Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining its new direction. The company said complete China-based manufacturing supply chains have now been established for metal-oxide-semiconductor field-effect transistor (MOSFET) and logic IC products.

The 2nd World Humanoid Robot Games put China's rapid advances in robotics on full display — but beyond the record-breaking sprints and human-robot sports demonstrations, the event raised a tougher question for the industry: can humanoid robots move past the highlight reel and become reliable, economically viable workers?

Nexchip Semiconductor reported higher first-half 2026 revenue as broadening demand for CMOS image sensors, power management chips and display drivers diversified its product mix, even though profit declined.

GATE 2026 is set to bring together automakers, suppliers, and technology firms in Kuala Lumpur as Southeast Asia deepens its focus on electric vehicles, smart manufacturing, and industrial upgrading. The event's scale and timing could make it a key indicator of where the region's auto supply chains are heading next.

China Resources Microelectronics (CRM) and Hangzhou Silan Microelectronics (Silan), two of China's leading integrated device manufacturers, reported strong first-half 2026 results as firmer semiconductor demand, higher utilisation and improved product mix lifted earnings.

Global demand for AI and high-performance computing (HPC) has lifted investment returns for Taiwan-listed companies in China, with Foxconn continuing to lead the pack. According to CRIF, Foxconn's total China investment returns in the first half of 2026 reached NT$117.6 billion (US$3.7 billion).

The US has informally expressed dissatisfaction with the South Korean government's KRW800 trillion (US$578.5 billion) plan to build a semiconductor cluster in the country's southwest. The complaint comes as Washington escalates its demands for South Korean investment on American soil, and reflects frustration that Seoul is throwing its weight behind domestic chip projects while moving slowly on commitments in the US.

Kaynes Technology India and BOSGAME have signed a strategic memorandum of understanding to support BOSGAME's entry and expansion in India. The deal highlights how global hardware brands are increasingly looking to India for design, manufacturing, and customer support as the country's electronics ecosystem matures.

OmniVision Group reported a sharp drop in first-half 2026 profit as weakness in consumer electronics and automotive electronics weighed on its core image sensor business, even as machine vision, robotics and edge AI emerged as faster-growing sources of revenue.

Chinese analog and mixed-signal chipmaker Novosense Microelectronics has introduced the NSM350x series, a Hall-based magnetic encoder designed for high-precision angular measurement in robot joints and industrial motion-control systems, reports Sina Finance.

China has launched its largest-ever auto recall, involving about 4.27 million vehicles over risks tied to electronic door emergency unlocking. The action is led by Tesla and a group of Chinese EV startups, including Xiaomi, Leapmotor and Xpeng, while joint ventures backed by European, US and Japanese automakers were left out.

Infineon Technologies has agreed to acquire Bangalore-based C2i Semiconductors, a move that strengthens its position in power delivery for AI data centers and highlights India's growing role in chip design. The deal could shape how global operators manage rising energy demand, efficiency pressures, and next-generation computing workloads.

The AI infrastructure boom has long been defined by a race to secure GPUs, memory and power. Yet as cluster sizes continue expanding, another layer of the system is beginning to emerge as an equally decisive constraint: the optical links responsible for moving data fast enough between increasingly dense pools of accelerators.

The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical and economic limits of scalability.