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Friday 21 August 2026
Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the other 26 manufacturers grew more than twice as fast.
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Friday 21 August 2026
Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES, the three largest upstream memory chip makers are headed for a more than threefold jump in combined DRAM and NAND revenue in 2026, with supply constraints likely to keep pricing firm until new capacity arrives in 2027.
Friday 21 August 2026
Research Insight: 2028 key year for optical interconnects in AI racks
Optical communications will likely enter AI server racks in 2028, DIGITIMES analyst Joyce Chen said on August 20 at a semiconductor industry forum in Taipei, as rising AI cluster scale drives demand for faster data transfer, lower latency, and higher-bandwidth interconnects.
Friday 21 August 2026
Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026 in Taipei, analyst Jerry Zheng said the technology is moving toward mainstream adoption as bandwidth demand outpaces computing gains.
Thursday 20 August 2026
Commentary: How iPad Air became a catalyst for IT OLED expansion
Apple kicked off the tablet OLED era in 2024, introducing Tandem OLED in the iPad Pro to overcome bottlenecks in display lifespan and brightness. The iPad mini followed, set to adopt OLED in the second half of 2026, though with annual shipments hovering at just 2 million units, its impact is largely symbolic. Market research firm UBI Research noted that tablet OLED growth has largely stalled through 2024 and 2025, with OLED costs remaining the primary hurdle: panels currently run roughly twice the price of LCD alternatives, and narrowing that gap is widely viewed as the primary prerequisite for expanding OLED adoption in IT applications.
Thursday 20 August 2026
Analysis: Unitree IPO exposes the economics behind China's humanoid robot boom
Unitree Robotics' August 19 debut on Shanghai's STAR Market did more than crown China's first mainland-listed humanoid robot maker. It marked a shift in the industry from competition between robot brands to a harder contest over supply-chain cost, AI capability, and mass production.
Thursday 20 August 2026
Analysis: Marvell's US$120bn Google deal is the AI chip industry's new playbook — equity for orders, not cash
Marvell Technology is set to deepen its role in Google's AI infrastructure through an expanded agreement to develop custom chips, in a deal that could generate roughly US$120 billion in revenue for the chipmaker through fiscal 2033 if Google meets purchasing targets tied to the warrant, according to Reuters. The scale of that figure is the story: it reframes Marvell not as a niche supplier, but as a structural bet by Google on custom silicon over merchant GPUs.
Wednesday 19 August 2026
Commentary: Tsinghua Unigroup distances itself from failed US$15 billion Dongguan chip-cloud project
Tsinghua Unigroup's former "chip-to-cloud" expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring. Several projects originating in the group's earlier era have since entered disposal proceedings, and one of the former group's largest planned investments has now reached a formal end.
Wednesday 19 August 2026
Charts: Taiwan's materials suppliers split: wafer giants stall, substrate and lead-frame names run
The two largest silicon wafer companies are the sector's slowest growers on a cumulative basis. Everything running fast sits downstream of them.
Wednesday 19 August 2026
Charts: Memory, not logic, is doing the work in Taiwan's July chip revenue
Scale and growth have decoupled. TSMC still supplies more than half the sector's monthly sales, but the growth table now belongs to DRAM, NOR flash and controller names.
Wednesday 19 August 2026
Charts: New capacity is starting to show up in Taiwan's packaging and test revenue
Ardentec credits a new fab entering volume production for the sharpest monthly jump in the sub-sector; ELASER's revenue nearly doubled year on year on customer demand.
Tuesday 18 August 2026
Analysis: China's AI chip ambitions collide with Ajinomoto's 95% grip on ABF film
China's semiconductor self-reliance campaign is moving beyond lithography machines and advanced processors into less visible materials that can be just as difficult to replace. Ajinomoto Build-up Film, or ABF, has become the latest pressure point.
Tuesday 18 August 2026
Commentary: AMD's Taalas acquisition echoing Jensen Huang's Groq strategy
On February 20, 2026, Canadian AI chip startup Taalas unveiled its HC1 inference chip. Taalas said the chip ran the Llama 3.1 8B model at a single-user inference speed of 16,960 tokens per second, roughly 48 times the inference speed of an Nvidia B200 in the company's testing.
Tuesday 18 August 2026
Column: Why model training needs distillation
Around 2019, a friend working at a large cloud services provider excitedly shared that his team had trained a CNN model for document text recognition with good results, but the computing cost was too high to deploy directly. They then used distillation to train a smaller model for service, and it turned out to be highly effective.
Tuesday 18 August 2026
Column: Strategic resilience in precious metal refining: insights from Qiankun Gold, Silver
Amid global supply chain restructuring and geopolitical rivalry, precious metals are no longer merely financial hedging tools but have become core assets supporting high-tech manufacturing and strategic material reserves.
Sunday 16 August 2026
Interview: Orbbec bridges physical AI data gaps with robot-free platform
As physical AI and robotics draw unprecedented market attention, a key bottleneck is clogging the deployment pipeline: quality, real-world physical data. To move applications from the lab to real-world deployment, companies are getting creative in overcoming this obstacle while balancing affordability, stability, and data volumes.