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Monday 19 October 2026
DIGITIMES Insights: SpaceX moves closer to independent mobile network as Starlink expands spectrum holdings beyond satellites
SpaceX announced on October 8, 2026, that it would acquire US 800MHz low-band spectrum licenses held by Grain Management, covering up to 14MHz of paired bandwidth. The transaction remains subject to approval by the Federal Communications Commission (FCC).
LATEST STORIES
Sunday 18 October 2026
Exclusive: EnterpriseSG positions Singapore's semiconductor SMEs for bigger roles in global chip supply chains
Singapore is targeting high-value semiconductor manufacturing, advanced packaging, and silicon photonics, building on its strengths in engineering, precision manufacturing, and reliability, according to Zeng Yi Wong, assistant managing director for manufacturing at Enterprise Singapore (EnterpriseSG).
Saturday 17 October 2026
Singapore's AI bet shifts from model race to deployment, resilience and trusted adoption
Singapore is moving its AI strategy beyond pilot-heavy experimentation toward a more deployment-focused model centered on enterprise adoption, sector transformation and resilient access to compute.
Saturday 17 October 2026
Interview: SEMI CEO sees US$3 trillion chip industry by 2035, as trusted partners reshape supply chain
The semiconductor industry reached the US$1 trillion revenue milestone several years earlier than originally forecast, and with growth driven by AI and quantum computing, reaching US$2 trillion by 2035 is entirely achievable, SEMI President and CEO Ajit Manocha told DIGITIMES in an exclusive interview at SEMICON West 2026.
Friday 16 October 2026
DIGITIMES Insights: China's automakers pursue three humanoid robot strategies as EV supply chains offer 60% overlap
Chinese automakers are accelerating their expansion into humanoid robotics, leveraging artificial intelligence (AI) technologies, electric drive systems, and supply chain resources developed through their automotive businesses, according to DIGITIMES Intelligence.
Friday 16 October 2026
Analysis: TSMC's chipmaking edge strengthens C.C. Wei's hand — from advanced-node capacity to Musk's Terafab
TSMC reported record earnings for the third quarter of 2026 and forecast a further 15% increase in fourth-quarter revenue, putting full-year US dollar revenue growth on course to reach 44%. Yet supply chain sources say the earnings call carried a more consequential message: TSMC's increasingly explicit assertion of the bargaining power afforded by its lead in advanced process technology and manufacturing scale.
Friday 16 October 2026
Interview: The AI economy needs US$6T in funding — but from where?
AI is clearly making an enormous impact on the global economy, with capabilities extending from language chatbots to agentic teams and the physical realm within just a few years. A new report by consulting firm Bain takes stock of AI's effects on businesses so far and projects how it could shape the near future.
Thursday 15 October 2026
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding and hybrid bonding technologies. Xu Songyu, head of wireless terminal chip product management at Huawei's semiconductor business, said the company now sees a sustainable development path for Kirin processors over the next decade.
Thursday 15 October 2026
Column: 3D memory could redraw chip competition, weaken US sanctions on China
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D NAND with 128 layers or more, and restrictions on support provided by US persons.
Thursday 15 October 2026
Analysis: Apple HomeView faces hurdles in smart-home adoption
Apple launched the HomeView smart display at its "Welcome Home" event on October 13, priced at US$299. It's scheduled to debut in eight countries: the US, the UK, Canada, Australia, New Zealand, India, Singapore, and South Africa, on November 13. Featuring a 7-inch square display and an A18 chip, the device comes in desktop and wall-mounted versions and centers on a new Siri AI that Apple positions as a smart voice-control hub for the home.
Thursday 15 October 2026
Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem
GlobalFoundries (GF) has reached a multiyear manufacturing agreement with TSMC to expand silicon interposer capacity at its Malta fab in New York, supplying TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced-packaging ecosystem. The agreement is expected to be worth US$2 billion over an initial five-year term.
Thursday 15 October 2026
Analysis: Elon Musk's Terafab chases 10 chip iterations a year — can it rival TSMC?
Speaking to more than 2,000 Tesla owners and investors at the X Takeover event held at Tesla's Gigafactory in Austin, Texas, on October 11, Elon Musk made a candid admission: "To be clear, I don't know how to make chips." He immediately followed it with a declaration: "We'll figure it out."
Thursday 15 October 2026
Commentary: AI power demand pushes Taiwan's energy industry toward integrated systems
Energy Taiwan 2026 showcases an energy industry increasingly focused on integration, flexibility, and real-world deployment, as Taiwan balances its net-zero ambitions with rising electricity demand from artificial intelligence (AI), high-performance computing, and advanced manufacturing.
Wednesday 14 October 2026
Analysis: China's EV rebate cut pushes exporters from volume to value
China's planned cut to export tax rebates for new energy vehicles could ripple through global auto markets, intensifying pressure on low-cost exporters while reshaping trade tensions with Europe. The move signals a wider rollback of industry support and may accelerate consolidation among weaker carmakers and raise prices for some overseas buyers.
Tuesday 13 October 2026
Column: From 3D NAND to 3D DRAM — how vertical stacking is reshaping memory chip manufacturing
After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process node. Capacitive coupling between the floating gates of adjacent memory cells increasingly disrupted their threshold voltages, making stored data harder to read reliably. The problem became particularly acute with the adoption of triple-level cell (TLC) NAND, which requires precise threshold-voltage detection. Changes in the charge stored by neighbouring cells could alter those voltages, making further planar scaling increasingly difficult.
Tuesday 13 October 2026
Podcast highlights: Is Elon Musk using TSMC talks as leverage against Intel and Samsung?
Elon Musk's recent confirmation that his "TeraFab" initiative is in talks with Taiwan Semiconductor Manufacturing Co. (TSMC) signals that a project originally framed as a challenge to the established foundry model is pivoting toward a more pragmatic industrial path, according to DIGITIMES analyst Luke Lin.