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Bits + chips
TSMC InFO packaging brings more competitiveness to its 7nm process technology
Josephine Lien, Taipei; Jessie Shen, DIGITIMES
Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness to the foundry's 7nm FinFET process technology, according to...
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