Flora Wang joined DIGITIMES in 2024 and covers PCB, passive components, and semiconductor packaging and testing industries. She holds a Master's degree in Digital Journalism from Goldsmiths, University of London.
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains for silicon photonics (SiPh), AI...
ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company had built over the past few years was...
ADATA Technology is stepping up discussions in Thailand amid rising global demand for AI computing centers. Chairman Simon Chen's visit highlights how Southeast Asia could benefit from expanding AI infrastructure,...
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the...
Strong demand for AI servers is driving higher shipments of advanced printed circuit board (PCB) products in Taiwan, but it is also tightening supply of key materials and resources, adding fresh uncertainty to the...
Fulltech, a glass fiber yarn and cloth maker, said at its 2026 annual general meeting that demand for next-generation AI servers and high-speed switches is lifting specifications and demand for upstream PCB materials....
Demand for high-end fiberglass cloth is surging on the AI boom, and orders from copper-clad laminate (CCL) customers are leaving the world's two largest suppliers, Nittobo and Taiwan Glass, short of capacity. In...
Demand in the passive component market has rebounded alongside the rapid buildout of AI data centers. While Japanese suppliers continue to lead in technology, their capacity expansion has struggled to keep pace with...
Demand in the passive components market is recovering significantly, lifting operating momentum at Taiwan's two leading suppliers, Yageo and Walsin Technology. Average book-to-bill ratios at both companies have risen...
MPI Corporation, a major probe card supplier, said AI demand is tightening supply across the probe card market and extending order visibility, with the company considering a prepayment mechanism to guarantee customers...
Japanese capacitor manufacturer Nichicon has announced a broad price hike for aluminum electrolytic capacitors (e-cap), as order volumes for some products have exceeded the company's existing production capacity. The...
A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in the capital market. This has once drawn...
WinWay Technologies has bought real estate in California for US$2.28 million to create a local manufacturing and office base, a move that underscores how Asian suppliers are expanding closer to US customers as demand...
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years,...
INPAQ Technology, a unit of PSA Walsin Technology, reported that revenue and profit in the first quarter of 2026 fell year on year, citing a supply-demand imbalance in the memory market and sharp raw material price...
Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive electronics, and future device upgrades lifts orders while memory shortages weigh on...
Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward profitability as demand builds across high-performance computing and emerging...
Linkotech said its fan-out panel-level packaging rollout is showing early momentum, with certification from a North American low-Earth-orbit satellite communications customer and first equipment deliveries completed in...
Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related chips, and rising use of advanced packaging capacity. The result suggests continued...
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift...
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end...
Chang Wah Technology has declared that the global semiconductor inventory correction has ended, with demand recovering in industrial control, networking, and AI data center power management. The shift signals firmer...
WinWay Technologies said shipments linked to artificial intelligence, high-performance computing, central processing units, and application processors lifted consolidated revenue to NT$1.073 billion (US$33.9 million) in...
Co-Tech said on June 8, 2026, that Nvidia has directly approached it to discuss long-term capacity planning for high-end HVLP4 copper foil, as AI GPU and ASIC demand accelerates and a structural supply bottleneck looms...
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