China OSAT firms foraying into higher-end packaging fields

Home Tech Chips + Components

Julian Ho, Taipei; Willis Ke, DIGITIMES Thursday 27 December 2018 0

China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment where they believe they can technologically catch up with Taiwan counterparts...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Email address

Passwords

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW users please REGISTER first.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Before Going to Press.