TSMC and Samsung Electronics have both encountered different but critical bottlenecks in the development of their respective 3nm process technologies, according to industry sources...

TSMC plans to launch an enhanced version of 3nm process technology in 2023, with Apple being the initial customer adopting the process, according to industry sources.

IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post a revenue decline of 10-12% sequentially in the fourth quarter of 2020, with gross margin...

China-based Innosilicon, a provider of high-speed mixed signal IPs and customized chip design services, has recently announced it has completed a chip tape-out and testing based on...

With Semiconductor Manufacturing International (SMIC) at risk of being blacklisted by the US government, concerns are growing about whether China-based memory chipmakers ChangXin...

TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...

Taiwan-based fabless chipmakers, with many of them contracting SMIC to manufacture their chips supplied to the Chinese market, are mulling shifting orders away from the China-based...

The potential blacklisting of SMIC, China's largest pure-play foundry, by the US government may shake up the second-tier pure-play foundry market segment.

At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars...

KLA has announced the eSL10 e-beam patterned-wafer defect inspection system, which is designed to accelerate time-to-market for high-performance logic and memory chips, including...

China's state-backed SMIC has stepped up the development of its FinFET process technology, disclosing plans to roll out its FinFET N+1 and N+2 processes without implementing EUV li...

Samsung Electronics has revised its foundry process roadmap, skipping 4nm and jumping directly to 3nm from 5nm, according to industry sources.

MediaTek has launched its newest chips in the smartphone gaming-focused G series - the MediaTek Helio G25 and G35. The latest chips feature MediaTek HyperEngine game technology for...

Globalfoundries has announced its most advanced FinFET solution, 12LP+, which is ready for production. The differentiated 12LP+ solution is optimized for artificial intelligence (AI)...

TSMC's 5nm technology will be offered in more process variants, including a further enhanced 5nm node in addition to 5nm Plus, according to sources at IC inspection services companies...

TSMC is expected to kick off volume production of chips manufactured on an enhanced version of its 5nm FinFET process, dubbed tentatively 5nm Plus, in the fourth quarter of 2020,...

TSMC has an over 50% of the global pure-play foundry market, and the establishment of its new US fab could pose a further threat to Samsung's foundry operations and Globalfoundries,...

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has revised upward its capex outlook this year to US$4.3 billion, up US$1.1 billion or about 34% from...

Semiconductor Manufacturing International (SMIC), China's top IC foundry, has disclosed plans to trade its shares on the science and technology innovation board (STAR) of China's...

Samsung Electronics is gearing up for mass production of 5nm chips later this year to further enhance its FinFET process offerings that leverage extreme ultraviolet (EUV) technolog...

TSMC has disclosed that its 3nm technology development remains on track, with risk production scheduled for 2021 followed by volume production in the second half of 2022.

China's Semiconductor Manufacturing International (SMIC) with its 14nm FinFET process manufacturing has obtained orders from HiSilicon, according to industry sources.

Semiconductor Manufacturing International (SMIC) has moved 14nm FinFET process to volume production with orders from Huawei's chip arm HiSilicon, and is gearing up for its next-generation...

Globalfoundries announced recently that its embedded magnetoresistive non-volatile memory (eMRAM) on the company's 22nm FD-SOI (22FDX) platform has entered production. The foundry...