A growing number of Taiwan-based network equipment suppliers have ramped up shipments of 5G CPE (customer premise equipment) products to the markets in Europe and the US starting...

Acer has announced its latest notebooks, monitors and projectors as well as its first Chromebook that is equipped with an Arm-based processor.

Micron Technology has announced the launch of uMCP5, which the company claims is the industry's first universal flash storage (UFS) multichip package with low-power DDR5 DRAM.

Notebook shipments are expected to grow over 20% on year in 2020 thanks to demand from stay-at-home activities in the wake of the coronavirus outbreak.

Qualcomm reportedly will team up with Asustek Computer to develop and launch its own-brand gaming smartphones at the end of 2020 at the earliest, according to industry sources.

Global notebook shipments are forecast to rise at a CAGR of 0.9% from 2020 to 2025, according to Digitimes Research's latest five-year forecast for the notebook industry.

First-tier chip designers and PC brand vendors have begun cooperation to develop notebooks with integrated antenna-in-package (AiP) modules to support both sub-6GHz and mmWave 5G...

TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...

Both Intel and AMD reportedly have resumed shipments to Huawei after obtaining export permits from US authorities, but Taiwan's IC substrates do not expect their revenues to receive...

TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...

Building on bullish growth in first-quarter 2020 in weak market conditions, the world's top-10 semiconductor suppliers managed to continue their revenue growth at a rate of 2.4% in...

Taiwan's leading III-V semiconductor player Win Semiconductors is gearing up its foundry support for Qualcomm after having stopped shipments to Huawei/HiSilicon, as the US chipmaker...

Executives at Qualcomm have paid visits to Taiwan-based pure-play foundries for the purpose of securing capacity support if deliveries from China's Semiconductor Manufacturing International...

After nearly two months of negotiations and press reports that a blockbuster deal was in the works, Nvidia this week announced a US$40 billion agreement to buy Arm from financially...

SiP substrates adopted for processing core processors and peripheral components for new Apple Watch models reportedly will be all supplied by three Taiwanese makers, Unimicron Technology,...

Qualcomm's next-generation mid-tier 5G SoC solutions will come with RF360's second-generation 5G GaAs power amplifiers (PA) that will enable handset makers to roll out new 5G phones...

Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...

System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.

MediaTek and Qualcomm have introduced their new AI-capable mobile SoC chips designed specifically for gaming smartphones - the Helio G95 and Snapdragon 732G respectively.

TSMC has already scaled up its 7nm process output to 130,000 wafers monthly ahead of schedule, with the monthly production set to climb further to 140,000 units at the end of this...

Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...

Taiwan backend houses are cautious about business prospects for the fourth quarter of the year thanks to upcoming disruptions in MediaTek shipments to China's Huawei under the latest...

Asustek Computer continues to see losses generated by its handset business narrow, and is eyeing the business' return to profitability in 2021, according to market sources.

Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...

The US trade restrictions on Huawei are set to affect the overall shipments of 5G mobile APs to the Chinese market in fourth-quarter 2020, and to significant change the landscape...