中文網
Taipei
Fri, Jul 1, 2022
22:57
mostly cloudy
28°C
CONNECT WITH US

TSMC develops SiP technology

Julian Ho, Taipei; Jessie Shen, DIGITIMES 0

Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories