High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which...
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
Apple will no longer be the exclusive customer of TSMC adopting the foundry's advanced integrated fan-out (InFO) wafer-level packaging, which is expected to attract orders for Android...
Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
China-based OSAT Tongfu Microelectronics plans to raise up to CNY5.5 billion (US$854 million) to fund its upcoming capacity expansions for a variety of segments, according to industry...
China's top-3 backend houses JCET, Tongfu Microelectronics, and Tianshui Huatain Technology are all set to gain big from robust packaging demand in the second half of the year, having...
Logic and memory IC backend house Powertech Technology (PTI) has revised upward its capex target this year to NT$17 billion (US$606.05 million) from the NT$15 billion estimated pre...
IC backend service provider Winstek Semiconductor is expected to post an about 10% revenue increase in 2021, driven by demand for AI chips for handset and blockchain applications,...
China's SMIC is struggling to obtain crucial EUV lithography equipment for the development of its sub-7nm process technologies, and will be seeking a dialogue with ASML with the help...
ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...
Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...
The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...
