Semicon Taiwan 2026

Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow".

Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow". Pre-event forums began in August 31.

Over 100,000 industry professionals from 65 countries participated in this year's event.

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IN THE NEWS

Monday 21 September 2026

Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...

Thursday 17 September 2026

Samsung bets on zHBM as 2.5D memory nears its limits

Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...

Monday 14 September 2026

DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker

ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...

Monday 14 September 2026

Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan

As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial deployment...

Monday 14 September 2026

Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects

As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement...

Saturday 12 September 2026

ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs

Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.

Friday 11 September 2026

DAS Expands in Taiwan and Unveils World First at SEMICON

DAS Environmental Experts continues to expand its capabilities in Taiwan and is presenting another new product at SEMICON Taiwan. Against the backdrop of ongoing investments...

Friday 11 September 2026

Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026

Toward Technologies, Inc. concluded its participation in SEMICON Taiwan 2026, held from September 2 to 4 at Taipei Nangang Exhibition Center Hall 1. Under the theme "RELAY,...

Friday 11 September 2026

d-Matrix brings Raptor chips to Nvidia racks as falling token prices pressure GPU economics

AI chip startup d-Matrix is adopting Nvidia's NVLink Fusion technology to bring its next-generation Raptor inference processors into Nvidia MGX racks, giving the company a path into...

Thursday 10 September 2026

AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand

AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...

Wednesday 9 September 2026

Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

Tuesday 8 September 2026

ViTrox rides AI demand, expands Taiwan push as Malaysia semiconductor base grows

After several years away from SEMICON Taiwan, Malaysia-based inspection equipment maker ViTrox returned to the show this year and has already confirmed plans to exhibit again next...

Tuesday 8 September 2026

Infineon COO leaves a US fab open, says GlobalFoundries, ESMC already cover it

Infineon COO Alexander Gorski said the company is balancing in-house production, outsourcing, and global expansion as supply-chain resilience becomes a key customer requirement. In...

Tuesday 8 September 2026

Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission

As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...

Tuesday 8 September 2026

FitTech shifts from LED to optical communications, eyes InP relief

FitTech is pivoting away from the crowded LED market into optical communications, with outsourced chip testing and sorting orders set to rise month by month from the third quarter...

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