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Monday 27 July 2026
Jensen Huang backs open-weight AI as report says OpenAI, Anthropic lobby for tighter controls
Nvidia CEO Jensen Huang has backed open-weight artificial intelligence (AI) models in his first post on X, adding weight to a widening industry dispute over whether advanced AI should remain tightly controlled or be more broadly shared as competition with China accelerates.
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Tuesday 28 July 2026
Moonshot AI opens Kimi K3 weights, challenging US closed-model economics

Moonshot AI officially released the model weights for its Kimi K3 large language model on July 27, allowing developers to download, fine-tune, and deploy it.

Tuesday 28 July 2026
From models to chips: Anthropic chip ambitions pull Korea deeper into the AI silicon race
The push toward deeper sovereign control over the critical hardware stack underpinning AI models is gaining traction following news of Anthropic's outreach to SK hynix for supplies related to producing its own chips, spanning early design planning and key component procurement.
Tuesday 28 July 2026
EYEQ Lab completes 200mm SiC line validation with yield above 90%

South Korean power semiconductor maker EYEQ Lab has completed mass-production validation of its dedicated 8-inch, or 200mm, silicon carbide (SiC) line in Busan, achieving an average yield above 90%, ET News reported, citing industry sources.

Tuesday 28 July 2026
Energy storage unicorn expands in Baotou as China's industry chain accelerates integration
Inner Mongolia HyperStrong Technology is a major production subsidiary established by Beijing HyperStrong Technology in Baotou, Inner Mongolia. Its development offers a useful case study as competition intensifies among China's battery energy storage system integrators.
Tuesday 28 July 2026
China's Yunnan Germanium wins long-term InP wafer order as AI optical demand rises
Yunnan Germanium has secured a major supply deal for indium phosphide (InP) wafers, underscoring how AI data center buildouts are reshaping global demand for high-speed optical parts. The contract could bolster the company's revenue base, but execution risks, capacity expansion, and market swings will determine how much benefit reaches investors and customers worldwide.
Monday 27 July 2026
South Korea, AMD team up to integrate homegrown NPUs with CPUs and GPUs
South Korea and AMD have agreed to build and demonstrate heterogeneous AI computing infrastructure integrating AMD CPUs and GPUs with homegrown neural processing units, as Seoul seeks to give its AI chip industry practical reference models and a path into the global AI computing supply chain.
Monday 27 July 2026
CATL profit climbs 42%, but storage price pressure tests its global lead

CATL reported a 42% rise in first-half 2026 net profit as electric-vehicle and energy-storage battery shipments surged, although weaker margins and intense storage pricing highlighted the cost of sustaining its global lead.

Monday 27 July 2026
India's Paras Defense semiconductor unit to invest in Madhya Pradesh OSAT facility
Indian defense engineering company Paras Defense and Space Technologies said its semiconductor subsidiary, Paras Semiconductors, will invest INR62 billion (approx. US$643.79 million) to establish a semiconductor packaging and testing facility in Madhya Pradesh, as the country expands efforts to build a domestic chip manufacturing ecosystem, according to Reuters, The Economic Times, and Data Quest.
Monday 27 July 2026
India's NIELIT and SCL expand access to indigenous semiconductor design kit through eChipHub
India's National Institute of Electronics and Information Technology (NIELIT) and the Semiconductor Laboratory (SCL) have collaborated to make SCL's indigenous 1.2-micrometer Process Design Kit (PDK) available through the eChipHub platform, supporting semiconductor design education and research as part of the country's India Semiconductor Mission.
Monday 27 July 2026
IndieSemiC, Semtech partner on RISC-V IoT platform as India expands semiconductor design ecosystem
Gujarat-based fabless semiconductor startup IndieSemiC has partnered with US-based semiconductor supplier Semtech Corporation to develop a new RISC-V-based system-in-package (SiP) platform that combines general-purpose computing with long-range wireless connectivity for Internet of Things (IoT) applications, according to announcements by DeshGujarat and The Economic Times.
Monday 27 July 2026
Apple reportedly seeks 20% iPhone 18 OLED price cut despite costlier M16 panels

Apple is pressing Samsung Display (SDC) and LG Display (LGD) for steep price reductions on OLED panels for the iPhone 18 series as rising memory and storage costs increase handset production expenses.

Monday 27 July 2026
Weekly news roundup: Samsung and SK Hynix favor DDR5, Intel accelerates 18A, Alibaba deepens CXMT ties
AI infrastructure, memory and advanced chipmaking led this week's tech agenda, with Intel, Samsung, SK Hynix, CXMT, Alibaba and Foxconn reshaping capacity and supply chains. Below are the most-read DIGITIMES stories from the week of July 20-26, 2026.
Monday 27 July 2026
CXMT's US$8.6 billion IPO sets off new spending cycle across China's DRAM supply chain
China's leading DRAM producer CXMT listed on Shanghai's STAR Market on July 27 after raising about CNY57.9 billion (approx. US$8.6 billion), the board's largest initial public offering to date. The deal gives the memory chipmaker fresh capital to expand capacity, develop advanced processes and accelerate new products, while creating a substantial demand pipeline for China's semiconductor equipment, materials, packaging and memory-module suppliers.
Monday 27 July 2026
India's HCLTech plans US$4.4B AI data center
HCLTech said it plans to establish its first AI data center at the upcoming Odisha Sovereign AI Park, marking a further step in its expansion into the full-stack artificial intelligence market through a partnership with AI startup Sarvam and the Government of Odisha.
Monday 27 July 2026
Samsung bolsters energy team as chip projects test power supply
Samsung Group is recruiting current and former government energy officials for its in-house think tank as electricity infrastructure emerges as a key issue for its semiconductor expansion in Yongin and the proposed Honam chip cluster.