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Tuesday 6 October 2026
Analysis: China automakers' US entry paths remain open
The recent summit between US President Donald Trump and Chinese President Xi Jinping concluded without progress on automotive issues—namely, whether Chinese automakers might enter the US market or build manufacturing plants on American soil...
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Wednesday 7 October 2026
India nears 2GW of data center capacity, but its racks were built for a pre-AI power load
India is joining the top tier of Asia Pacific data center markets with a stock of facilities designed for a fraction of the power AI hardware draws. That gap is turning the country's build-out into a race for liquid cooling, power equipment, and high-density designs, not just floor space.
Wednesday 7 October 2026
Huawei's NPO bet challenges CPO's path to AI scale
Huawei is backing near-packaged optics (NPO) rather than co-packaged optics (CPO) for its next-generation AI infrastructure, arguing that NPO offers a better balance of cost, manufacturability, reliability and serviceability as optical interconnects move deeper into large-scale AI clusters.
Wednesday 7 October 2026
iRobot reenters Taiwan market after restructuring, unveils five new models
The global household cleaning robot market grew by double digits in 2025, making it a key area for smart home development and intense competition in smart home devices. After filing for bankruptcy at the end of 2025 and completing its restructuring in January 2026, US-based robot vacuum maker iRobot is targeting the Taiwanese market.
Wednesday 7 October 2026
Semicon 2.0 widens focus beyond fabs: Dassault Systèmes pitches virtual twins to India's chipmakers
Dassault Systèmes is pitching its virtual twin software as the link between India's chip design base and the factories and packaging plants now being built under the country's semiconductor mission. The French industrial software company is offering tools that simulate production before anything is built, as the government's Semicon 2.0 program widens support beyond fabrication to design, research, and talent.
Wednesday 7 October 2026
Amata sees Chinese factories in Thailand rising fivefold over 10 years
Thailand's industrial landscape may shift further toward China as global supply chains continue to move across Southeast Asia. More broadly, the trend highlights how lower costs, trade realignment, and investment incentives are reshaping manufacturing networks, while also raising questions about local supply chains, land use, and economic dependency.
Wednesday 7 October 2026
Canon courts India's chip projects as toolmakers jostle for an early foothold
India's young chip industry is becoming a contest among the world's largest semiconductor equipment makers, with Canon the latest to declare its interest. The race remains at an early, positioning stage, however, and has so far produced few confirmed orders.
Wednesday 7 October 2026
Rapidus adds Malaysian chip designers to its semiconductor network
Japan's Rapidus is widening its semiconductor push with help from four Malaysian IC design firms, a move that could strengthen chip-development support for customers worldwide. The partnership underlines how Malaysia is emerging as a key design hub, linking Japanese ambitions with global supply-chain and AI-chip demand.
Wednesday 7 October 2026
BOE chairman expected to meet Samsung executive as LCD panel prices rise
Chinese display makers have raised LCD panel prices as global TV makers head into the holiday season, raising costs for TV makers worldwide. BOE chairman Yanshun Chen is expected to visit South Korea in October 2026 and meet Samsung Electronics president Tae-moon Roh, with supply volumes and pricing set to dominate talks.
Wednesday 7 October 2026
Chunghwa Telecom, New Taipei fire department launch drone-based medical supply transport pilot program
Chunghwa Telecom's New Taipei operations division and the New Taipei City Fire Department signed a memorandum of understanding on October 6 to promote drone-based emergency blood transport. The pilot will use New Taipei's north coast and mountain routes as a testbed for an air logistics system aimed at improving emergency medical supply delivery in remote areas.
Wednesday 7 October 2026
Samsung Electro-Mechanics secures 2027 AI server MLCC demand as supply pressure builds
Samsung Electro-Mechanics (Semco) has secured another major AI server order, signing a KRW290 billion (about US$216 million) contract to supply multilayer ceramic capacitors (MLCCs) to an undisclosed global customer throughout 2027. The deal is its sixth disclosed long-term supply agreement this year.
Wednesday 7 October 2026
Analysis: Kioxia's NAND pedigree meets an AI-era SSD gap

Kioxia helped create the NAND flash industry, but AI is changing what leadership in memory looks like. The Japanese supplier is benefiting from record NAND demand and higher prices, yet rivals are capturing more value from enterprise solid-state drives (SSDs) for AI servers. Kioxia's challenge is therefore less about making advanced NAND than turning it into qualified products, hyperscaler relationships, and committed volumes before today's AI infrastructure boom hardens the supplier hierarchy.

Wednesday 7 October 2026
Smaller batteries, smarter roads: Honda tests different EV cost model
The complexity of vehicle economics surrounding surging battery costs has long put the EV industry in a difficult position, caught between power-delivery constraints and energy-efficiency demands.
Tuesday 6 October 2026
South Korea keeps sovereign AI contest on track, adds KRW4.7T frontier program after hours of confusion
South Korea's Ministry of Science and ICT said its Sovereign AI Foundation Model Project will run to completion as originally planned. The statement reversed, within hours, a vice minister's suggestion that the national-team AI competition would wind down as the government launches a new KRW4.7 trillion frontier AI program.
Tuesday 6 October 2026
Samsung secures customer backing for US$5B substrate expansion
Samsung Electro-Mechanics is investing KRW6.78 trillion (approx. US$5 billion) to expand FCBGA capacity in South Korea and Vietnam. The projects are backed by customer funding and medium- to long-term volume commitments, as demand for high-performance package substrates pushes Korean production lines toward high utilization.
Tuesday 6 October 2026
Huawei's Kirin 9050 Pro reveals new logic folding chip design
Huawei's Kirin 9050 Pro has been fully broken down by Chinese and overseas researchers, giving the market a closer look at the company's "LogicFolding" approach. Analysis from Geekerwan and die-shot images posted by Kurnal Insights show that the flagship SoC in the Huawei Mate 90 Pro Max uses two vertically stacked dies rather than a traditional single-plane chip design.