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Thursday 1 October 2026
Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion
China's rapid expansion of AI applications is driving a fresh wave of data center construction. SemiAnalysis estimates that the country has already delivered more than 24GW of data center capacity and will remain above that level by the end of 2026, making China the world's second-largest data center market after the US.
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Wednesday 30 September 2026
DIGITIMES Insight: AI is emerging as the new growth anchor in the mobile communications industry
South Korea's leading telecommunications operator, SK Telecom (SKT), recently established SK Hyper and SK Horizon in quick succession. The moves mark a pivotal shift for telecommunications AI, signaling a transition from internal operational optimization toward full-scale infrastructure monetization.
Wednesday 30 September 2026
Interview: iFLYTEK Medical sees clinical integration as key to healthcare AI expansion in South Korea
Xunfei Healthcare (iFLYTEK Medical), the healthcare AI arm of China's iFlytek, is using its Spark Medical Large Model to support diagnosis and medical record generation while tackling challenges including clinical workflow integration, differences in care settings, and model hallucinations. It also hopes to bring its experience from China to South Korea through local partnerships.
Wednesday 30 September 2026
Commentary: What risks does China's DRAM capacity face amid tightening market?
China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
Wednesday 30 September 2026
Commentary: Garmin returns to OLED, putting Micro LED on notice
Garmin's decision to offer OLED options but no Micro LED version in its new flagship smartwatches, the fenix 9 and fenix 9 Pro, has revived debate over whether the emerging display technology is ready for sustained commercial competition. The shift comes about a year after Garmin launched the world's first Micro LED smartwatch, the fenix 8 Pro Micro LED in September 2025.
Tuesday 29 September 2026
Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with a pledge to invest more than US$250 billion in the US by 2035. The fund is designed to give Micron an early look at technology shifts, position it for next-generation AI architectures, and strengthen its strategy to reduce memory-cycle volatility.
Tuesday 29 September 2026
Column: Beyond Zero Trust – why AI supply chain resilience needs a plan B
Artificial intelligence is rapidly entering enterprise operations, blurring the lines between cybersecurity and supply chain management. In the AI era, Zero Trust is no longer only about who can access a system. Enterprises must also ask whom and what they depend on, how concentrated those dependencies are, and what happens when a critical link fails.
Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging. In the second part of his interview with DIGITIMES, Dr. Shin-Puu Jeng, chairman of IMAPS and a former TSMC executive, shared how TSMC transformed CoWoS from a niche lab concept into an industry standard.
Tuesday 29 September 2026
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC advanced packaging executive, reflected on the early development of CoWoS. In the first of this two-part series, Jeng details how a critical thin-interposer crisis forced TSMC and Xilinx to innovate, laying the foundation for modern advanced packaging.
Tuesday 29 September 2026
Analysis: Elon Musk's AI safety push clashes with regulation
Global AI has entered a period of dramatic turmoil, with leading researchers warning that top labs are "gambling with our lives" and one Anthropic safety researcher saying there is more than a 10% chance AI will wipe out humanity within the next 10 years. That pressure has pushed Anthropic CEO Dario Amodei and OpenAI CEO Sam Altman into rare agreement: slow model development.
Monday 28 September 2026
Column: For physical AI, maps are turning into memory
A robot that can map a factory floor still cannot necessarily find the box it has been asked to move, or remember what it saw on its last visit. For autonomous robots, building the map is increasingly just the beginning. What comes next — searching for objects, navigating to specified locations, remembering what the robot has seen, and retrieving that information for model reasoning in complex environments — is where the new applications and challenges lie.
Saturday 26 September 2026
DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders
China's two leading memory suppliers are moving to raise capital and expand output as demand for chips grows, a shift that could reshape the country's domestic supply chain. Their efforts reflect a new stage for the sector, but the long-term test will be whether fresh funding can translate into stronger technology, higher yields, and wider customer adoption.
Saturday 26 September 2026
Interview: Taiwan's H2U helps companies manage employee health with AI, eyes third markets with South Korea
When companies discuss ESG, they often emphasize environmental issues and compliance while paying less attention to employee health, a key component of the social dimension, according to Saxon Chen, founder and CEO of Taiwanese digital health technology company H2U Corp.
Friday 25 September 2026
Interview: GMI Cloud bets on Taiwan as a proving ground for global AI expansion
GMI Cloud is making Taiwan a key part of its global AI infrastructure expansion, with a US$500 million investment in an AI factory powered by Nvidia's Blackwell GPUs. Announced in late 2025, the facility is expected to deploy roughly 7,000 GPUs and serve customers including Trend Micro and Wistron.
Friday 25 September 2026
From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors
India's new semiconductor incentive regime is putting more capital at risk for manufacturers, but the first wave of investment commitments suggests lower subsidies have not stopped companies from considering fresh projects.
Thursday 24 September 2026
Commentary: Apple's M8 Ultra AI server plan could pull Apple Silicon into Nvidia's enterprise infrastructure game
After more than a decade away, Apple may be preparing to return to the enterprise server market. According to The Information, as reported by Reuters, the company is developing an enterprise AI server powered by its planned M8 Ultra chip and has discussed adopting Nvidia's NVLink Fusion interconnect technology.