Bits + chips
China OSAT firms foraying into higher-end packaging fields
Julian Ho, Taipei; Willis Ke, DIGITIMES

China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment where they believe they can technologically catch up with Taiwan counterparts...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.