Sat, May 28, 2022
Before going to press
7 days news
Chips + Components
Displays + Photonics
IT + CE
Mobile + Telecom
Battery + Green energy
Asia Supply Chain 100
Internet, Cloud, AI
Accelerators & incubators
Research on demand
Products & services
China smartphone AP
Special Report Databases
Commentary and analysis
Biz Focus home
CONNECT WITH US
FUSION IS TRANSPORTATION
NEWS TAGGED 10NM
Friday 27 May 2022
Nanya gearing up for 10nm process output ramp-up
DRAM chipmaker Nanya Technology will be ramping up its first-generation 10nm process output in the second half of 2022, according to company chairman Chia-Chau Wu.
Thursday 24 March 2022
Samsung, Intel keen to take slices of foundry market from TSMC
Samsung Electronics and Intel have both stepped up efforts to expand their respective foundry businesses, eyeing bigger slices of the global foundry market particularly in the advanced...
Thursday 30 December 2021
Nanya to break ground for new DRAM plant in 1H22
Nanya Technology plans to break ground for a new DRAM plant in the first half of 2022 in an effort to meet growing market demand, and expects to invest a total of NT$300 billion (US$10.86...
Thursday 2 December 2021
Will Samsung 3nm GAA process win over major TSMC clients?
Samsung Electronics has been actively pursuing 3nm GAA chip orders, with speculation that AMD and Qualcomm could be among the first customers of its newer foundry process technology...
Thursday 23 September 2021
Intel to hold groundbreaking ceremony for new fabs on September 24
Intel is scheduled to hold a groundbreaking ceremony for the construction of two new fabs in Arizona on September 24. Company CEO Pat Gelsinger and local government officials will...
Monday 13 September 2021
Intel offering competitive prices to maintain server market leadership
Intel, facing AMD's fierce competition in the server market, is offering more competitive pricing for its server CPUs, with many cloud computing datacenter operators who have begun...
Friday 30 July 2021
Intel could challenge TSMC in next 5 years
If Intel is able to advance its process technology on schedule, it could regain its foundry technology leadership that has been taken by TSMC in the next five years, according to...
Wednesday 14 July 2021
Intel seeks to regain advanced manufacturing lead
Intel is eyeing to regain its manufacturing lead, particularly advanced process manufacturing. Intel's capex for 2021 will be a nearly 10-year high for the company, despite being...
Monday 12 July 2021
Nanya expects DRAM prices to continue rally
DRAM contract prices, which registered a substantial increase in the second quarter of 2021, are expected to continue their rally in the third quarter, according to chipmaker Nanya...
Tuesday 6 July 2021
Nanya sees 2Q21 revenue hit 11-quarter high
DRAM chipmaker Nanya Technology has reported revenue of NT$22.64 billion (US$808.9 million) for the second quarter of 2021, the highest in 11 quarters.
Friday 18 June 2021
Nanya to see over 25% revenue gains in 2Q21 on rising DRAM ASPs
Nanya Technology is expected to post revenue growth of 25% or more sequentially in the second quarter of 2021, buoyed by sharp DRAM price rises, particularly for DDR3 solutions, according...
Tuesday 27 April 2021
PCB supply chain eyeing replacement demand stoked by new server CPUs
Taiwan's PCB supply chain players are optimistic that they will receive a boost from the upcoming server replacement demand to be driven by rollouts of new processors by Intel, according...
Tuesday 27 April 2021
Intel to defend market share with new 10nm server chips
Intel with its new-generation 10nm server chips will be striving to defend its market dominance.
Wednesday 21 April 2021
Nanya to defend market share with new chip plant, says president
Nanya Technology holds an around 3% share of the DRAM market, and is striving to defend its global market share with an additional 12-inch wafer fab set to come online in 2024, according...
Tuesday 20 April 2021
DRAM maker Nanya to build new 12-inch fab
Taiwan-based DRAM maker Nanya Technology has announced plans to establish a new 12-inch wafer fab designed for the company's in-house developed 10nm-class and EUV-based process man...
Friday 9 August 2019
Intel 10th Gen Core processor
Intel has launched 11 highly integrated 10th Gen Intel Core processors, manufactured via Intel's 10nm process and designed for 2-in-1s and notebooks. The processors bring high-performance artificial intelligence (AI) to the PC at scale, feature new Intel Iris Plus graphics and Intel Wi-Fi 6 (Gig+) and Thunderbolt 3. Systems are expected from PC manufacturers for the holiday season. In addition to performance and responsiveness gains, AI, graphics, connectivity and I/O are optimized on the SoC for a solution that delivers a feature-rich suite of capabilities for OEMs to create notebooks.
Friday 1 June 2018
Samsung 10nm 32GB DDR4 SoDIMM
Samsung Electronics has started mass producing 32GB DDR4 memory for gaming laptops in the widely used format of small outline dual in-line memory modules (SoDIMMs). The new SoDIMMs are based on 10nm-class process technology that will allow users to enjoy enriched PC-grade computer games on the go. Using the new memory solution, PC manufacturers can build faster top-of-the-line gaming-oriented laptops with longer battery life at capacities exceeding conventional mobile workstations, while maintaining existing PC configurations, according to Samsung. Compared to Samsung's 16GB SoDIMM based on 20nm-class 8Gb DDR4, which was introduced in 2014, the new 32GB module doubles the capacity while being 11% faster and approximately 39% more energy efficient, said the vendor. With a total of 16 of Samsung's newest 16Gb DDR4 DRAM chips (eight chips each mounted on the front and back), the 32GB SoDIMM allows gaming laptops to reach speeds up to 2,666Mbps. A 64GB laptop configured with two 32GB DDR4 modules consumes less than 4.6W in active mode and less than 1.4W when idle, said Samsung. This reduces power usage by approximately 39% and over 25%, respectively, compared to today's leading gaming-oriented laptops, which are equipped with 16GB modules.
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.
May 27, 10:24
Empower manufacturing with AI: Into new era of smart manufacturing with collective wisdom
Tuesday 24 May 2022
MSI unveils new lineup at Computex 2022 Online
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Thursday 19 May 2022
Computex Focus: DataVan to showcase new retail solutions for new normal
Renesas to reopen Kofu factory as 300mm wafer fab dedicated for power semiconductors
IC design houses bracing for cutback in orders from China handset brands
TSMC to move CoWoS-L technology to commercial production in 2 years
Intel makes key investments to advance datacenter sustainability
Concerns rising over potential foundry overcapacity in 2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
Sorry, the page you are trying to open is available only for our paid subscribers.
to read more
New users, please