IC backend service provider Winstek Semiconductor is expected to post an about 10% revenue increase in 2021, driven by demand for AI chips for handset and blockchain applications,...

China's SMIC is struggling to obtain crucial EUV lithography equipment for the development of its sub-7nm process technologies, and will be seeking a dialogue with ASML with the help...

ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...

Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...

The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...

Taiwan-based Eternal Materials continues to utilize as high as 90% of its dry-film photoresist production capacity, thanks to brisk PCB demand for base stations, servers, notebooks...

China-based ACM Research, a supplier of advanced wafer-level packaging equipment and other fab tools, has been expanding its product portfolio to satisfy the growing needs of China's...

ASE Technology has entered the supply chain of ZTE, providing advanced backend technology to volume process 5G base station chips developed in house by the Chinese vendor, according...

SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...

Wuhan Hongxin Semiconductor Manufacturing (HSMC), a logic IC foundry founded in late 2017, is gearing up for 14nm and 7nm process manufacturing eyeing to be China's most advanced...

In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along...

As super-slim in-display optical fingerprint sensor chips will see increasing penetration in 5G smartphones, Taiwan's IC backend service firms including ASE Technology Holding, ChipMos...

Taiwan-based fingerprint ID chip designer Egis Technology (EgisTec) expects to enjoy higher revenue growth for the fourth quarter of 2019 than the third quarter thanks to growing...

The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...

Pure-play foundry TSMC remains aggressive in expanding its advanced packaging business, which will generate nearly US$3 billion in revenues this year, according to company chairman...

Chances are not high for leadframe suppliers to score double-digit revenue increases in 2019, and China leadframe supply chain can hardly emerge to threaten Taiwan peers, according...

China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...

Taiwan Semiconductor Manufacturing Company (TSMC) is set to win all orders for A13 chips that Apple will reelase in 2019, extending its dominance in the pure-play foundry sector,...

Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing...

Amkor Technology will soon start operating a new factory at its manufacturing site in Longtan, northern Taiwan for wafer-level packaging (WLP) and wafer test services. The arrival...

IC packaging and testing specialist Sigurd Microelectronics has seen its revenues for June and the second quarter of 2018 hit record highs on robust market demand for smartphone RF...

Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.

Image sensor packaging specialist Xintec has decided to suspend its 12-inch wafer-level packaging production line for one year due to disappointing CMOS image sensor (CIS) demand...

The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...