Samsung Electronics acquired four US silicon photonics patents from UK-based Rockley Photonics in September 2026, South Korea's Shinailbo reported on November 11, citing US Patent and Trademark Office (USPTO) records. The reported acquisition could strengthen Samsung's intellectual property portfolio in optical interconnect technology as it expands its silicon photonics foundry business to compete with TSMC.

Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer evaluations to follow, ZDNet Korea reported on November 10, citing an industry source familiar with the plans.

Ingentec’s consolidated revenue reached NT$1.329 billion (US$40.4 million) from January to October 2026, up 79.32% from the same period in 2025. However, October revenue fell 8.59% month-over-month and 18.37% year-over-year to approximately NT$130 million as shipments of specialty gases to Japan, South Korea, and domestic customers declined slightly.

Smaller electronics manufacturers are relying on the spot market for memory as major customers lock in future supply through long-term agreements, according to independent electronic components distributor Smith.

Advantech's South Korean business grew 67% in the first three quarters of 2026, as industrial equipment, networking and cloud infrastructure, and healthcare remained its largest local markets. Some South Korean customers and partners have moved edge AI solutions into mass production, while the company is looking to extend its industrial computing and software integration expertise into robotics and energy applications.

Malaysia's Prime Minister Anwar Ibrahim's comments supporting the one-China principle and the use of force to unify Taiwan continue to weigh on Taiwan-Malaysia ties nearly three months later, raising concerns over Taiwanese companies' willingness to invest in Malaysia.

China's leading smart-device original design manufacturer (ODM), Huaqin Technology, plans to invest CNY1 billion (approx. US$149.86 million) in a wafer foundry venture, strengthening upstream semiconductor ties while expanding its AI server and data center businesses.

Jiangsu HISI Semiconductor (HISIGK) has prepared 14 automated lithography systems for delivery across 300mm, 200mm and 150mm wafer platforms, expanding its specialty semiconductor equipment business in markets ranging from MEMS to AR optics and LED chips.

Qualcomm has identified Samsung Electronics and Micron Technology as its primary memory suppliers for certain products, including automotive applications, in its fiscal 2026 annual report. The disclosure was absent from the previous two years' filings and comes as Qualcomm's automotive revenue jumped 52%.

CATL is exploring lithium-air batteries as a long-term research direction, attracting attention to the prospect of electric vehicles travelling more than 2,000km (≈ 1,243 miles) on a charge. That range remains a theoretical scenario, with no announced production battery or vehicle test demonstrating it.

Grab and SoftBank Group plan to invest a combined US$1.85 billion in two AI infrastructure projects, including data centers, in Malaysia, as they seek to capitalize on growing demand for AI computing capacity across Southeast Asia.

China and the US have extended selected export-control, tariff, and maritime measures ahead of the Asia-Pacific Economic Cooperation (APEC) Economic Leaders' Meeting in Shenzhen on November 18-19. US President Donald Trump has said he expects to meet Chinese President Xi Jinping during the summit, though no bilateral meeting date has been formally announced.

Former colleagues and business associates describe Alice Huang as an executive skilled at turning relationships into commercial opportunities. Their accounts are now central to understanding how the former Megaspeed executive established credibility in AI infrastructure—and whether her access to Nvidia CEO Jensen Huang influenced hardware supply.

Japan's state-backed chipmaker Rapidus is facing mounting technological challenges that could delay its plan to begin mass-producing 2nm semiconductors by March 2028, potentially undermining Tokyo's efforts to rebuild its domestic advanced semiconductor manufacturing capabilities.