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Wednesday 30 September 2026
Column: Memory and logic collide as AI shifts the balance
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge that has shaped nearly half a century of semiconductor development.
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Tuesday 29 September 2026
Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with a pledge to invest more than US$250 billion in the US by 2035. The fund is designed to give Micron an early look at technology shifts, position it for next-generation AI architectures, and strengthen its strategy to reduce memory-cycle volatility.
Tuesday 29 September 2026
Column: Beyond Zero Trust – why AI supply chain resilience needs a plan B
Artificial intelligence is rapidly entering enterprise operations, blurring the lines between cybersecurity and supply chain management. In the AI era, Zero Trust is no longer only about who can access a system. Enterprises must also ask whom and what they depend on, how concentrated those dependencies are, and what happens when a critical link fails.
Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging. In the second part of his interview with DIGITIMES, Dr. Shin-Puu Jeng, chairman of IMAPS and a former TSMC executive, shared how TSMC transformed CoWoS from a niche lab concept into an industry standard.
Tuesday 29 September 2026
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC advanced packaging executive, reflected on the early development of CoWoS. In the first of this two-part series, Jeng details how a critical thin-interposer crisis forced TSMC and Xilinx to innovate, laying the foundation for modern advanced packaging.
Tuesday 29 September 2026
Analysis: Elon Musk's AI safety push clashes with regulation
Global AI has entered a period of dramatic turmoil, with leading researchers warning that top labs are "gambling with our lives" and one Anthropic safety researcher saying there is more than a 10% chance AI will wipe out humanity within the next 10 years. That pressure has pushed Anthropic CEO Dario Amodei and OpenAI CEO Sam Altman into rare agreement: slow model development.
Monday 28 September 2026
Column: For physical AI, maps are turning into memory
A robot that can map a factory floor still cannot necessarily find the box it has been asked to move, or remember what it saw on its last visit. For autonomous robots, building the map is increasingly just the beginning. What comes next — searching for objects, navigating to specified locations, remembering what the robot has seen, and retrieving that information for model reasoning in complex environments — is where the new applications and challenges lie.
Saturday 26 September 2026
DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders
China's two leading memory suppliers are moving to raise capital and expand output as demand for chips grows, a shift that could reshape the country's domestic supply chain. Their efforts reflect a new stage for the sector, but the long-term test will be whether fresh funding can translate into stronger technology, higher yields, and wider customer adoption.
Saturday 26 September 2026
Interview: Taiwan's H2U helps companies manage employee health with AI, eyes third markets with South Korea
When companies discuss ESG, they often emphasize environmental issues and compliance while paying less attention to employee health, a key component of the social dimension, according to Saxon Chen, founder and CEO of Taiwanese digital health technology company H2U Corp.
Friday 25 September 2026
Interview: GMI Cloud bets on Taiwan as a proving ground for global AI expansion
GMI Cloud is making Taiwan a key part of its global AI infrastructure expansion, with a US$500 million investment in an AI factory powered by Nvidia's Blackwell GPUs. Announced in late 2025, the facility is expected to deploy roughly 7,000 GPUs and serve customers including Trend Micro and Wistron.
Friday 25 September 2026
From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors
India's new semiconductor incentive regime is putting more capital at risk for manufacturers, but the first wave of investment commitments suggests lower subsidies have not stopped companies from considering fresh projects.
Thursday 24 September 2026
Commentary: Apple's M8 Ultra AI server plan could pull Apple Silicon into Nvidia's enterprise infrastructure game
After more than a decade away, Apple may be preparing to return to the enterprise server market. According to The Information, as reported by Reuters, the company is developing an enterprise AI server powered by its planned M8 Ultra chip and has discussed adopting Nvidia's NVLink Fusion interconnect technology.
Thursday 24 September 2026
Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus
Ahead of the Trump-Xi summit, the key semiconductor question is no longer simply how much Nvidia hardware Washington will allow China to buy.
Thursday 24 September 2026
Trump-Xi pre-summit watch: China charts a sovereignty-first path for frontier AI
When Donald Trump and Xi Jinping discuss artificial intelligence, the deeper divide may not be over whether AI needs rules, but over what those rules are designed to protect.
Wednesday 23 September 2026
Commentary: Zhengfei Ren rumors expose a deeper chill across China's tech sector
Online rumors that Huawei founder Zhengfei Ren and his family had disappeared from public view have reignited concern over the fate of Chinese technology executives. Ren's younger daughter, Annabel Yao, appeared at a Beijing press conference on September 14, but China's new exit-and-entry rules took effect the next day, drawing fresh attention to executives who have fled, vanished, or faced restrictions.
Wednesday 23 September 2026
Analysis: Foxconn's EV push moves beyond demo and toward scale
Foxconn Group's electric vehicle business is entering a new phase as it shifts from proving the concept to preparing for mass production and wider regional expansion. The change could reshape Taiwan's auto industry and strengthen Foxconn's case as a cross-border EV manufacturer with ambitions far beyond its home market.