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Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key

Rebecca Kuo, analysis

Apr 29, 2026, 07:57 0

Credit: DIGITIMES

Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level to panel-level, bringing fan-out panel-level packaging (FOPLP)...

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