After mature-node price competition from 2023 to 2025, AI demand has spread from GPUs and HBM to power management ICs (PMICs), power components, networking chips and specialty processes. At the same time, aggressive price cutting by mature-node players in China has eased, pushing quotes for Taiwan foundries broadly higher since the start of 2026.
Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND core design, VLSI design, and mask design while listing experience in HBM, LPDDR, and GDDR among key qualifications.
Chinese artificial intelligence developer Z.ai (formerly Zhipu AI) plans to raise about US$5 billion through a Hong Kong share placement and convertible bond sale, which would give the company fresh capital for next-generation model development, computing infrastructure and business expansion.
Hua Hong Grace (HHGrace) has completed the share issuance for its acquisition of a 97.4988% stake in Huali Microelectronics (HLMC), strengthening the company's position in China's semiconductor foundry market.
