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Tuesday 20 May 2025
Nvidia courts ASIC allies with NVLink Fusion—so why is Broadcom still saying no?
At this year's COMPUTEX keynote, Nvidia CEO Jensen Huang unveiled NVLink Fusion, a new initiative to open the company's proprietary NVLink interconnect to third-party ASICs and CPUs...
Tuesday 20 May 2025
Huawei unveils HarmonyOS PCs: foldable design, full-stack control, cross-device ecosystem
Huawei, on May 19, 2025, launched its first personal computers powered by HarmonyOS, after five years of development involving more than 10,000 engineers. The MateBook Pro and MateBook...
Tuesday 20 May 2025
Xiaomi pledges CNY50 billion investment in chip design over next decade
Xiaomi founder and CEO Jun Lei announced on May 19 via Weibo that the company will unveil its first 3nm mobile system-on-chip (SoC), the "Xring O1," on May 22. He also revealed that...
Tuesday 20 May 2025
Xiaomi's XRing SoC: next HiSilicon breakthrough or Zeku-style flameout?
Years after launching the Pinecone Surge S1 in 2017, Xiaomi founder and CEO Lei Jun announced the company's return to in-house smartphone chip design. Its new self-developed SoC,...
Tuesday 20 May 2025
Qualcomm CEO talks agentic AI, entry into data center CPU market during Computex keynote
Qualcomm CEO Cristiano Amon discussed the current developments in the AI PC field during his keynote speech ahead of Computex 2025, mentioning several new application scenarios developed...
Tuesday 20 May 2025
Tariffs cloud notebook outlook, but mobile chip demand stays hot
Following the significant impact of reciprocal tariffs imposed by the US, the chip inventory status for two major consumer electronics products—notebooks (NBs) and mobile phones—has...
Tuesday 20 May 2025
From cold benches to courtroom benches: A tale of two chip visions
The year 2025 marks a significant moment for the Chinese-speaking semiconductor industry, presenting a striking contrast.
Tuesday 20 May 2025
Huawei widens lead in global telecom race, Western RAN giants retreat under pressure
As global telecom players across Europe, the US, Japan, and South Korea face mass layoffs and resource constraints, market contraction is accelerating. Meanwhile, Huawei is bucking...
Monday 19 May 2025
Qualcomm signs AI pact with Saudi Arabia's Humain, eyes return to data center CPU race
Qualcomm has signed a memorandum of understanding (MoU) with Riyadh-based AI firm Humain to co-develop next-generation technologies for AI data centers. The deal was unveiled during...
Monday 19 May 2025
Taiwan Mobile to launch crypto platform, telco rivalry in Web3 fintech heats up
Telecom operators in Taiwan are expanding their presence in the Web3 financial tech sector, with one of them set to launch a virtual asset exchange platform next week.
Monday 19 May 2025
Sino-American Silicon enters Indian solar market with Premier Energies venture
Sino-American Silicon Products Group has formed a joint venture with India's Premier Energies to produce silicon wafers for solar cells in India, acquiring a 26% stake in the new...
Monday 19 May 2025
China's AI appliance chaos: DeepSeek boxes flood market as prices swing 100x between full and distilled models
Since its viral breakout in February, DeepSeek has triggered a rush for all-in-one AI appliances across China's enterprise and government markets. But the boom has also unleashed...
Monday 19 May 2025
Zhen Ding posts 23% revenue growth, driven by China's IC substrate boom
PCB manufacturer Zhen Ding Technology posted a 23% year-over-year increase in consolidated revenue for the first quarter of 2025, marking a record high for the quarter. The company's...
Monday 19 May 2025
Computex 2025: Qualcomm and MediaTek set to emerge
Computex 2025 is set to open on May 20 in Taipei, with Qualcomm and MediaTek—two longtime rivals in the mobile chip sector—unexpectedly emerging as keynote headliners...
Monday 19 May 2025
South Korea intercepts SK Hynix HBM China-bound tech leak
South Korean authorities arrested a former subcontractor employee at Incheon International Airport for allegedly attempting to smuggle SK Hynix's proprietary high-bandwidth memory...
Wednesday 23 December 2015
Samsung PRO Plus 128GB microSD cards
Samsung Electronics has unveiled its PRO Plus 128GB microSD card series, which is built with company's MLC NAND flash solution. With the introduction of its new 128GB microSD card, Samsung provides consumers with a memory card solution for capturing heavy-loaded, high-resolution video, photography and multimedia contents for use in today's mobile devices. The PRO Plus 128GB microSD is the newest addition to Samsung's PRO Plus lineup, which was first introduced in 32GB and 64GB versions in May 2015. The 128GB microSD features the highest-quality MLC NAND flash memory and UHS-I Speed Class 3 (U3) and Speed Class 10 support, offering the industry's fastest speeds of up to 95MB/s and 90MB/s for read and write respectively, Samsung said. The new PRO Plus 128GB microSD is meant for use in high-end smartphones and tablets, as well as fulfilling the security, capacity, performance and environment requirements inherent in newly emerging audio and video consumer electronics, specifically action cameras and drones. The new memory card is equipped to handle storing and transferring professional-grade photos and 4K UHD video recording and playback. It can record up to three hours and 50 minutes of 4K UHD video or 16 hours and 20 minutes of Full HD video in action cameras without the need to change or replace the memory card. In addition, the PRO Plus 128GB microSD can store a maximum of 10,940 photos or 30,670 MP3 songs based on Samsung's estimated user settings and configurations. Samsung will now offer the new PRO Plus 128GB microSD memory card in more than 50 countries including China, Europe, Korea, the US and other regions.