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NEWS TAGGED WAFER-LEVEL PACKAGING
Monday 11 September 2023
With heterogeneous integration technology constantly evolving, EVG sheds lights on hybrid bonding and NIL trends
Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...
Friday 4 August 2023
South Korea initiates major R&D project to boost chips packaging competitiveness
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
Wednesday 10 May 2023
Samsung reportedly to move FOWLP to volume production in 4Q23
Samsung Electronics is stepping up its deployment in the advanced packaging field, and reportedly will move its fan-out wafer-level packaging (FOWLP) technology to volume production...
Friday 7 April 2023
Samsung steps up fan-out wafer-level packaging deployment
Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry so...
Thursday 6 April 2023
JCET reports record revenue, profit for 2022
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91...
Tuesday 28 March 2023
ACM Research talks about new orders, growth opportunities
ACM Research, a leading developer of wafer processing technologies for semiconductor and advanced wafer-level packaging applications, has secured its first purchase order from a major...
Thursday 2 February 2023
OSATs see promising demand for custom-built chips
Demand for custom-built chips from system vendors remains promising for OSATs that offer high-end backend services, such as ASE Technology (ASEH), Amkor Technology and Powertech Technology...
Thursday 22 December 2022
ASE talks about SiP development trends
OSAT ASE Group recently shared its vision regarding development trends for system-in-package (SiP) technology.
Thursday 10 November 2022
AMD to utilize TSMC CoWoS for next-gen datacenter accelerator
AMD will utilize TSMC's CoWoS packaging for the next generation of its datacenter accelerators, according to industry sources.
Wednesday 5 October 2022
Sigurd sees stable demand for wireless and HPC chips
IC testing house Sigurd Microelectronics has enjoyed stable demand for wireless and HPC chips, enabling it to post about flat sequential revenue growth in September.
Monday 27 June 2022
Chipmakers focus on heat dissipation in manufacturing process upgrades
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Friday 17 June 2022
Substrate-free FOPLP technology gaining ground in advanced packaging market
Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which...
Wednesday 8 June 2022
ASE, Unimicron to provide packaging, related substrates for new Apple M2 chip
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Wednesday 1 June 2022
Arm-based HPC chips gain ground for PCs, benefiting OSATs
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
Thursday 21 April 2022
TSMC fan-out packaging to attract orders for Android smartphone SoCs
Apple will no longer be the exclusive customer of TSMC adopting the foundry's advanced integrated fan-out (InFO) wafer-level packaging, which is expected to attract orders for Android...
Mar 1, 10:49
Crypto Quantique expands IoT security solutions to support cellular connectivity
Friday 1 March 2024
International Business Conference: 2024 OLED Korea & 2024 eXtended Reality Korea to hold in parallel!
Thursday 29 February 2024
Eternal Materials expands presence with 'New Southbound' layout; new factory to start operations in 2025, deepening local services
Monday 26 February 2024
Pegatron 5G announces full suite of interoperable 5G ORAN-based products for private network solutions
SMIC unhindered by US sanctions as Chinese foundry strives toward 5nm
Intel confirms 3nm chip orders placed with TSMC
US reportedly suspends permission for materials shipping to SMIC
Intel is grabbing Samsung's cheese with system-level foundry
US will not choke China's access to mature process chips
Huawei's NearLink wireless technology signals a decoupled connected world
Intel cuts off manufacturing in IDM2.0, TSMC is expected to benefit
Tesla's humanoid robot 'Optimus' debuts in Taiwan, showcasing AI advancements
ASML reportedly sees first big EUV equipment order cut from TSMC
US, Japanese, and Dutch semiconductor equipment export values to China dropped; more substantial strategies demanded by expert
China's homegrown NearLink wireless tech to challenge Wi-Fi dominance, says DIGITIMES Research
China's smartphone shipments threaten 20% slide in 1Q24 says DIGITIMES Research
AP shipments to Chinese smartphone brands unpleasant in 4Q23, but to stay flat in 1Q24, says DIGITIMES Research
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