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NEWS TAGGED TRANSMISSION
Thursday 30 April 2026
China photonics chipmaker Lightelligence lists in HK, CPO commercialization in focus
As generative AI drives a sharp rise in computing demand, traditional electrical interconnect architectures are increasingly constrained by power consumption and density limits. On...
Thursday 30 April 2026
AI drives power interconnect surge as BizLink and JPC target high-end markets
The AI wave is driving the rapid expansion of data center infrastructure, fundamentally reshaping server rack power transmission designs amid rising power consumption. This shift is...
Wednesday 29 April 2026
Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key
Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...
Tuesday 28 April 2026
Radiant Opto-Electronics delays optical communications push by 2–3 years
Radiant Opto-Electronics will wait two to three years before accelerating investment in optical communications and co-packaged optics (CPO), as uncertainties around industry structure...
Monday 27 April 2026
Everlight ramping up in optical communications, supported by automotive and invisible light
As global companies race to capture opportunities in AI optical communications and co-packaged optics (CPO), Taiwanese LED and optoelectronics firms are actively transforming and entering...
Sunday 26 April 2026
BizLink expands optical interconnect push, sees uncertain CPO ramp timing

The artificial intelligence boom continues to drive demand for related hardware, particularly as server power delivery and high-speed...

Friday 24 April 2026
M31 and TSMC complete eUSB2V2 tapeout on N2P process
IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely...
Friday 24 April 2026
Texas Instruments says edge AI opportunities extend beyond robots
In an April 23 interview, Amichai Ron of Texas Instruments (TI) warned that edge AI will reshape devices worldwide, extending far beyond robotics and driving greater semiconductor...
Wednesday 22 April 2026
AI optical communication and automotive demand boost TXC, Taitien quartz component sales in 1Q26
Benefiting from strong AI high-frequency, high-speed transmission and communications infrastructure demand, TXC reported robust AI optical communication orders in the first quarter...
Saturday 18 April 2026
bEMC advances Micro LED optical transmission with key POC validation
The surge in AI data center demand is rapidly accelerating the need for high-speed data transmission, prompting LED manufacturers to target opportunities in optical communications...
Friday 17 April 2026
Taiwan and Japan solidify lead in transmission component market for humanoid robots
The rise of new hardware designs for humanoid robots has created fresh opportunities across the supply chain, with linear actuators — which act as the muscles of robots that...
Tuesday 14 April 2026
Huawei backs optical chip push through photonics supplier investment
AI data centre and high-speed computing demand are pushing optical communications and photonic chips into focus, as data transmission bottlenecks reinforce the strategic role of photonics...
Tuesday 14 April 2026
Cypress Technology's Professional AV Solutions Drive Digital Transformation in Courtrooms

Cypress Technology has been dedicated to the research, development, and manufacturing of professional audiovisual solutions for 36 years, with all R&D and production...

Monday 13 April 2026
Silicon photonics scaling hits wafer testing bottleneck
AI demand is pushing data transmission to its limits, making 2026 a critical year for silicon photonics (SiPh) and co-packaged optics (CPO) to move into large-scale deployment. The...
Friday 10 April 2026
MAtek sees record March revenue as AI and silicon photonics boost testing demand
MAtek's March revenue surge has implications for global chipmakers and AI infrastructure providers: rising demand for advanced material and failure analysis testing linked to AI chip...