Friday 28 April 2023
Avalue launching Intel Atom embedded industrial motherboards, EMX-EHLP, with Intel Celeron/Atom SoC BGA processor
Avalue Technology, a global industrial PC solution provider and an associate member of the Intel Internet of Things Solutions Alliance, is bringing the new Intel Atom Embedded Industrial...
Thursday 30 March 2023
IC backend firms urged to expand production capacity in Southeast Asia
IC backend houses are being encouraged to increase production capacity in Southeast Asia, especially for BGA packaging, according to industry sources.
Monday 20 March 2023
CIS packagers enjoy stable demand for high-end auto applications
BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with...
Thursday 19 January 2023
Wi-Fi 6E penetration in PCs to rise on new MacBook Pro adoption
The new 14-and 16-inch MacBook Pro models just unveiled by Apple both support the newest Wi-Fi 6E (802.11ax) wireless communication standard, which is expected to notably drive up...
Monday 3 October 2022
Asian automotive CIS, MCU vendors set to raise quotes on foundry cost increases
Asia's first-tier suppliers of car-use CMOS image sensors (CIS) and microcontroller units (MCU) have shown a relatively clear attitude that they would hike quotes to fully reflect...
Thursday 23 June 2022
Automotive CIS backend may incorporate RW technology
Like handset CMOS image sensors, automotive CIS will likely be built based on the backend wafer reconstruction technology for a shorter verification cycle, according to industry so...
Friday 1 April 2022
IC test interface vendors diversifying into non-handset chip segments
Taiwan's IC test interface specialists including Chunghwa Precision Test Tech (CHPT) are striving hard to strengthen deployments in multiple market segments beyond handsets as demand...
Monday 28 March 2022
IDMs, backend partners expanding automotive CIS capacity
International IDMs such as Onsemi and Sony are keenly expanding capacities for automotive CMOS image sensors (CIS) to meet ever-mounting demand for ADAS applications, and their backend...
Wednesday 1 December 2021
Supply chain cooperation crucial to address SiP challenges, says ASE VP
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
Wednesday 17 November 2021
Eternal Materials sees demand for high-end IC substrates remain strong
Eternal Materials, which specializes in resin materials and dry-film photoresists, continues to enjoy strong shipments for high-frequency and high-speed substrates, while seeing orders...
Thursday 7 October 2021
Packaging leadframe supply stays tight with order visibility clear till 2023
The supply of leadframes for chip packaging has been tight, with the visibility of orders from international IDMs for automotive and industrial applications extended to 2023, according...
Tuesday 24 August 2021
China OSATs strengthen QFN packaging capability for car chips
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Friday 11 June 2021
ASE Technology posts record revenues for May
ASE Technology has reported revenue grew 2.3% sequentially and about 18% on year to NT$42.27 billion (US$1.53 billion) in May 2021, a record high for the same month, and its January-May...
Summary of Tech Supply Chain News!
Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research
Meet the analyst: Operating system in AI era will be king, says DIGITIMES Research
Taiwan server industry experiences decline in 2023 revenues and shipments; poised to see growth in 2024, says DIGITIMES Research