
Thursday 20 August 2026
Xiaomi's robotics ambitions reveal the next battleground for industrial AI

As artificial intelligence expands from digital environments into physical operations, embodied intelligence is emerging as a new frontier for technology companies. Xiaomi's latest earnings call offered a glimpse into how the company is approaching this field, with robotics positioned not as a standalone product category, but as a capability designed to enhance manufacturing, automation, and future industrial applications.

Thursday 20 August 2026
WRC 2026: Unitree GD01 mecha, Ubtech bionic U1 headline China's humanoid robot showcase

The 2026 World Robot Conference (WRC) recently opened in Beijing, with humanoid robots remaining the event's biggest focus. With China continuing to lead global humanoid robot shipments and the conference reaching new highs in scale each year, WRC has become a key showcase for humanoid robot makers to demonstrate their latest capabilities.

Thursday 20 August 2026
Nvidia and AMD chase US open model lead as China shifts race
Hugging Face's latest summer 2026 open model report says Chinese labs have continued to lead in frontier open-model parameter scale since 2026, while the US center of competition has shifted from model labs such as Meta and Google to chipmakers like Nvidia and AMD.
Thursday 20 August 2026
Fudan Microelectronics profit jumps 339%, FPGA localisation gains traction
Shanghai Fudan Microelectronics Group reported a sharp first-half earnings increase in 2026, helped by stronger semiconductor demand, rising sales across its chip portfolio and investment gains, while tightening global FPGA supply is creating fresh opportunities for Chinese suppliers.
Thursday 20 August 2026
CXMT planned to use Samsung process data to develop DRAM, ex-engineer says
A former Samsung Electronics researcher has testified that ChangXin Memory Technologies (CXMT) intended from its earliest days to develop DRAM using Samsung process data, an account that contrasts with the Chinese memory maker's description of its technology development in the prospectus for its recent Shanghai listing.
Thursday 20 August 2026
LG targets 100,000 hours of robot training data ahead of 2027 humanoid debut
LG Electronics is scaling up its robot training infrastructure with Nvidia, targeting 100,000 hours of real and synthetic data by the end of 2026 as it pushes its physical AI strategy toward commercialization. LG plans to use the data to improve its proprietary Robot Foundation Model (RFM) and unveil a bipedal humanoid in the first quarter of 2027, according to ETNews.
Thursday 20 August 2026
Solomon unveils AI vision tools for smart manufacturing at Automation Taipei 2026

AI vision company Solomon is presenting new factory automation tools at Automation Taipei 2026, including an agentic physical AI platform, AR smart wiring guidance, and a next-generation 3D vision camera. The demonstrations are aimed at smart manufacturing, autonomous robotics, and AI server assembly use cases.

Thursday 20 August 2026
Intel Malaysia packaging expansion draws HBM flows from Taiwan

South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according to SemiAnalysis ChipBook. The shift suggested that some HBM shipments previously sent to Taiwan for TSMC's CoWoS packaging might be redirected to packaging plants in Malaysia.