Flora Wang joined DIGITIMES in 2024 and covers PCB, passive components, and semiconductor packaging and testing industries. She holds a Master's degree in Digital Journalism from Goldsmiths, University of London.
PCB maker Eiso Enterprise posted strong growth in the third quarter of 2026 as AI server backup battery unit (BBU) products began shipping, driving demand for high-end printed circuit boards (PCBs) and lifting the...
Flexium Interconnect chairman Walter Cheng said the company has emerged from the toughest operating downturn of the past two years and expects AI orders for smart glasses and infrastructure to accelerate in 2027, which...
Panasonic Industrial Devices Materials Taiwan's Hukou plant experienced an explosion and fire early on November 4, injuring five employees and leaving two others unaccounted for...
Universal Scientific Industrial (USI), a subsidiary of ASE, plans to launch Wi-Fi 8 (IEEE 802.11bn) products in the first quarter of 2027, building on its experience developing and integrating Wi-Fi 6E and Wi-Fi 7...
AMD and Nvidia have separately invested in supply-chain capacity expansion, making substrates, packaging, and testing key priorities as AI demand diversifies...
Rapid growth in AI-driven demand is placing new pressure on the printed circuit board (PCB) supply chain, with equipment constraints, shorter product development cycles and overlapping capacity commitments emerging as...
The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron, STATS ChipPAC, Wistron, and market...
Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering an open-ended shortage of...
PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in AI servers, high-speed optical...
Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications...
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance computing (HPC) will require...
AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years...
Zhen Ding Technology Holding announced that it, Elite Material (EMC), Taliang Technology, and Topoint Technology will jointly invest a total of NT$60 million (approx...
ASE, together with National Cheng Kung University (NCKU), National Sun Yat-sen University (NSYSU), and National Chung Cheng University (CCU), unveiled 18 technology research projects on October 16, focusing on advanced...
Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene (PTFE) and naming seven...
Kingboard Laminates Holdings (KB Laminates), a leading Chinese manufacturer, announced its eighth price increase of 2026 on October 13, raising prices by 15% for laminates and prepreg (PP) made with style 2116 or...
IC substrate maker Xinxing experienced a fatal workplace accident at its Yangmei plant on October 13, prompting the Taoyuan City Labor Inspection Office to order a partial shutdown in the affected area...
King Yuan Electronics (KYEC) has signed a prepayment agreement with Nvidia to support its wholly owned US subsidiary, AeternZ, in building local testing capacity, giving Nvidia early access to AI chip testing capacity...
Taiwanese semiconductor testing services provider King Yuan Electronics (KYEC) is expanding its US footprint, with its board approving an advance payment agreement with Nvidia...
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