TSMC InFO packaging brings more competitiveness to its 7nm process technology

Josephine Lien, Taipei; Jessie Shen, DIGITIMES Asia Thursday 20 July 2017 0

Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness to the foundry's 7nm FinFET process technology, according to...

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