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Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts

, Taipei
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Credit: DIGITIMES

Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry. At an August 31 pre-event briefing, the group said the changes are accelerating work in AI computing, advanced process technology, heterogeneous integration, and quantum computing.

The event will feature what Semiconductor Equipment and Materials International (SEMI) president of Taiwan and global chief marketing officer Terry Tsao described as its most valuable technology forums and the CEO Summit in the AI era, with AI leaders from Google, Microsoft, and Meta scheduled to speak in Taiwan. The speaker roster also spans IC design, foundry, outsourced semiconductor assembly and test, equipment, and materials, bringing together partners across the supply chain.

SEMI said major companies including Nvidia, Marvell, Taiwan Semiconductor Manufacturing Company, United Microelectronics Corporation, Samsung Electronics, SK Hynix, Cisco Systems, Micron Technology, Foxconn, and Delta Electronics are expected to attend. Driven by cloud service provider demand, the conference will focus on co-packaged optics, silicon photonics, 3D IC, high-bandwidth memory, fan-out panel-level packaging, chiplets, complementary field-effect transistors, gate-all-around, backside power delivery, and hybrid bonding.

The group also projected that the global semiconductor market will exceed US$2 trillion by 2030, with AI infrastructure serving as the main growth engine. It expects the global wafer fab equipment market to reach US$220 billion by 2028, the testing equipment market to hit US$23.5 billion, and the packaging equipment market to rise to US$10 billion by 2028.

SEMI added that the global semiconductor materials market is forecast to grow at a double-digit pace in 2026 and 2027, reaching US$92 billion in 2027. Taiwan is expected to be the largest market at US$28 billion, or 30% of the global total. Globally, wafer-processing materials and packaging materials are projected at US$56.6 billion and US$35.3 billion, respectively. SEMI's senior director of market intelligence, Clark Tseng, said Taiwan’s integrated ecosystem across process, packaging, testing, and materials is helping position the market at the center of the industry’s AI transition.

Article edited by Ysi Chen