205 news items tagged FinFET
TSMC to volume produce 4nm chips ahead of schedule
Tuesday 30 March 2021TSMC will move N4 (namely 4nm process) to volume production in the fourth quarter of 2021, ahead of the 2022 timeframe set previously, according to sources at fab toolmakers.
SMIC striving to regain chip orders
Friday 12 March 2021With the US trade restrictions on Semiconductor Manufacturing International (SMIC) reportedly easing, the China-based pure-play foundry is striving to regain orders particularly those...
Development of 3nm process challenging TSMC, Samsung
Thursday 31 December 2020TSMC and Samsung Electronics have both encountered different but critical bottlenecks in the development of their respective 3nm process technologies, according to industry sources...
TSMC to roll out 3nm Plus process in 2023
Wednesday 2 December 2020TSMC plans to launch an enhanced version of 3nm process technology in 2023, with Apple being the initial customer adopting the process, according to industry sources.
Wafer capacity by feature size shows strongest growth at sub-10nm
Wednesday 18 November 2020IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...
SMIC expects 10-12% revenue drop in 4Q20
Thursday 12 November 2020China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post a revenue decline of 10-12% sequentially in the fourth quarter of 2020, with gross margin...
Innosilicon completes chip tape-out based on SMIC FinFET N+1
Tuesday 13 October 2020China-based Innosilicon, a provider of high-speed mixed signal IPs and customized chip design services, has recently announced it has completed a chip tape-out and testing based on...
China memory chipmakers could be next US trade ban target
Wednesday 30 September 2020With Semiconductor Manufacturing International (SMIC) at risk of being blacklisted by the US government, concerns are growing about whether China-based memory chipmakers ChangXin...
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform
Thursday 24 September 2020TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...
IC design houses brace for impact of possible US ban on SMIC
Thursday 10 September 2020Taiwan-based fabless chipmakers, with many of them contracting SMIC to manufacture their chips supplied to the Chinese market, are mulling shifting orders away from the China-based...
Possible SMIC blacklisting may reshape pure-play foundry landscape
Tuesday 8 September 2020The potential blacklisting of SMIC, China's largest pure-play foundry, by the US government may shake up the second-tier pure-play foundry market segment.
Six pillars bolstering Moore's Law: Q&A with Intel chief architect Raja Koduri
Monday 24 August 2020At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars...
KLA intros electron-beam defect inspection system
Wednesday 22 July 2020KLA has announced the eSL10 e-beam patterned-wafer defect inspection system, which is designed to accelerate time-to-market for high-performance logic and memory chips, including...
SMIC faces hurdles catching up with TSMC
Monday 20 July 2020China's state-backed SMIC has stepped up the development of its FinFET process technology, disclosing plans to roll out its FinFET N+1 and N+2 processes without implementing EUV li...
Samsung reportedly to skip 4nm foundry process
Thursday 2 July 2020Samsung Electronics has revised its foundry process roadmap, skipping 4nm and jumping directly to 3nm from 5nm, according to industry sources.
MediaTek intros gaming-optimized solutions for mainstream smartphones
Wednesday 1 July 2020MediaTek has launched its newest chips in the smartphone gaming-focused G series - the MediaTek Helio G25 and G35. The latest chips feature MediaTek HyperEngine game technology for...
GF rolls out 12LP+ FinFET process
Wednesday 1 July 2020Globalfoundries has announced its most advanced FinFET solution, 12LP+, which is ready for production. The differentiated 12LP+ solution is optimized for artificial intelligence (AI)...
TSMC 5nm technology said to be in more process variants
Tuesday 9 June 2020TSMC's 5nm technology will be offered in more process variants, including a further enhanced 5nm node in addition to 5nm Plus, according to sources at IC inspection services companies...
TSMC to move 5nm Plus process to volume production in 4Q20
Thursday 28 May 2020TSMC is expected to kick off volume production of chips manufactured on an enhanced version of its 5nm FinFET process, dubbed tentatively 5nm Plus, in the fourth quarter of 2020,...
Samsung, Globalfoundries to see growing threat from TSMC
Monday 18 May 2020TSMC has an over 50% of the global pure-play foundry market, and the establishment of its new US fab could pose a further threat to Samsung's foundry operations and Globalfoundries,...
SMIC raises 2020 capex
Thursday 14 May 2020China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has revised upward its capex outlook this year to US$4.3 billion, up US$1.1 billion or about 34% from...
SMIC plans listing on Shanghai STAR board
Thursday 7 May 2020Semiconductor Manufacturing International (SMIC), China's top IC foundry, has disclosed plans to trade its shares on the science and technology innovation board (STAR) of China's...
Samsung to spend big on EUV fab tools in 2020
Thursday 30 April 2020Samsung Electronics is gearing up for mass production of 5nm chips later this year to further enhance its FinFET process offerings that leverage extreme ultraviolet (EUV) technolog...
TSMC 3nm process development remains on track
Friday 17 April 2020TSMC has disclosed that its 3nm technology development remains on track, with risk production scheduled for 2021 followed by volume production in the second half of 2022.
HiSilicon places 14nm chip orders with SMIC
Tuesday 14 April 2020China's Semiconductor Manufacturing International (SMIC) with its 14nm FinFET process manufacturing has obtained orders from HiSilicon, according to industry sources.