SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations for HBM4, underscoring both the strategic importance of advanced packaging equipment and rising complexity in the TC bonder supply chain amid a patent dispute between South Korean rivals Hanmi Semiconductor and Hanwha Semitech. The move reflects SK Hynix's broader push to diversify critical equipment suppliers while aligning with Nvidia's next-generation AI roadmap
China's prolonged price war in the auto market is taking a growing toll on profitability, and even BYD, the country's dominant electric-vehicle maker, is beginning to feel the strain. At the same time, the company's latest sales figures highlight the scale of its operations and the increasingly complex dynamics shaping its growth
Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market share from TSMC. The South Korean company plans to offer its Heat Path Block solution to third-party chip designers after validating the system in its upcoming Exynos 2600 processor, according to local media reports
