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Thursday 23 April 2026
Tencent, Alibaba circle DeepSeek in US$20 billion AI deal talks
Chinese tech giants Tencent Holdings and Alibaba Group are reportedly in talks to invest in AI startup DeepSeek, as the company seeks fresh funding that could value it at more than US$20 billion, underscoring intensifying competition and rising capital demands in the global AI sector
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Friday 24 April 2026
BizLink builds Southeast Asia manufacturing network with distinct roles across key markets

Driven by geopolitical shifts and supply chain restructuring, Southeast Asia has become an important destination for Taiwanese electronics manufacturers seeking to expand capacity and diversify risk. The rise of AI servers and semiconductor equipment markets has further strengthened the region's strategic position in global supply chains

Friday 24 April 2026
Interview: Taiwan-Korea cooperation not limited to memory giants; Hwaseong City aims to expand alliances
When it comes to Taiwan-Korea semiconductor cooperation, the outside world often focuses on orders and R&D between memory giants such as Samsung Electronics, SK Hynix, and TSMC. However, centered on Hwaseong City in Gyeonggi Province, South Korea, emphasizes that the potential of Taiwan-Korea cooperation goes far beyond this; both sides should establish more direct supply chain alliances at the SME level in equipment and components
Friday 24 April 2026
China chipmaker scales beyond security ICs into AI, automotive

Unigroup Guoxin Microelectronics reported steady growth in 2025, reinforcing its position across specialty ICs and security chips while accelerating expansion into AI, automotive electronics, and other emerging applications

Thursday 23 April 2026
SaiMemory wins NEDO backing for next-generation ZAM memory, partners with Intel

SaiMemory, a next-generation memory developer established by SoftBank, said on April 22 that its development project has been selected for subsidies by Japan's New Energy and Industrial Technology Development Organization (NEDO), with the government expected to cover roughly half of the initial development costs

Thursday 23 April 2026
China hands 11.5-year sentence in rare earth, semiconductor data leak case
China is intensifying investigations and enforcement against data leaks in critical sectors across its industrial supply chain, targeting areas such as rare earths, semiconductors, and digital data resources
Thursday 23 April 2026
Volkswagen outlines aggressive EV, AI and capacity reset ahead of Beijing show
Volkswagen's plan to launch 50 electric models by 2030 while cutting global production capacity signals major structural shifts for consumers, suppliers, and markets worldwide. The company is reallocating resources toward rapid localized development, AI-defined vehicles, and software moves that could reshape competition in China while forcing difficult trade-offs across Europe and other regions
Thursday 23 April 2026
Former Samsung Electronics researcher sentenced to 7-year prison term for leaking DRAM trade secrets
A former researcher at Samsung Electronics was sentenced to seven years in prison on April 22 by a South Korean court for leaking core semiconductor trade secrets to a Chinese competitor. The case highlights how chip-making technology is increasingly regarded by governments as a national security asset under strict protection
Thursday 23 April 2026
LG Display approves KRW1.1 trillion OLED infrastructure investment
LG Display approved an investment of KRW1.1 trillion (approx. US$740 million) to build OLED technology infrastructure. The move, running from April 22, 2026, to June 30, 2028, could affect global display supply chains, technology competition, and investment flows in advanced OLED development and will significantly broaden research partnerships worldwide
Thursday 23 April 2026
SK Hynix flags persistent HBM shortage as demand outpaces supply
SK Hynix said demand for high-bandwidth memory is expected to outpace supply for several years, underscoring persistent constraints in the AI memory market even as the company ramps up investment
Thursday 23 April 2026
Supermicro GPU smuggling prompts Nvidia to intensify supply chain audit
Following the recent smuggling indictment involving Supermicro co-founder Wally Liaw and others, Nvidia has significantly upgraded its global supply chain monitoring practices in recent months, according to an industry source. Already maintaining high visibility over customer lists, Nvidia now enforces stricter controls on shipments and transshipment processes, prompting multiple suppliers to expand their legal teams to comply with the intensified audits
Thursday 23 April 2026
Samsung and SK Hynix race to upgrade China chip plants as NAND demand surges
As the artificial intelligence boom reshapes global computing demand, the memory chip industry is entering a new phase of strain and restructuring — one in which both DRAM and NAND flash are seeing rapidly tightening supply
Thursday 23 April 2026
What Apple's new CEO inherits: AI, China, and a governance reckoning
Apple Inc. announced that John Ternus, Vice President of Hardware Engineering, will succeed Tim Cook as CEO in September, following Cook's 15-year tenure. The transition marks a pivotal moment as Apple navigates converging pressures from AI transformation and global operations, presenting a leadership test that spans technology, governance, and geopolitics
Thursday 23 April 2026
Interview: Seiko Epson outlines engineered future vision for 2035 amid geopolitical challenges
Amid volatile geopolitical tensions affecting Japan's components, manufacturing, and end-user sectors, Seiko Epson unveiled its Engineered Future 2035 long-term vision. The plan aims to shift Epson from a traditional printer maker into a value-driven company focused on technology innovation and engineering excellence, with improving return on invested capital as a core discipline
Thursday 23 April 2026
Zhen Ding breaks ground on new China site; Zhongji Innolight chairman attends to show support
Taiwanese printed circuit board (PCB) giant Zhen Ding Technology Group held a groundbreaking ceremony for the HD Campus of the "Zhen Ding Technology Group Huai'an Tech City" in Huai'an, China, on April 22. The new park plans to build facilities for high-density interconnect (HDI), modified semi-additive process (mSAP), and high-layer count (HLC) PCBs. Upon completion, the group's total number of factories across four major local parks will reach 23, further strengthening its manufacturing scale in the advanced PCB sector
Thursday 23 April 2026
Japan PC shipments peak on upgrade cycle, correction ahead
Japan's PC market delivered a standout performance in the fiscal year ending March 2026, but underlying demand signals point to a sharp reversal as upgrade-driven momentum fades