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NEWS TAGGED WAFER-LEVEL PACKAGING
Monday 27 June 2022
Chipmakers focus on heat dissipation in manufacturing process upgrades
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Friday 17 June 2022
Substrate-free FOPLP technology gaining ground in advanced packaging market
Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which...
Wednesday 8 June 2022
ASE, Unimicron to provide packaging, related substrates for new Apple M2 chip
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Wednesday 1 June 2022
Arm-based HPC chips gain ground for PCs, benefiting OSATs
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
Thursday 21 April 2022
TSMC fan-out packaging to attract orders for Android smartphone SoCs
Apple will no longer be the exclusive customer of TSMC adopting the foundry's advanced integrated fan-out (InFO) wafer-level packaging, which is expected to attract orders for Android...
Thursday 10 March 2022
TSMC, Unimicron to offer production solutions for Apple M1 Ultra
Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...
Thursday 25 November 2021
TSMC outsources part of CoWoS packaging production to OSATs
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Thursday 7 October 2021
Tongfu to raise CNY5.5 billion for capacity expansions
China-based OSAT Tongfu Microelectronics plans to raise up to CNY5.5 billion (US$854 million) to fund its upcoming capacity expansions for a variety of segments, according to industry...
Wednesday 18 August 2021
China top-3 OSATs hike quotes by 20-30% for rush orders
China's top-3 backend houses JCET, Tongfu Microelectronics, and Tianshui Huatain Technology are all set to gain big from robust packaging demand in the second half of the year, having...
Wednesday 28 July 2021
PTI raises capex outlook for 2021
Logic and memory IC backend house Powertech Technology (PTI) has revised upward its capex target this year to NT$17 billion (US$606.05 million) from the NT$15 billion estimated pre...
Tuesday 5 January 2021
Backend house Winstek to enjoy 10% sales growth in 2021
IC backend service provider Winstek Semiconductor is expected to post an about 10% revenue increase in 2021, driven by demand for AI chips for handset and blockchain applications,...
Thursday 17 December 2020
SMIC struggling to obtain EUV litho equipment
China's SMIC is struggling to obtain crucial EUV lithography equipment for the development of its sub-7nm process technologies, and will be seeking a dialogue with ASML with the help...
Monday 16 November 2020
ASE quietly enhancing CIS backend capability
ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...
Monday 9 November 2020
Top foundries to maintain tight partnerships with OSATs, says Amkor executive
Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...
Wednesday 29 July 2020
Semiconductor packaging materials to see 3.4% CAGR during 2019-2024
The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...