72 news items tagged wafer-level packaging
Backend house Winstek to enjoy 10% sales growth in 2021
Tuesday 5 January 2021IC backend service provider Winstek Semiconductor is expected to post an about 10% revenue increase in 2021, driven by demand for AI chips for handset and blockchain applications,...
SMIC struggling to obtain EUV litho equipment
Thursday 17 December 2020China's SMIC is struggling to obtain crucial EUV lithography equipment for the development of its sub-7nm process technologies, and will be seeking a dialogue with ASML with the help...
ASE quietly enhancing CIS backend capability
Monday 16 November 2020ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...
Top foundries to maintain tight partnerships with OSATs, says Amkor executive
Monday 9 November 2020Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...
Semiconductor packaging materials to see 3.4% CAGR during 2019-2024
Wednesday 29 July 2020The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...
Eternal Materials utilizes 90% of dry-film photoresist production capacity
Thursday 2 July 2020Taiwan-based Eternal Materials continues to utilize as high as 90% of its dry-film photoresist production capacity, thanks to brisk PCB demand for base stations, servers, notebooks...
China fab toolmaker ACM enhances offering for local demand
Friday 15 May 2020China-based ACM Research, a supplier of advanced wafer-level packaging equipment and other fab tools, has been expanding its product portfolio to satisfy the growing needs of China's...
ASE enters ZTE supply chain for 5G base station chips
Tuesday 7 April 2020ASE Technology has entered the supply chain of ZTE, providing advanced backend technology to volume process 5G base station chips developed in house by the Chinese vendor, according...
SJSemi strengthens presence in wafer-level 3D packaging segment
Friday 3 January 2020SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...
Chinese foundry HSMC gearing up for 14nm, 7nm chip production
Friday 22 November 2019Wuhan Hongxin Semiconductor Manufacturing (HSMC), a logic IC foundry founded in late 2017, is gearing up for 14nm and 7nm process manufacturing eyeing to be China's most advanced...
TSMC may join forces with OSAT firms to build SoIC ecosystem
Monday 23 September 2019In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along...
Backend firms eyeing COF orders for ultraslim optical fingerprint ID chips
Friday 30 August 2019As super-slim in-display optical fingerprint sensor chips will see increasing penetration in 5G smartphones, Taiwan's IC backend service firms including ASE Technology Holding, ChipMos...
EgisTec eyes rosy 4Q19 on growing adoption of in-display fingerprint sensors
Thursday 15 August 2019Taiwan-based fingerprint ID chip designer Egis Technology (EgisTec) expects to enjoy higher revenue growth for the fourth quarter of 2019 than the third quarter thanks to growing...
Wafer-level backend demand promising
Wednesday 14 August 2019The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...
PTI remains focused on FOPLP for advanced logic ICs
Wednesday 24 April 2019Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...
Advanced packaging to generate nearly US$3 billion in revenues in 2019, says TSMC chairman
Tuesday 26 March 2019Pure-play foundry TSMC remains aggressive in expanding its advanced packaging business, which will generate nearly US$3 billion in revenues this year, according to company chairman...
China leadframe supply chain not gaining ground, says Chang Wah chairman
Monday 10 December 2018Chances are not high for leadframe suppliers to score double-digit revenue increases in 2019, and China leadframe supply chain can hardly emerge to threaten Taiwan peers, according...
China not necessarily top job destination for Taiwan IC packaging talent
Friday 2 November 2018China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...
TSMC to be only supplier of Apple A13 chips in 2019
Friday 12 October 2018Taiwan Semiconductor Manufacturing Company (TSMC) is set to win all orders for A13 chips that Apple will reelase in 2019, extending its dominance in the pure-play foundry sector,...
TSMC to set up new fab for advanced packaging
Tuesday 25 September 2018Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing...
Backend firm Amkor to expand capacity in Taiwan
Friday 7 September 2018Amkor Technology will soon start operating a new factory at its manufacturing site in Longtan, northern Taiwan for wafer-level packaging (WLP) and wafer test services. The arrival...
Sigurd revenues for 2Q18 hit record on robust IC packaging demand
Wednesday 4 July 2018IC packaging and testing specialist Sigurd Microelectronics has seen its revenues for June and the second quarter of 2018 hit record highs on robust market demand for smartphone RF...
TSMC develops SiP technology
Friday 22 June 2018Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.
Xintec halts 12-inch wafer-level packaging production
Wednesday 20 June 2018Image sensor packaging specialist Xintec has decided to suspend its 12-inch wafer-level packaging production line for one year due to disappointing CMOS image sensor (CIS) demand...
Global semiconductor packaging materials market reaches US$16.7 billion in 2017
Friday 20 April 2018The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...