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Thursday 22 January 2026
How Sony-TCL tie-up could chip away at Samsung's OLED advantage

Sony's decision to form a TV joint venture with TCL is being read in South Korea less as a routine corporate reshuffle than as a structural challenge to the country's long-held dominance in premium TVs and OLED panels. The deal has triggered unease not only about Sony's future role in TVs, but about whether Samsung Electronics can continue to dictate the industry's technological and competitive agenda

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Friday 23 January 2026
ASML leads chip equipment charge into advanced packaging
Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end processes as a new growth engine as artificial intelligence drives demand for more complex chip integration
Friday 23 January 2026
Analysis: How Howard Lutnick is redrawing the memory-chip map

US Commerce Secretary Howard Lutnick is driving a fundamental reordering of the global semiconductor supply chain. According to exclusive analysis from DIGITIMES analyst Luke Lin, the administration has shifted its pressure campaign away from advanced logic chips and toward memory, delivering a blunt ultimatum to South Korea's two dominant producers: build wafer fabs in the US or face tariffs of up to 100%

Friday 23 January 2026
South Korea-made EUV pellicles to be adopted at Samsung's Taylor fab
Industry sources stated that Samsung has signed equipment contracts and placed orders for extreme ultraviolet (EUV) photomask pellicle-related equipment for its Taylor fab with South Korean equipment supplier Fine Semitech Corp. (FST)
Friday 23 January 2026
HBF likely overtaking HBM market by 2038 as commercialization speeds up

High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting large-scale data training and real-time inference, said Joungho Kim, professor of electrical engineering at the Korea Advanced Institute of Science and Technology

Friday 23 January 2026
BizLink's early move to Malaysia highlights shifting dynamics in global supply chains
As businesses increasingly adopt an "Out of China" approach due to geopolitical pressures, BizLink Group's strategic choice to establish operations in Malaysia early on offers insights into Southeast Asia's evolving role in manufacturing. While many Taiwanese firms initially expanded into China, BizLink began with a modest three-person office in Malaysia. This decision has paid dividends as the country transitioned from a low-cost labor hub into a significant manufacturing center driven by the rise of AI, according to BizLink Group chairman Roger Liang
Friday 23 January 2026
NAND shortages help Phison to enter US server supply chain
Severe NAND flash shortages driven by AI servers have emerged, but have become a growth opportunity for Phison Electronics. Company CEO K.S. Pua said that the shortage is enabling the company to enter the US server supply chain and the enterprise storage market. According to Pua, large server customers have proactively approached Phison to help secure supply, while NAND flash prices continue to trend upward. Consumer and channel markets are unable to bear the cost pressure, pushing the storage industry into a phase of structurally strong long-term demand
Thursday 22 January 2026
MFTBC, Foxconn to form joint venture for e-bus manufacturing

Mitsubishi Fuso Truck and Bus Corporation (MFTBC), a major Japanese commercial vehicle maker, has announced to establish a joint venture with Taiwan-based Foxconn

Thursday 22 January 2026
EMS watch: Chinese EMS champions reshape their playbooks around AI hardware, autos, and global delivery
A cluster of China's leading electronics manufacturers and component suppliers is entering the new year with a clearer division of labor across the AI device wave, automotive electrification, and globalized manufacturing. Recent company filings, investor communications, and post‑autumn analyst commentary point to a common theme: growth is being pursued less through single-product cycles and more through platform capabilities—vertical integration, module-level design, and cross‑sector customer expansion—while capital market actions and overseas footprints are being positioned as strategic amplifiers
Thursday 22 January 2026
Chinese banks turn to satellites, boosting the country's commercial space industry

Since the start of 2026, China's commercial space sector has once again emerged as a focal point for both capital markets and industrial players. On one front, major Chinese banks have completed the launch of dedicated or jointly operated satellites, formally integrating satellite applications into financial risk management and digital operations. On another, privately owned aerospace companies are accelerating their push toward initial public offerings, underscoring how commercial spaceflight is moving more rapidly toward both capital-market validation and real-world applications

Thursday 22 January 2026
Commentary: China's NPI edge comes under pressure
Geopolitical uncertainty shows little sign of easing, driving continued adjustments across the global consumer electronics supply chain. In manufacturing, the industry is moving beyond simple capacity dispersion and entering a new phase marked by the geographic redistribution of engineering capabilities. Recent market reports that Google plans to relocate portions of new product introduction (NPI) work for select high-end smartphone models to Vietnam starting in 2026 have drawn close attention across the industry
Thursday 22 January 2026
Rising China-Japan tensions put semi materials in the spotlight

As tensions between China and Japan escalate over export controls on rare earths and semiconductor materials, China is accelerating efforts to build domestic production capacity—even as Japanese firms continue to dominate the global photoresist market

Thursday 22 January 2026
Lutnick warns memory chipmakers may face 100% tariffs without US production

Samsung Electronics and SK Hynix have been investing tens of trillions of won each year to expand memory production as the global market moves into a new upcycle. That spending now faces fresh pressure from the US semiconductor tariff policy, complicating long-term investment planning at the two companies

Thursday 22 January 2026
Tripod Technology targets over NT$5B in 2026 capex for Vietnam, China expansion

PCB maker Tripod Technology said full-year 2025 revenue reached a record high, and it expects stable momentum heading into 2026 despite ongoing inventory adjustments among automotive customers. Strong demand from server and memory module applications is driving a steady increase in utilization rates, allowing first-quarter operations to defy traditional seasonality and remain in line with the previous quarter's revenue level

Thursday 22 January 2026
Raana Semiconductors raises US$3 million seed round to develop indigenous silicon ingot growth systems
Raana Semiconductors Pvt. Ltd. (RSPL), an India-based company specializing in crystal growth systems and single-crystal materials, has raised US$3 million in a seed funding round, marking its first institutional capital raise. The pure equity round was led by Equirus Innovatex Fund and Artha Venture Fund, with participation from IvyCap Ventures, PointOne Capital, CIIE Initiatives (IIMA Ventures), and angel investor Garimella Laxminarayana. Valuation details were not disclosed, according to Inc42, Saure Energy, and BW Disrupt
Thursday 22 January 2026
India-based Paras Defence enters semiconductor packaging with new subsidiary
Paras Defence and Space Technologies Ltd. announced the launch of a new subsidiary, Paras Semiconductor Pvt. Ltd., marking the company's expansion into the semiconductor packaging and assembly sector. The move aims to address gaps in India's domestic capability for advanced semiconductor packaging, particularly for defence and strategic electronics applications